Konvergenz der Kommunikationsnetze zu Multiservice-Netzen

The rapid progress in the convergence of communication networks (fixed and mobile networks with data networks) to multi service networks has an impact on the principles of the traditional switching technologies. Future requirements will also have to be fulfilled through service-convergence (bundling of individual services to new services) regardless of organizational or technical boundaries. Requirements in the information- and communication-business all the way to technical network aspects are to be faced. Based on developments in microelectronics, two converging evolutions by packet-oriented technologies (within the network and at the edge of the network) are now taking place. Starting with the principles of circuit-switching and packet-switching the change in today’s telecommunications world will be discussed. Apart from that emphasis will be put on the distribution of the switching functions within the network, the change of the network’s topology, as well as the influence on the signalling protocols (extensions and new approaches).     

Codierte Modulation in modernen Übertragungssystemen

Modern communication systems offer high speed and reliable data transmission services. The quality of these services is achieved by combining coded multi-level modulation techniques and modern digital signal processing (Viterbi-decoding) in the receiver. In this paper we first present an introduction to Trellis Coded Modulation (TCM) and then some new results on unversal techniques adapted for the AWGN-channel as well as for the fading channel. It is shown that TCM is well suited for communication channels with time variant characteristics (e.g. mobile communication channels), especially when our new codes are applied.     

30 Jahre EXACT-Bauelementesystem

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Formation of titanium and cobalt germanides on Si (100) using rapid thermal processing

Titanium and cobalt germanides have been formed on Si (100) substrates using rapid thermal processing. Germanium was deposited by rapid thermal chemical vapor deposition prior to metal evaporation. Solid phase reactions were then performed using rapid thermal annealing in either Ar or N₂ ambients. Germanide formation has been found to occur in a manner similar to the formation of corresponding silicides. The sheet resistance was found to be dependent on annealing ambient (Ar or N₂) for titanium germanide formation, but not for cobalt germanide formation. The resistivities of titanium and cobalt germanides were found to be 20 μΩ-cm and 35.3μΩ-cm, corresponding to TiGe₂ and Co₂Ge, respectively. During solid phase reactions of Ti with Ge, we have found that the Ti₆Ge₅ phase forms prior to TiGe₂. The TiGe₂ phase was found to form approximately at 800° C. Cobalt germanide formation was found to occur at relatively low temperatures (425° C); however, the stability of the material is poor at elevated temperatures.     

CVD-based tungsten carbide schottky contacts to 6H-SiC for very high-temperature operation

In this study, tungsten carbide, with its hardness, chemical inertness, thermal stability and low resistivity (25 μΩ cm)¹ is shown as a reliable contact material to n- and p-type 6H-SiC for very high temperature applications. WC films with thicknesses of 100–150 nm were deposited by chemical vapor deposition (CVD) from a WF₆/C₃H₈/H₂ mixture at 1173 K. A method to pattern CVD-tungsten carbide is suggested. TEM analysis of as deposited samples displayed a clear and unreacted interface. The electrical investigations of the p-type 6H-SiC Schottky contacts revealed a high rectification ratio and a low reverse current density (6.1 × 10⁻⁵ A cm⁻², −10 V) up to 773 K. On n-type, a low barrier (Φ_Bn=0.79 eV) at room temperature was observed. The low Φ_Bn value suggests WC to be promising as an ohmic contact material on highly doped n-type epi-layers. We will show a temperature dependence for the barrier height of tungsten carbide contacts that can be related to the simultaneous change in the energy bandgap, which should be considered when designing SiC devices intended for high temperature operation.     

An Effective Approach for High‐Efficiency Photoelectrochemical Solar Cells by Using Bifunctional DNA Molecules Modified Photoanode

This paper firstly reports the effect of deoxyribonucleic acid (DNA) molecules extracted from chickpea and wheat plants on the injection/recombination of photogenerated electrons and sensitizing ability of dye‐sensitized solar cells (DSSCs). These high‐yield DNA molecules are applied as both linker bridging unit as well as thin tunneling barrier (TTB) at titanium dioxide (TiO₂ )/dye interface, to build up high‐efficient DSSCs. With its favorable energy levels, effective linker bridging role, and double helix structure, bifunctional DNA modifier shows an efficient electron injection, suppressed charge recombination, longer electron lifetime, and higher light harvesting efficiency, which leads to higher photovoltaic performance. In particular, a photoconversion efficiency (PCE) of 9.23% is achieved by the binary chickpea and wheat DNA‐modified TiO₂ (CW@TiO₂) photoanode. Furthermore, time‐resolved fluorescence spectroscopy measurements confirm a better electron transfer kinetics for DNA‐modified TiO₂ photoanodes, implying a higher electron transfer rate (k_ET). This work highlights a great contribution for the photoanodes that are linked with DNA molecule, which act as both bridging unit and TTB to control the charge recombination and injection dynamics, and hence, boost the photovoltaic performance in the DSSCs.