Functional Properties and Food Applications of Rapeseed Protein Concentrate

Rapeseed protein concentrate (RC), prepared with 2% hexameta-phosphate, was tested for its functionality and performance in some foods. The RC had good nitrogen solubility, fat absorption, emulsification, and whipping capacities but poor water absorption and gelling properties. It increased the emulsion stability, and protein but lowered the fat content of wieners. It also increased the cooking yield, reduced the shrinkage and tenderized meat patties. Results were similar to soybean isolate except for the poorer color and flavor. The cooking yield of RC supplemented wieners was less than the all-meat control and soybean-supplemented wieners. A 9% RC dispersion mixed with an equal volume of eggwhite produced a meringue of comparable stability and texture to that of eggwhite alone.     

纳米技术在生物传感器中的应用

介绍了纳米技术在生物传感器中的应用，重点阐述当前发展方向的前沿。     

化学镀非晶态Ni—B合金的研究

本文通过化学镀方法在铜和钢上沉积非晶态Ni-B合金。着重讨论了还原剂浓度、络合剂浓度对化学镀沉积速率的影响;分析了它的耐蚀原因和其显微硬度随退火温度的变化情况并就其应用和发展略作说明。     

8Li次级束的产生

在北京串列加速器次级束流线上通过2 H(7Li,8Li) 1H逆运动学反应产生了用于核天体物理研究的8Li次级束。准直后的次级束纯度达到 80 %以上 ,对于 44MeV的7Li强度约为 3 0s- 1·pnA- 1,可以用来进行逆几何转移反应的实验测量。     

浅谈综合布线系统接地设计

综合布线系统作为建筑智能化不可缺少的基础设施,其接地系统的好坏将直接影响到综合布线系统的运行质量,故而显得尤为重要。本文介绍了综合布线系统接地的结构及设计要求,并提出在接地设计中应注意的几个问题。     

高温预析出对Al-Zn-Mg系铝合金时效硬化和应力腐蚀的影响

研究了高温固溶后降温处理工艺对中强可使预析出LC52和7039铝合金的组织、时效硬化和应力腐蚀的影响。金相观察发现,高温预析出可优先在晶界处产生,并提高随后时效状态下晶界析出相的不连续分布程度,温度降低到一定程度晶内和晶界产生大量析出。合金拉伸性能和应力腐蚀结果表明,预析出在保持强度和塑性的同时,可提高抗应力腐蚀性能。而预析出温度降低,合金强度呈下降趋势。     

JOINING MECHANISMS OF β''''-Al2O3 CERAMIC AND PYREX GLASS TO Al MATRIX COMPOSITE

The bonding of β'-Al2O3 and pyrex glass to Al matrix composites by anodic bonding process is achieved. The microstructure of the bonded interface and the joining mechanisms are analyzed with scanning electron microscope (SEM), energy dispersive X-ray fluorescence spectrometer (EDX). It is observed that the bonding region across the interface consists of the metal layer, oxide transitional layer and the ceramic layer, with the transitional layer composed of surface region and sub-surface region. The bonding process can mainly be categorized into anodic bonding process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining of the interface. The temperature, voltage and the drift ions in the ceramic or glass during the bonding process are the essential conditions to solid state diffusing and oxide bonding at the interface. The voltages, temperature, pressure as well as the surface state are the main factors that influence the anodic bonding.