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11.
Determination of three dimensional in situ stress from core discing based on analysis of principal tensile stress 总被引:2,自引:0,他引:2
K. Matsuki N. Kaga T. Yokoyama N. Tsuda 《International Journal of Rock Mechanics and Mining Sciences》2004,41(7):1167-1190
To determine all of the components of in situ stress from core discing, both the directions and magnitudes of the principal in situ stresses must be determined for a disc of a given thickness. In this study, we analyzed the direction and magnitude of tensile stress below an HQ core stub for 11 core lengths using stress conditions under which core discing is likely to occur. First, based on an analysis of the direction of tensile stress below the core stub, we propose a method for determining directions of in situ stress from the height distribution at the periphery of the end surface of a disc. This method can be used with a disc of any thickness. Next, based on an analysis of the magnitude of tensile stress in the central part of a core, we propose a linear criterion for core discing, which can be applied to a core of any length. This criterion was in good agreement with an empirical formula obtained previously in laboratory experiments. By combining information on the direction of in situ stress and the linear criterion for core discing, we propose a method for determining all of the components of in situ stress from core discing under the assumption that vertical stress is given by the overburden stress. Finally, these methods were applied to discs obtained from a field where hydraulic fracturing was performed to measure horizontal stresses. The results showed that the azimuths of the principal stresses estimated from core discing were consistent with those of the principal horizontal stresses determined by hydraulic fracturing and that while the magnitudes of the principal horizontal stresses estimated from core discing showed a large scatter, they were similar to those determined by hydraulic fracturing. 相似文献
12.
As a room temperature bonding method, surface activated bonding (SAB) method has been introduced to be one of the most appropriate interconnection methods for the next generation of electronic packaging. Thus it is important to study the reliability of SAB interconnection in long term life test.In this paper, interconnections of Au bump and Cu film bonded by SAB method were performed in high temperature thermal aging test. Degradation of properties such as electrical resistance, shear strength of bump and interface microstructure during aging process were studied to investigate the failure mechanism of the interconnection. Intermetallic compound Cu3Au was found formed at the interface during thermal aging, and it causes evolvement of the properties and failure mode of the interconnection changing in shear test. Results reveal that SAB is suitable for the interconnection between Au bump and Cu film and it is reliable in thermal reliability test. 相似文献
13.
In the first half of the paper, various types of processing pertaining to a polygon, using the 4×4 determinant theories are explained along with a new containment test algorithm of a point in a polygon. In the latter half of the paper, a general-purpose geometric processor, the POLYGON ENGINE, is presented which can deal with various types of interference problems, such as Boolean operations in solid modelling, hidden line and surface eliminations, ray tracing and so on. It is, a successor of the TRIANGLE PROCESSOR and is also based upon the 4×4 determinant theories [4–6]. While the TRIANGLE PROCESSOR processes a triangulated polygon on a triangle-by-triangle basis, the POLYGON ENGINE can treat a polygon without triangulation. The latter is expected to be more functional, more efficient and easier to use. 相似文献
14.
In recent years the requirement for the reduction of energy consumption has been increasing to solve the problems of global warming and the shortage of petroleum resources. For example, in the power generation field, as thermal power generation occupied 60% of the power generation demand, considerable improvement of the thermal efficiency is required. This paper describes the pressure drop characteristics of finned tube banks used for heat exchangers in thermal power generation that were clarified by testing serrated finned tube banks with different fin heights for improved heat transfer and conventional spiral finned tube banks with different fin heights, and an equation to predict pressure drop which is necessary for the heat exchanger design is proposed. © 2006 Wiley Periodicals, Inc. Heat Trans Asian Res, 35(3): 179–193, 2006; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/htj.20112 相似文献
15.
Toshihiro Kasuga Masahiro Yoshida Tomoko Uno Kiichi Nakajima 《Journal of Materials Science》1988,23(6):2255-2258
Bioactive glass-ceramics toughened by tetragonal zirconia polycrystal (TZP) were prepared by hot-pressing mixed powders of the MgO-CaO-P2O5-SiO2 glass and TZP containing 20 to 80% alumina. The bending strength and the fracture toughness of the composite materials were improved compared with those of the material without TZP. These composites showed high bending strengths (400 to 500MPa) and high fracture toughness ( 2.8MPa m1/2). The existence of a crack deflection mechanism was observed by scanning electron microscopy. After soaking in simulated physiological solution at 100 °C, no phase transformation from tetragonal to monoclinic of TZP in the composites and no degradation in bending strength occurred. 相似文献
16.
Humidity Sensor Characteristics of Woodceramics 总被引:9,自引:0,他引:9
Kiyokazu Kasai Kiyotaka Shibata Koji Saito Toshihiro Okabe 《Journal of Porous Materials》1997,4(4):277-280
The humidity sensor characteristics of Woodceramics were investigated. The Woodceramics used in this experiment were prepared at 650–900°C. The size of specimens selected was 1 × 1 × 10 mm . One was used as-cut and the other was polished. Above 700°C, the resistance of the specimen was below 50 and the decrease of resistance with increasing relative humidity was small. The specimen prepared at 650°C had a resistance of about 1 k. The resistance of as-cut specimens decreased with increase in relative humidity, but that of the polished specimen did not change significantly. The difference between as-cut and polished samples was explained by the differences in surface micro-structure. 相似文献
17.
