半连续式棒材轧机在线捆扎机及其工艺设置

由北京冶金设备制造厂设计的YSK6型钢丝捆扎机，共设有并列6台棒材捆扎车，每台捆扎车由中间收送机、成形捆扎机、液压装置、捆扎辊道和台车组合而成。按生产工艺参数要求，整个成型捆扎周期为30秒。捆扎后的棒材在成品称重时用电子秤，每称量一次均可打印出单次净值、累加值和累加次数值。     

转移法色交换

将图Ｇ的着色由一种变为中一种，通常用Ｋｅｍｐｅ法以交换。但是，对于某些情况，用此法无效。针对这个问题，本文提出了一种转移法色交换，它适用于平面图着色，方法直观，清晰且有效。     

施加复合电磁搅拌对A357合金微观组织的影响

在半固态加工技术中，电磁搅拌是最早应用于制备非枝晶浆料的方法之一，同时也是半固态触变压铸技术最早获得工业应用的重要技术基础之一。采用自行开发的电磁搅拌器，研究了多种不同电磁搅拌方式在不同工艺条件下，单独施加或复合施加对A357合金微观组织的影响。试验结果表明：单一施加旋转感应电磁搅拌时，浆料径向组织很不均匀；单一施加无芯感应电磁搅拌。当搅拌电流较小时，径向组织也不均匀，增大电流，浆料质量有明显改善；采用（旋转感应＋无芯感应）复合电磁场进行复合电磁搅拌时，可在电流较小时获得满意的浆料质量。     

Fluorescence in situ hybridization mapping of the cystic fibrosis transmembrane conductance regulator (CFTR) gene to 7q31.3

We have used the fluorescence in situ hybridization (FISH) technique to refine the localization of the cystic fibrosis transmembrane conductance regulator (CFTR) gene on human chromosome 7. The result shows that the gene is most likely located within band q31.3.     

国产核电厂蒸汽发生器下封头接管区模拟装置承受循环载荷能力的试验

国产核电厂蒸汽发生器下封头群孔接管区具有应力分布复杂、焊接施工条件差的特点。为考核其承受循环载荷的能力，设计制造了与实物相似的模拟试验装置，根据核电厂运行寿命期内的载荷特点，确定了模拟试验装置的试验载荷与试验循环数。循环加载试验的结果表明，蒸汽发生器下封头群孔接管区承受循环载荷的能力在寿命期内是符合要求的。     

太钢电弧炉上应用四星接法MOA的必要性

分析了太钢电弧炉变压器高压侧相间过电压的产生原因，比较了用于限制过电压的避雷器的两种接法．结论是用四垦接法ＭＯＡ限制过电压的效果较显著．     

Process and design analysis for ultrafine-pitched wiresweep elimination in advanced copper heat spreader BGA package

The semiconductor device trend for increasing functionalities and performances yet with smaller overall feature sizes presents escalating obstacles to the decreasing form factor along with demanding thermal carrying capability required at the package level. To confront this compounding issue, ultrafine-pitch wirebond interconnect coupled with thermally enhanced copper heat spreader attached to the package are introduced. However, the additional copper heat spreader thickness introduced within the package challenges the design of the package's wire, its loop height, and the molding process control to prevent wire sweeping occurrences. This study investigates the impact of different ultrafine pitched wire types, wire loop designs, copper heat spreader structures, and mold material types on eliminating device short from occurring due to the wire sweeping phenomena. A full factorial experiment is performed using an active silicon device packaged in a thermally enhanced ball grid array (BGA) test vehicle. In addition, test characterization is carried out using x-ray and multiinsertions hot/cold continuity tests. Then, a detailed failure analysis is performed by package decapsulation and scanning electron microscopy/energy-dispersive x-ray (SEM/EDX) to confirm the experimental findings. In conclusion, the study finds that for an ultrafine-pitched thermally enhanced BGA package, wire type is insignificant to reduce wire shorting occurrences. However, mold material and copper heat spreader structure using an optimized wire loop design are significant factors in eliminating wiresweep shorting phenomena. This study concludes with a wirebond interconnect and heat slug design recommended along with an improved process parameters and assembly material sets found from the experiment.     

MX345芯片及单片机控制

MX345芯片用于产生模拟信令—CTCSS单音.本文在介绍MX345编码/解码器工作原理的基础上,设计出MX345芯片与单片机的接口电路.最后给出控制软件.     

Crystallite growth characteristics in superfine zirconia powders and compacts

Crystallite growth characteristics of coprecipitated superfine zirconia powders have been investigated. It was found that the crystallite growth in powders follows a cubic law at 800 and 1000°C; however, the crystallite size data for compacts of both Y-TZP and YSZ cannot be fitted with a traditional parabolic or cubic law, but with a linear relation between crystallite size and the logarithm of time. In addition, it was also found that the degree of agglomeration of the powders can affect the crystallite growth.