增加黄金储备规避外汇风险

近几年，我国外汇储备逐年增加，而美元汇率偏弱，使我国承担很大的外汇风险。为了规避外汇风险，应增加黄金储备。文中提出了我国增加黄金储备总量的理由以及增加黄金储备的途径。这些建议具有可操作性，可以提供给有关部门参考。     

Nd3+ Doped Silicate Glass Photonic Crystal Fiber with Random Hole Distributions

The fabrication of one kind of large core area Nd3 doped silicate glass photonic crystal fiber, and demonstration of the fiber's waveguidence properties were reported. This fiber owns a random air hole distribution in the cladding. The measured minimum loss of this kind of fiber is 10 dB·m-1 at 660 nm. These fibers can sustain only a single mode at least over wavelength ranging from 660 nm to 980 nm.     

破片式战斗部优化设计技术研究

侧重研究了破片式战斗部装药外形的优化设计技术。提出了装药外形与破片飞散特性（如破片飞散角，分布带宽等）之间的数学描述；建立了圆弧和对数螺线装药外形母线与战斗部其他设计参数间的数学模型。在假定约束条件下，优化设计了破片了聚焦式战斗部的结构参数；静爆试验结果表明，破片分布与理论计算吻合较好。     

二硫代磷酸硫化氧钼与硫,磷添加剂的复配特性研究

研究了二烷基二硫代磷酸硫化氧钼（ＭｏＤＴＰ）摩擦改进剂及其与硫、磷、硫－磷型添加剂复合的抗磨减摩性能。试验表明，经过适当复配后，这类合活性元素的添加剂对ＭｏＤＴＰ的抗磨减摩性能均有增效作用，同一类型添加剂的活性愈高，增效作用愈显著。同时利用扫描电镜和Ｘ－射线能谱仪进行摩擦副表面膜的形貌照相及元素分析，对复合作用的机理进行了初步探讨。     

Evaluation of accuracy of measuring intraocular pressure by handheld non-contact applanation tonometer

PURPOSE: To evaluate the accuracy of measuring intraocular pressure by handheld non-contact applanation tonometer. METHOD: 58 patients' (113 eyes) intraocular pressure were measured by Keeler, non-contact tonometer and R 900 Goldmann applanation tonometer and the results of measurement of intraocular pressure by the two kinds of tonometers were compared. RESULT: The mean intraocular pressure measured by non-contact is 16.31 +/- 5.59 mmHg and 17.49 +/- 6.13 mmHg (1 mmHg = 0.1333 kPa) by Goldmann applanation tonometer, respectively. There was no statistical significance to be found (P > 0.05) between the two methods. By linear correlation and regression analysis, a positive correlation was found between the two methods (r = 0.8942, b = 0.8154). CONCLUSION: The handheld non-contact tonometer has the same accuracy and reliability of measurement of intraocular pressure comparing with Goldmann applanation tonometer, and it can be used in glaucoma clinic and screening.     

锆(Ⅳ)-3,5-diBr-PADAP-安替比林三元配合物的分光光度研究与应用

本文提出在安替比林存在下,以3,5-diBr-PADAP为显色剂,分光光度测定微量锆的新方法。在pH1～2的HCl介质中,锆(W)与试剂和安替比林形成配合比为1:1:1的红色三元配合物,最大吸收值在615nm波长处,摩尔吸光系数ε=1.35×10~5。锆(Ⅳ)量在0～25μg/25ml范围内,遵守比尔定律。方法简单、快速、准确。若采用钽试剂—苯萃取法分离共存离子,可适用于钽铌矿和合金中痕量锆的测定。     

一种新型背面接触式H~+-ISFET

简要地介绍了氢离子敏场效应晶体管(H~+-ISFET)的基本结构和工作原理,提出了一种新型背面接触式H~+-ISFET。对该结构在版图、工艺设计中的有关问题,进行了探讨。最后指出:它在pH值的测量中有较好的实用价值。     

Control of Titanium Alloy Thin Plate Welding Distortion by Trailing Peening

The technology of trailing peening is a kind of promisingly bran-new technology which can be used to control weldingstress and distortion of Ti alloy thin plate. Control of TC4 Ti alloy thn plate welding stress and distortion underthe condition of convent     

The thermodynamic performance of a new solution cycle in double absorption heat transformer using water/lithium bromide as the working fluids

In this paper, a new solution cycle in the double absorption heat transformer is presented and the thermodynamic performance of this new cycle is simulated based on the thermodynamic properties of aqueous solution of lithium bromide. The results show that this new cycle is superior to the cycle being studied by some researchers. This new solution cycle has a wider range of operation in which the system maintains the high value of COP and has larger temperature lifts and operation stability. The relationship between the absorber and the absorbing evaporator is more independent and this makes the operation and control of the system more easier.     

Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au

Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints. IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress.