一种基于超短波地空通信的椭圆信道模型

在矢量信道环境中提出了一种基于超短波地空通信的椭圆信道模型,推导出了地面接收信号的标准多径时延和波达方向的概率密度函数,对标准多径时延、波达方向和接收功率进行了仿真,分析了V/UHF地空通信的信道特性,表明了多径效应对超短波地空通信的影响.     

W-Mo合金CMP工艺参数的影响与优化研究

简述了金属化学机械抛光的机理。将半导体制造工艺中的化学机械抛光技术拓展并应用到W-Mo合金表面加工中,在实现W-Mo合金材料表面高平坦度、低粗糙度的前提下,提高W-Mo合金去除速率。针对W-Mo合金的性质,选用碱性抛光液,并采用田口方法对抛光液pH值、抛光压力和抛光盘转速三个重要因素进行了优化设计,得到以去除速率为评价条件的综合最优抛光参数。实验分析表明,当抛光液pH值为11,抛光压力为80 kPa,抛光盘转速60 r/min时,可以获得较高的去除速率。     

宽带IP城域网及其应用

文章结合南京电信公众宽带IP城域网的建设，对宽带IP城域网的网络结构、用户接入安全、网络管理和认证计费作了阐述，并简要介绍了应用于宽带IP城域网上的一些业务。     

业务光网络中光服务等级协定的研究

从业务光网络的角度对比服务等级协定(SLA)定义了光服务等级协定(O-SLA)的框架结构,在此基础上重点分析了O-SLA协商机制并提出一种动态协商的概念,对动态协商机制的实现流程进行了分析研究.随后总结了O-SLA得以有效实施的关键技术,并提出一种支持区分服务的O-SLA实施流程,此流程对于向端用户提供可定制化的光层业务提供了一种新思路.     

无人机箱式发射助推火箭燃气流场数值模拟

对计算流体力学中的域动分层法动网格更新技术进行了阐述,并且应用该方法对无人机发射时的燃气流场进行数值模拟,得到全流场参数在三维空间上的时间分布.无人机每个时刻的运动速度事先根据推力曲线计算好,随着无人机的运动,根据相应变化的运动边界更新网格,并且计算新网格下的流场分布,相应的流场边界条件也会发生变化.通过分析计算得到的箱上各监测点的压力分布曲线,了解冲击波在箱体表面传播的过程和产生的影响,结果可以为工程应用提供有力的参考.     

Anodic Synthesis of Hierarchical SnS/SnOx Hollow Nanospheres and Their Application for High‐Performance Na‐Ion Batteries

Constructing hollow nanostructures is attractive for both fundamental research and practical applications. However, how to prepare hollow nanostructures in a simple, scalable, and cost‐effective way still remains a great challenge. In this study, for the first time, the anodization technique is applied to construct hollow nanostructures. Specifically, hollow nanospheres of SnS/SnO_x with a hierarchical porous structure are self‐assembled directly on the Sn substrate, via a convenient one‐step anodization method. When applied for sodium‐ion batteries, the thus fabricated SnS/SnO_x hollow nanospheres on the substrate readily serve as a binder‐free electrode, delivering remarkably high cycling stability and rate capability.     

An Electroabsorption Modulator Monolithically Integrated with a Semiconductor Optical Amplifier and a Dual-Waveguide Spot-Size Converter

A semiconductor optical amplifier and electroabsorption modulator monolithically integrated with a spot-size converter input and output is fabricated by means of selective area growth,quantum well intermixing,and asymmetric twin waveguide technology.A 1550～1600nm lossless operation with a high DC extinction ratio of 25dB and more than 10GHz 3dB bandwidth are successfully achieved.The output beam divergence angles of the device in the horizontal and vertical directions are as small as 7.3°×18.0°,respectively,resulting in a 3.0dB coupling loss with a cleaved single-mode optical fiber.     

基于统计分析的数据链电磁环境适应性研究

通过对无人机数据链在零均值和非零均值电磁干扰环境条件下的电磁兼容性概率函数的研究,检验系统在给定信号条件下的电磁兼容性概率,可以客观地反映出无人机数据链电磁环境适应能力的高低.从总体性能检测或环境适应性分析的角度考虑,利用具有可比性的传统误码率分析方法的验证及其取得的一致性结论,清晰地表明该统计方法的有效性.     

分析MES在小批量电子产品生产管理中的应用

MES是生产管理系统的核心,是管理信息系统和生产企业过程自动化系统之间的桥梁。制造执行系统是当前企业应用和信息化研究的热点之一,设计针对电子制造企业的制造执行系统,体现了电子制造行业对制造执行系统的功能要求。本文阐述了制造执行系统在这种生产环境下的管理应用,介绍了小批量生产环境下电子产品科研生产管理中所存在的问题。     

A Room‐Temperature High‐Conductivity Metal Printing Paradigm with Visible‐Light Projection Lithography

Fabricating electronic devices require integrating metallic conductors and polymeric insulators in complex structures. Current metal‐patterning methods such as evaporation and laser sintering require vacuum, multistep processes, and high temperature during sintering or postannealing to achieve desirable electrical conductivity, which damages low‐temperature polymer substrates. Here reports a facile ecofriendly room‐temperature metal printing paradigm using visible‐light projection lithography. With a particle‐free reactive silver ink, photoinduced redox reaction occurs to form metallic silver within designed illuminated regions through a digital mask on substrate with insignificant temperature change (<4 °C). The patterns exhibit remarkably high conductivity achievable at room temperature (2.4 × 10⁷ S m^?1, ≈40% of bulk silver conductivity) after simple room‐temperature chemical annealing for 1–2 s. The finest silver trace produced reaches 15 µm. Neither extra thermal energy input nor physical mask is required for the entire fabrication process. Metal patterns were printed on various substrates, including polyethylene terephthalate, polydimethylsiloxane, polyimide, Scotch tape, print paper, Si wafer, glass coverslip, and polystyrene. By changing inks, this paradigm can be extended to print various metals and metal–polymer hybrid structures. This method greatly simplifies the metal‐patterning process and expands printability and substrate materials, showing huge potential in fabricating microelectronics with one system.