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991.
992.
Electric and mechanical performances of Bi0.5Sb1.5Te3 prepared by spark plasma sintering 总被引:1,自引:0,他引:1
Thermoelectric (TE) materials are a kind of functional materials which can be used to convert directly heat energy to electricity or reversely.The thermoelectric effects hold great potential for application in power generation and refrigeration.Bi2Te3 and its alloys are well known as best TE materials currently available near room temperature.This paper studies respectively the effects of spark plasma sintering (SPS) on electric performance of Bi0.5Sb1.5Te3 thermoelectric materials that are prepared through vacuum melting and ball milling.Through X-ray Diffraction and cold field emission scanning electric microscope s4800, the phase constituent and microstructure of the TE materials samples were analyzed.Electric conductivity and power factor can be improved with the rise of Spark Plasma Sintering temperature (from 300 to 500 ℃) and pressure(from 30 to 60 MPa), and the density and mechanical strength of Bi0.5Sb1.5Te3 thermoelectric material increase, too. 相似文献
993.
Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder 总被引:1,自引:0,他引:1
D.C. Lin T.S. Srivatsan G-X. Wang R. Kovacevic 《Journal of Materials Engineering and Performance》2007,16(5):647-654
This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag,
and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process
revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag
solder, which is 6.5 °C, and for the composite counterparts, it is dependent on the percentage of copper nanopowder. Temperature
recordings revealed the same temperature level of 221 °C for both melting (from solid to liquid) and final solidification
(after recalescence) of the Sn-3.5%Ag solder. Addition of copper nanoparticles was observed to have no appreciable influence
on melting temperature of the composite solder. However, it does influence solidification of the composite solder. The addition
of 0.5 wt.% copper nanoparticles lowered the solidification temperature to 219.5 °C, while addition of 1.0 wt.% copper nanoparticles
lowered the solidification temperature to 217.5 °C, which is close to the melting point of the ternary eutectic Sn-Ag-Cu solder
alloy, Sn-3.7Ag-0.9Cu. This indicates the copper nanoparticles are completely dissolved in the eutectic Sn-3.5%Ag solder and
precipitate as the Cu6Sn5, which reinforces the eutectic solder. Optical microscopy observations revealed the addition of 1.0 wt.% of copper nanoparticles
to the Sn-3.5%Ag solder results in the formation and presence of the intermetallic compound Cu6Sn5. These particles are polygonal in morphology and dispersed randomly through the solder matrix. Addition of microsized copper
particles cannot completely dissolve in the eutectic solder and projects a sunflower morphology with the solid copper particle
surrounded by the Cu6Sn5 intermetallic compound coupled with residual porosity present in the solder sample. Microhardness measurements revealed the
addition of copper nanopowder to the eutectic Sn-3.5%Ag solder resulted in higher hardness. 相似文献
994.
995.
996.
It is well known that the mechanical properties such as strength and hardness of structural steel are usually enhanced by the martensite-phase transformation method. In many industrial applications, hardness has always been used as an index to reflect the wear-resistance performance. As a result, steel is quenched to a large extent in order to increase the hardness and wear-resistance performance. In general, from the wear mechanism, no exact relationship between the hardness and wear resistance of materials can be formulated. Also there are few conclusive studies on the effects of running procedures on wear-resistance performance. Therefore, the friction behavior of S45C carbon steel with and without a quenching process was evaluated by a rotating tribometer under various test conditions. The experimental results show that the running conditions cause a great influence on the wear-resistance performance of the materials. Under low speed and light apparent pressure conditions, the quenched specimens have high wear-resistance performance. Contrarily, at high speed and heavy loading, the wear-resistance performance of hardened specimens decreases due to tempering effects at the rubbing surface when the contact temperature becomes increased. Therefore, this causes more severe wear to the hardened specimens than to the unhardened specimens. 相似文献
997.
本研究考察了高温高压条件下添加剂硫对Ni-Mn-Co粉末触媒合成金刚石的影响,并在此基础上,考察了含硫金刚石的机械性能。研究表明:硫对Ni70Mn25Co5粉末触媒合成金刚石的成核有明显的抑制作用,随着硫含量的增加,成核呈减少趋势;添加剂硫影响晶体的颜色和晶形,随添加剂含量的增加,晶体的颜色呈加深趋势,硫的添加使晶体的表面出现孔洞缺陷,当硫含量较低时,孔洞缺陷多分布在(100)晶面上,当硫含量较高时,(111)晶面上也出现孔洞,致使晶体的完整性受到制约;添加剂硫影响金刚石的机械性能,随着添加剂硫含量的增加,含硫金刚石的冷冲击强度(TI)和热冲击强度(TTI)呈明显的下降趋势。 相似文献
998.
WANG Bowen CAO Shuying WENG Ling HUANG Wenmei SUN Ying 《稀有金属(英文版)》2006,25(5):538-542
The structure, magnetization, and magnetostriction of Sm0.9Pr0.1Fex and Sm1-xNdxFel.9 thin films have been investigated using X-ray diffraction, vibrating sample magnetometer, and optical cantilever method. It is found that the structure of Sm0.9Pr0.1Fex thin films consists of an Sm-Pr-Fe amorphous phase when x≤2.69 and that of Sm1-xNdxFel.9 thin films consists of an Sm-Nd-Fe amorphous phase. The in-plane magnetization of Sm0.91Pr0.1Fex thin films increases with increase in the Fe content, and low values of the in-plane coercivity occur in the range of 1.62≤ x≤ 2.28. The magnetostriction value of Sm0.91Pr0.1Fex thin films increases with increasing the Fe content when x ≤ 1.94 and decreases when x 〉 1.94. The in-plane magnetostriction of Sm1-xNdxFe1.9 thin films under low magnetic fields has been improved by the substitution of Nd for Sm when x = 0.2. 相似文献
999.
离心铸造梯度功能材料凝固过程中第二相的迁移行为 总被引:6,自引:1,他引:6
金属液在离心铸造下将发生第二相质点的径向移动。本文分析了第二相质点的移动规律。 相似文献
1000.