On-body propagation velocity estimation using ultra-wideband frequency-domain spatial correlation analyses

On-body communications around the human torso are considered, using ultra-wideband transmissions. The velocity of the diffracted wave propagating around the body is extracted from frequency- domain spatial correlation analyses.     

存储媒体的媒体内同步反馈控制算法

本文提出了一种存储媒体的媒体内同步反馈控制算法，该方案是建立在缓冲区占用率控制基础上，通过周期性地检查缓冲区的占用情况来检测失步，并将其反馈给发送方，由发送方对发送帧速率进行调整。文章给出了接收方所需缓冲区的设计准则及发送帧速率的调整方法，并分析了算法中各参数对同步性能的影响。实验表明该方案能够处理由于网络传输时延特性变化引起的失步，与其它反馈控制方案相比具有更低的数据丢弃率，从而使接收端播放平滑连续，具有良好的视频播放质量。     

新型微波-毫米波幅相测试系统及扩展应用

介绍了一种新型微波 毫米波幅相测试系统及其在相关测试领域中的典型应用。与传统微波幅相测试系统相比 ,该系统具有原理新颖、结构简单、扩展频段容易和使用方便等优点。本系统目前广泛应用于紧缩场电气性能检测、天线测量和RCS测量等领域中 ,频率范围为 1～ 110GHz。本测试系统已经申请国家专利 ,并通过相关部门鉴定。     

单桩腿有限元分析

为保证桩腿在冬季冰区海域的安全使用,对桩腿结构进行冰载荷作用下的强度分析。应用ANSYS软件建立桩腿、地基、冰相互作用的仿真计算模型,实现桩腿的力学分析。对桩腿进行了强度校核,计算出冰载荷作用下桩腿的变形及其应力状态。计算结果表明,桩腿在此冰载荷作用下强度满足安全要求。     

Characterization of an ASIC for CPG sensors with grid-only depth of interaction sensing

A new version of the front-end application specific integrated circuit (ASIC) for co-planar-grid (CPG) sensors is presented. Compared to the first version, the ASIC is optimized for signal/noise performance, modified in peaking time, and it implements timing signals to measure the depth of interaction using the grids signals only. Experimental results using state-of the-art CPG sensors and different approaches for reducing the error due to electron trapping are reported. A new technique that makes use of the sum and difference of the grids signals is also presented.     

工程化学基础课程的改革与实践

文中介绍了工程化学基础课程改革思想的提出，在教改过程中通过遴选合适的教材、修订教学大纲，建全教学文件、适当运用现代化教学手段和积极进行师资队伍建设等改革方案的实施，在教学实践中适应科技发展，培养工程概念，增强环保和经济意识，及时更新教学内容，提高教学质量。     

多线程编程技术实现经典进程同步问题

介绍了Windows环境下进行多线程编程的意义，重点讨论了C＋＋Builder环境下开发多线程应用程序这一问题。并通过实现生产者-消费者问题、读者-写者问题、哲学家共餐问题等经典进程同步问题使人们更好地理解同步概念及其实现方法。     

Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures

Focused ion beam (FIB) and nano-probing were applied for failure analysis of three-dimensional stacked circuits with copper through-silicon-vias between the stacked chips. The failure analysis was done after high temperature storage and thermal cycling tests. Passive voltage contrast in FIB allowed to pinpoint the open sites. FIB cross-sections showed the presence of opens at the bottom of the copper vias. The failure cause was suspected to be an interlayer particle, which was confirmed by optical profilometry. Nano-probing was used on another sample to pinpoint the failure location through the measurement of the local resistance within the daisy chains. The failure was traced out to be related with surface contamination.