平滑相位的π/4DQPSK调制及其在移动通信系统中的应用

本文详细介绍了一种新型π/ 4DQPSK调制解调方法 ,该方法将π/ 4DQPSK调制中的相位跳变改为平滑变化。仿真实验表明 ,与普通的π/ 4DQPSK相比 ,该方法使高次谐波分量大幅下降 ,可以有效降低功耗 ,压缩频带宽度。     

陶瓷行业推行ISO14000探析

大力推行ISO14000系列标准已成为我国陶瓷企业适应加入WTO后新的竞争形式，参与国际绿色贸易的有力武器。本文根据我国陶瓷企业的现状，分析了在陶瓷行业推行ISO14000系列标准工作中所存在的问题，提出了在我国陶瓷行业广泛推行ISO14000系列标准的对策和建议。     

陶瓷企业管理信息系统的应用

通过分析陶瓷企业现状和需求，提出实施管理信息系统的框架结构和必要条件。     

PBA/PMMA核壳结构乳胶粒子粒径分析

采用种子乳液聚合制备出了PBA/PMMA核壳结构乳胶粒子，研究并分析了MMA在3种不同投料方式（间歇法、半间歇法和平衡溶胀法）下粒子粒径变化情况。实验发现第二单体采用间歇法投料可获得较理想的核壳结构乳胶粒。     

SF6气体绝缘电容式电压互感器研制

本文介绍西容公司新研制的一种完全无油化的SF6气体绝缘电容式电压互感器,提出了关键技术问题解决方案和产品绝缘结构的设计思路.并介绍了研制成功的110kV和220kV系列产品的结构、技术参数、性能指标、试验考核情况和产品特点.     

掺Yb相移光纤光栅形成过程的分析

研究了用二次曝光法制作掺Yb相移光纤光栅的实验过程 ,并对相移光纤光栅制作过程中出现次峰的情况进行了理论分析。合理地解释了该现象     

超声处理对RTM成型复合材料界面性能的影响

在RTM成型过程中采用超声技术。探讨了超声处理的最佳工艺参数,着重研究超声处理对RTM成型复合材料界面性能的影响。结果表明,在RTM成型过程中采用超声技术增加了树脂对纤维增强体的浸润性,使树脂中的空气和成型过程中产生的气泡易于排出,从而减少了复合材料的孔隙率,进而改善复合材料的界面性能。     

A push mechanism for GPRS supporting private IP addresses

The General Packet Radio Service (GPRS) provides a packet switched data service for mobile users. However, the existing GPRS specification does not provide the push mechanism and it is difficult to support GPRS services such as call termination (incoming call) for wireless voice over IP (VoIP). Based on the short message service, this paper proposes a push mechanism for GPRS supporting private IP addresses. Our approach does not need to modify the existing GPRS structure.     

Enhancement of underfill capillary flow in flip-chip packaging by means of the inertia effect

This paper describes how the use of inertia forces induced by the rotation of a working disk may be adopted to increase the fill rate of the flip-chip packaging process and thereby reduce the process cycle time. It is shown how the driving forces resulting from the inertia effect are determined by the Weber number. The constant and varying contact angle models are compared under a specified set of process conditions. The calculated flow behavior results indicate that the relationship between the contact angle, the average fluid velocity, the liquid-air interface position, and the filling time depends upon the Weber number. The constant and varying contact angle models are utilized in the analysis of a new processing method referred to as rotation-enhanced underfill packaging (REUP). The inertia effect induced by the angular motion of the working disk is shown to enhance the flow of the underfill encapsulant and to reduce the time of the underfill process. The present results confirm that the rotation of the working disk leads to an increased underfill capillary flow rate, which is beneficial in reducing the production cycle time of the flip-chip packaging process.