Laser-Sintered Barium Titanate 总被引:1,自引:0,他引:1
Toshihiro Kasai Yoshiharu Ozaki Hideki Noda Kenji Kawasaki Kei Tanemoto 《Journal of the American Ceramic Society》1989,72(9):1716-1718
Laser sintering of alkoxy-derived ultrafine BaTiO3 powders was investigated. The temperature increases of the sample with laser irradiation were measured with a thermocouple. It was found that laser irradiation could generate enough heat to sinter ceramics. A slurry was prepared by mixing an alkoxy-derived BaTiO3 powder, binder additives, solvent, and plasticizer. The slurry was tape cast and dried to give a green sheet. The green sheet was laser sintered and was then characterized by SEM, XRD, and density measurements. The effect of burnout before laser irradiation and the characteristic microstructure of laser-sintered BaTiO3 are described. 相似文献
18.
An investigation was undertaken on the application of dilute chitosan solutions gelled by tyrosinase‐catalyzed reaction with 3,4‐dihydroxyphenethylamine (dopamine). The tyrosinase‐catalyzed reaction with dopamine conferred water‐resistant adhesive properties to the semidilute chitosan solutions. The viscosity of the chitosan solutions increased highly by the tyrosinase‐catalyzed reaction and the subsequent reactions between o‐quinone compounds and chitosan. These highly viscous, gel‐like modified chitosan materials were allowed to spread onto the surfaces of the glass slides, which were tightly lapped together and held them in water. Tensile shear adhesive strength of over 400 kPa was observed for the modified chitosan samples. The increase in the amino group concentration of the chitosan solutions and the molecular mass of the chitosan used effectively led to the increase in adhesive strength of the glass slides. In addition, in the case where the chitosan solution was gelled by the enzymatic reaction with dopamine in the presence of poly(ethylene glycol), adhesive strength sharply increased at shorter reaction times concomitantly with the increase in the viscosity of the chitosan solutions because the tyrosinase activity effectively was retained by poly(ethylene glycol). © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 1818–1827, 2007 相似文献
19.
We have developed a reel-to-reel microchip mounting system that continuously mounts LED chips and other microchips on meter-long flexible printed circuit board (PCB) tape for 1.2-m-long standard LED light tubes. Mounting microchips on meter-long PCBs is difficult because a large chip mounter is expensive and the chip positioning stage is difficult to move in a meter-wide area with an accuracy of hundreds of micrometers. Hence, we developed a new microchip mounting system that utilizes a small chip mounter and reel winding machines. The system repeatedly moves the long PCB tape by a certain length with the reel winding machines and mounts the chips on it. The PCB tape (which is 5 mm wide) is made by fabricating long PCB tapes which are 25 cm × 26.6 m through a roll-to-roll PCB process and slitting them into meter-long tapes. The reel-to-reel system repeatedly mounts chips by adjusting their positions through image processing of the copper wiring pattern on the PCBs. Our constructed system mounted 24 LED chips with a pitch of 5 cm with an accuracy of 0.082 mm to form a 1.2-m-long LED tape. The luminance of the tape is 12.4 lx at a distance of 1 m, which is the luminance of outdoor corridor lighting. Therefore, this system can be used for meter-long tape lighting. 相似文献
20.
Atsuhiko Yamanaka Tooru Kitagawa Masayuki Tsutsumi Toshihiro Kashima Hiroyuki Fujishiro Kimiko Ema Yoshinobu Izumi Shigehiro Nishijima 《应用聚合物科学杂志》2004,93(6):2918-2925
High strength polyethylene fiber (Toyobo, Dyneema® fiber: hereinafter abbreviated to DF) has a negative thermal expansion coefficient. Relation between fiber structure and thermal strain of DF used as reinforcement of DF reinforced plastic (DFRP) for cryogenic use was investigated. The crystallinities and orientation angles of several kinds of polyethylene fibers having different modulus from 15 to 134Gpa (herein after abbreviated to DFs) were measured by NMR and X‐ray. We obtained the parameters of the mechanical series‐parallel model composed of crystal and amorphous by crystallinity and modulus. Thermal expansion coefficients of DFs were estimated by mechanical series‐parallel model. All DFs having different modulus showed negative thermal expansion coefficients in the temperature range from 180 to 300K, and absolute values of those markedly increased by increasing tensile modulus of DF. The estimated thermal expansion coefficients showed negative values, and thermal strains showed a similar curve to observed ones mostly. Average thermal expansion coefficients in the temperature range from 180 to 300K estimated by mechanical model agreed with the observed ones. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 2918–2925, 2004 相似文献