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991.
本文从理想材料轴对称弹塑性问题的所有基本方程出发,研究了全塑性时轴对称空间问题的塑性应变分布规律和应力场,并推导了控制应力分布的定解方程,给出了全塑性轴对称问题的通用解法。 相似文献
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压敏显色微胶囊及其涂料的研究进展 总被引:3,自引:0,他引:3
综述了无碳复写纸的结构类型和性能、压敏显色微胶囊制备及其微胶囊涂料的最新进展。揭示了微胶囊技术在无碳复写纸应用中的重要作用。 相似文献
997.
Co-evolution as a computational and cognitive model of design 总被引:6,自引:0,他引:6
Co-evolutionary design has been developed as a computational model that assumes two parallel search spaces: the problem space
and the solution space. The design process iteratively searches each space using the other space as the basis for a fitness
function when evaluating the alternatives. Co-evolutionary design can also be developed as a cognitive model of design by
characterizing the way in which designers iteratively search for a design solution, making revisions to the problem specification.
This paper presents the computational model of co-evolutionary design and then describes a protocol study of human designers
looking for evidence of co-evolution of problem specifications and design solutions. The study shows that co-evolutionary
design is a good cognitive model of design and highlights the similarities and differences between the computational model
and the cognitive model. The results show that the two kinds of co-evolutionary design complement each other, having strengths
in different aspects of the design process.
Electronic Publication 相似文献
998.
The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73–9% Zn and 0–3.0% Ag. The scanning
electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis
results indicate that Ag5Zn8 and AgZn3 become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations
gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure
when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure
of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these
solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%.
Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0%
to 3.0% 相似文献
999.
Hao Wang Minjia Xu Chen Wang Hubing T. 《Electromagnetic Compatibility, IEEE Transactions on》2003,45(2):198-206
When numerically modeling structures with imperfect conductors or conductors coated with a dielectric material, impedance boundary conditions (IBCs) can substantially reduce the amount of computation required. This paper incorporates the IBC in the finite-element method (FEM) part of a FEM/method of moments (FEM/MoM) modeling code. Properties of the new formulation are investigated and the formulation is used to model three practical electromagnetic problems. Results are compared to either measured data or other numerical results. The effect of the IBC on the condition number of hybrid FEM/MoM matrices is also discussed. 相似文献
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