Cu CMP工艺中新型低pH碱性抛光液稳定性的研究

Abstract： The stability of a novel low-pH alkaline slurry （marked as slurry A, pH = 8.5） for copper chemical mechanical planarization was investigated in this paper. First of all, the stability mechanism of the alkaline slurry was studied. Then many parameters have been tested for researching the stability of the slurry through comparing with a traditional alkaline slurry （marked as slurry B, pH = 9.5）, such as the pH value, particle size and zeta potential. Apart from this, the stability of the copper removal rate, dishing, erosion and surface roughness were also studied. All the results show that the stability of the novel low-pH alkaline slurry is better than the traditional alkaline slurry. The working-life of the novel low-pH alkaline slurry reaches 48 h.     

新型碱性精抛液对300mm铜膜全局平坦化的影响

The copper removal rate and uniformity of two types copper slurries were investigated, which was performed on the 300 mm chemical mechanical planarization （CMP） platform. The experiment results illustrate that the removal rate of the two slurries is nearly the same. Slurry A is mainly composed ofa FA/OI1 type chelating agent and the uniformity reaches to 88.32%. While the uniformity of slurry B is 96.68%, which is mainly composed of a FA/OV type chelating agent. This phenomenon demonstrates that under the same process conditions, the uniformity of different slurries is vastly different. The CMP performance was evaluated in terms of the dishing and erosion values. In this paper, the relationship between the uniformity and the planarization was deeply analyzed, which is mainly based on the endpoint detection mechanism. The experiment results reveal that the slurry with good uniformity has low dishing and erosion. The slurry with bad uniformity, by contract, increases Cu dishing significantly and causes copper loss in the recessed region. Therefore, the following conclusions are drawn： slurry B can improve the wafer leveling efficiently and minimize the resistance and current density along the line, which is helpful to improve the device yield and product reliability. This investigation provides a guide to improve the uniformity and achieve the global and local planarization. It is very significant to meet the requirements for 22 nm technology nodes and control the dishing and erosion efficiently.     

负性VALCD三基色阈值特性分析

彩色液晶显示器件(CLCD在相同电压驱动条件下各波长透射率有很大的差别,从而引起图像显示的色彩饱和度或还原性不够。用UVVis8500型双光束紫外/可见分光光度计测量在不同电压驱动下负性VALCD的电光特性,对三基色的阈值特性和阈值特性随波长变化关系进行分析。结果表明,阈值电压V饱和电压V和中值电压V都是随着波长的增加而逐渐增大,并且饱和电压与阈值电压之差随着波长的增加而变大。对常用三种中心波长500.0 nm、550.0 nm和600.0 nm的中值电压V作为驱动电压进行分析,其结果为CLCD选取驱动电压提供一定的指导作用。     

TD-SCDMA标准的改进方案探究

文章给出的Walsh地址码分扇区使用技术同样可以起到空分多址的作用,大量减少小区内的CDMA多用户干扰。同时,多频点收发信机可共用高增益定向天线,使不同频点时隙的按需分配成为可能。若采用分集接收和小区间的自动频率规划技术,还将为TD-SCDMA标准的大规模使用和推广奠定良好的技术基础。     

Lee氏纠错码及其在QAM系统中的应用

首先介绍了Ｌｅｅ氏码这种对相位透明的多进制线纠错码的性质和构造，然后将它的应用从ＰＳＫ推广到６４ＱＡＭ系统，并给出性能比较分析结果。     

加快电工电子国家工科基础课程教学基地的建设

本文介绍了西安电子科技大学“国家电工电子教学基地”建设的规划和进展情况，以期促进与兄弟院校在教学改革方面的合作和交流。     

分形理论在煤储层物性研究中的应用

基于分形理论在地质问题研究中的标度不变性 ,利用煤层的自然粒级组成和压汞法测出的煤中不同孔径段的比孔密资料。进行了煤岩破碎结构的块度分形和孔隙结构分形 ,并就分形特征在构造煤破碎程度的划分中的意义及其对煤层气开发的影响进行了探讨。尤其指出了煤层孔隙结构分形存在两个“无标度区” ,孔径大于 10 -10 m的分数维 (D1) ,可用于评价煤层气的解吸和运移 ,小于 10 -10 m的分数维 (D2 )可用于评价煤层气的吸附与扩散。     

从AutoCAD中提取实体数据的研究

从提取实体数据的角度,对ＡｕｔｏＣＡＤ中ＤＸＦ文件结构进行了简单分析,着重介绍了基本图形实体数据、尺寸标注信息和块实体数据的提取过程,对于 ＣＡＤ／ＣＡＰＰ／ＣＡＭ的信息集成有重要意义。