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电压暂降作为最为严重的电能质量问题之一,已受到国内外专家学者广泛的重视。在电压暂降的特征参数中,除暂降幅值和持续时间外,相位跳变的影响也不容忽视。文中进行了相位跳变研究的必要性分析,给出了相位跳变的计算方法,通过对国内多个地区电能质量监测系统所获取到的暂降事件数据的处理与分析,得到了相位跳变值的分布特征;选取开关电源和交流接触器作为敏感性设备,进行了相位跳变的试验研究,绘制了不同相位跳变值下的电压暂降敏感度曲线。基于上述分析,在电压暂降评估中,将相位跳变作为电压暂降的一个重要特征参数进行研究是非常必要的。 相似文献
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The effects of Al2O3 addition on both the sintering behavior and microwave dielectric properties of PbO-B2O3-SiO2 glass ceramics were investigated by Fourier transform infrared spectroscope (FTIR), differential thermal analysis (DTA),
X-ray diffraction (XRD) and scanning electron microscopy (SEM). The results show that with the increase of Al2O3 content the bands assigned to [SiO4] nearly disappear. Aluminum replaces silicon in the glass network, which is helpful for the formation of boron-oxygen rings.
The increase of the transition temperature T
g and softening temperature T
f of PbO-B2O3-SiO2 glass ceramics leads to the increase of liquid phase precipitation temperature and promotes the structure stability in the
glasses, and consequently contributes to the decreasing trend of crystallization. Densification and dielectric constants increase
with the increase of Al2O3 content, but the dielectric loss is worsened. By contrast, the 3% (mass fraction) Al2O3-doped glass ceramics sintered at 725 °C have better properties of density ρ=2.72 g/cm3, dielectric constant ɛ
r
=6.78, dielectric loss tan δ=2.6×10−3 (measured at 9.8 GHz), which suggest that the glass ceramics can be applied in multilayer microwave devices requiring low
sintering temperatures. 相似文献
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讨论了复合添加La2O3/MgO对(Zr0.8Sn0.2)TiO4介质陶瓷烧结机制和微波介电性能的影响。结果表明,La2O3/MgO对(Zr0.8Sn0.2)TiO4的烧结有一定的促进作用,但La2O3/MgO添加量的增大会造成晶格缺陷和残留气孔的增多,从而导致材料的密度和Q×f降低。在1320℃保温12h、La2O3/MgO添加量为0.9wt%时,(Zr0.8Sn0.2)TiO4介电性能最好,其εr=37.14,Q×f=36600,τf=7.77×10-6/℃。 相似文献
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利用不同粒度的CaO-B2O3-SiO2(CBS)玻璃粉料,制备了低温烧结的CBS玻璃陶瓷.研究了粉料粒度对CBS系玻璃陶瓷低温烧结的影响.实验表明,粉料粒度对粉料的玻璃化温度Tg的影响不明显,玻璃致密化开始于玻璃化温度Tg≈680℃,随着烧成温度升高,收缩率迅速增大;随着粉料粒度的减小,试样的烧结温度和显气孔率降低,体积密度、收缩率、热膨胀系数和抗折强度都增大.将粉料粒径中位值D50=2.34 μm的粉料采用流延工艺制得127 μm的生料带,运用优化烧成工艺,与银电极浆料在850℃共烧,表面平整,匹配良好,能在一定程度上满足低温共烧陶瓷(LTCC)用基板材料的要求. 相似文献