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91.
We present a numerical study of the packing of uniform spheres under three-dimensional vibration using the discrete element method (DEM), focusing on the effects of vibration condition (amplitude and frequency) and inter-particle frictions (sliding and rolling frictions). The results are analysed in terms of packing density, coordination number (CN), radial distribution function (RDF) and pore structure. It is shown that increasing either the vibration amplitude or frequency causes packing density to increase initially to a maximum and then decrease. Both vibration frequency and amplitude should be considered to characterize the effect of vibration process on packing structure. The sliding and rolling frictions between particles can decrease packing density since they dissipate energy, although the effect of rolling friction is less significant. In line with the change of packing density, microstructural properties such as CN, RDF and pore distribution also change: a looser packing often corresponds to smaller CN, less peaked RDF and larger but more widely distributed pores. 相似文献
92.
本文介绍了磁电机点火系统的点火提前角测量原理。对点火系统的点火信号和触发信号进行采集、调理,再用单片机进行处理,最后用LabVIEW进行点火提前角数据存储和显示。 相似文献
93.
Seyeong Choi Alouini M.-S. Qaraqe K.A. Hong-Chuan Yang 《Wireless Communications, IEEE Transactions on》2008,7(2):495-499
We propose and analyze new finger assignment techniques that are applicable for RAKE receivers in the soft handover (SHO) region. Specifically, extending the results for the case of two-base station (BS), we consider the multi-BS situation, attack the statistics of several correlated generalized selection combining (GSC) stages, and provide closed-form expressions for the statistics of the output signal-to-noise ratio (SNR). By investigating the tradeoff among the error performance, the average number of required path estimations/comparisons, and the SHO overhead, we show through numerical examples that the new schemes offer commensurate performance in comparison with more complicated GSC-based diversity systems while requiring a smaller estimation load and SHO overhead. 相似文献
94.
对在五坐标数控加工中心上铣制三元流叶轮时出现的叶轮附面尺寸误差问题,进行了详细分析,并提出了问题的解决方法,有效地避免了加工中产生的超差。 相似文献
95.
Yawei Li Shaobai Sang Shengli Jin Chunyan Yang Nan Li 《Journal of Materials Science》2006,41(18):5815-5819
Synthesis of Mg-α-Sialon has been investigated by the mixture of silicon, aluminum and magnesia powders in a flowing nitrogen atmosphere in the range of 1300–1600 °C, when Mg-α-Sialon is designed with a chemical formulation of Mg
x
Si12−3x
Al3x
O
x
N16−x
in present work. The results showed that Mg-α-sialon initially occurred at 1400 °C and basically increased with elevated temperatures. For the samples of x = 0.6, 0.8 and 1.0 the products mainly consisted of Mg-α-Sialon with small amounts of Si, AlN and 21R AlN-polytypoid phases at 1600° C. However, in final products of x = 1.2, 1.4 and 1.6 only a little of Mg-α-Sialon formed and a great amount of Si remained in these samples at all the fired temperatures. Fortunately, the content of Mg-α-Sialon in these samples were obviously increased by adding a small amount of α-Si3N4 as seeds before nitridation. 相似文献
96.
97.
98.
Wei Li Zhang Wei Pan Bin Luo Xi Hua Zou Meng Yao Wang 《Photonics Technology Letters, IEEE》2008,20(9):712-714
A theoretical construction of one-to-many (OTM) and many-to-one (MTO) chaos synchronization communications using semiconductor lasers is presented. One center laser provides strong injections (strong link) to other side lasers, and the side lasers also provide weak injections (weak link) to the center one. Simulation results show that the side lasers synchronize with the center laser through injection-locking. In addition, messages transmitted via the strong links or the weak links experience strong chaos pass filtering, enabling us to realize OTM and MTO communications. 相似文献
99.
Bin Xie Shi X.Q. Han Ding 《Components and Packaging Technologies, IEEE Transactions on》2008,31(2):361-369
In an anisotropic conductive adhesive (ACA) assembly, the electrical conduction is usually achieved with the conductive particles between the bumps of integrated circuit (IC) and corresponding conductive tracks on the glass substrate. Fully understanding of the mechanical and electrical characteristics of ACA particles can help to optimize the assembly process and improve the reliability of ACA interconnection. Most conductive particles used in the ACA assembly are with cracks in the metal coating of the particles after the ACA bonding. This paper introduced the fracture analysis by applying the cohesive elements in the numerical model of the nickel-coated polymer particle and further simulating the cracks initiation and propagation in the nickel coating during the ACA bonding. The simulation results showed that the stress distribution on the nickel-coated particle with cracks was significantly different from that on the nickel-coated particle without crack, indicating that the stress analysis by taking the crack into consideration is very important for the reliability assessment of the ACA interconnection. The stress analysis of cohesive elements indicated that the cracks initiated at the central area of the nickel coating and propagated to the polar area. Furthermore, by the introduction of a new parameter of the virtual resistance, a mathematical model was established to describe the electrical characteristics of the nickel-coated particle with cracks. The particle resistance of the nickel-coated particle with cracks was found to be much higher than that of the particle without crack in the optimized bonding pressure range, indicating that it is necessary to take the crack into consideration for the particle conduction analysis as well. Therefore, the fracture analysis on the conductive particle by taking the crack into consideration could accurately evaluate the reliability of ACA interconnection and avoid serious reliability issues. 相似文献
100.