IC卡处理系统及其实现

本文介绍了ＩＣ卡处理系统的基本组成，详述了一种ＩＣ卡处理系统的软硬件实现方法，说明了Ｉ＾２Ｃ总线在系统中的应用。     

基于LabVIEW的浑浊度数字化测试仪设计

本文将虚拟仪器技术与光频转换器件TSL230B相结合,设计新型浑浊度数字化测试仪.阐述该系统的工作原理、硬件构成及软件设计方案;实现浑浊度的自动在线测量.实验结果表明,该仪器数据处理能力强,图形化显示直观,保存与打印结果方便,测量的重复性好,精确度高.     

浅析发电企业生产项目招标的规范管理

本文分析了发电企业生产项目招标的现状、特点以及存在的问题，提出了完善和改进发电企业生产项目招标管理的一些措施，从而建立科学合理、规范的监督制度与运作程序，保证项目质量，提高经济效益。     

Stabilization of multiple independent linear systems with control networks

The problem of stabilizing multiple independent linear systems sharing one conmmon network cable is presented and solved. Both the quanfization and time sequencing are studied in the field of control over networks by providing the formulated stabilizing sufficient condition which illustrates the relationship between the system instability, quanfization and time sequencing, and the data rate is also presented in temps of the quanfization and time sequencing. A numerical example is given to illustrate the result.     

分布式防火墙技术研究

介绍了分布式防火墙的产生、体系结构、主要特点及存在的问题.     

安钢高强板AH60的生产实践

本文论述了高强度低合金钢板AH60的试制过程，结合产品技术要求和生产实际设计合理的成分体系和工艺路线。     

浅析企业新产品开发中若干问题

分析了企业新产品开发活动中存在的各种问题．并对国内企业和国外成熟企业就新产品开发流程作了相应的比较。     

马钢四铁厂2号高炉开炉实践

马钢四铁厂2号高炉通过开炉前的认真准备，加强人员培训，选择合适开炉料和送风参数以及送风后尽快降硅、合理调整煤气流等一系列措施，高炉开炉后生产水平快速上升，实现了开炉15天达产，第二个月高炉利用系数达2．238的好成绩。     

A fuzzy constraint satisfaction approach for electronic shopping assistance

The Internet and World Wide Web offer an additional channel for consumers to find, select, and buy products. However, unlike shopping in the traditional store, consumers have no direct contact with human clerks to get the required information in the electronic store. The objective of this paper is to propose a fuzzy constraint satisfaction approach to help buyers find fully satisfactory or replacement products in electronic shopping. For the buyer who can give precise product requirements, the proposed approach can generate product-ranking lists based on the satisfaction degrees of each product to the given requirements. For the buyer who may not input accurate requirements, a similarity analysis approach is proposed to assess buyer requirements automatically during his browsing process. The proposed approach could help buyers find the preferred products on the top of the ranking list without further searching the remaining pages. The experimental results show the applicability of the proposed approach for electronic shopping assistance.     

The coming of CSP: automated assembly processes for high-volume chip scale packaging

Chip scale packaging (CSP) is emerging as a major player within the semiconductor packaging market. Processing in the back-end requires optimizing the use of intermediate carrier configurations such as tape-in-carrier and strip-based substrates. This optimization of carrier configurations must occur in all processes related to CSP assembly, including die attach, wire bond, encapsulation, ball attach, laser mark, singulate, inspect, and test. CSP is considered an SMT and, as such, can be processed using existing lines. However, CSP is different from SMT and has its own assembly problems. One of the critical problems is that, with thinner package profile requirement, thinner substrate is necessary. Another important problem that should be considered is the failure of solder joints because of the coefficient of thermal expansion mismatch among the substrate, lead packages, and the board when the thermal load is severe. To address this point, several studies using moire interferometry have been conducted to measure thermal deformations that accumulate during thermal cycles.