Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages

Exposed pad packages were introduced in the late 1980s and early 1990s because of their excellent thermal and electrical performance. Despite these advantages, the exposed pad packages experience a lot of thermo-hygro-mechanical related reliability problems during qualification and testing. Examples are die lift, which occurs predominantly after moisture sensitivity level conditions, and die-attach to leadframe delamination leading to downbond stitch breaks during temperature cycling. In this chapter, nonlinear finite element (FE) models using fracture mechanics based J-integral calculations are used to assess the reliability problems of the exposed pad package family. Using the parametric FE models any geometrical and material effects can be explored to their impact on the occurrence diepad delamination, and dielift. For instance the impact of diepad size is found to be of much less importance as the impact of die thickness is. Using the fracture mechanics approach, the starting location for the delamination from thermo-hygro-mechanical point of view is deducted. The results indicate that when diepad delamination is present, cracks are likely to grow beneath the die and dielift will occur. The interaction between dielift and other failure modes, such as lifted ball bonds, are not found to be very significant. The FE models are combined with simulation-based optimization methods to deduct design guidelines for optimal reliability of the exposed pad family.     

On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages

Theoretical and practical ranges of leak rates measurable by the helium mass spectrometer are characterized. The effect of noise due to: 1) background helium present in the spectrometer and 2) desorption of helium that attaches itself to the specimen surface during bombing is quantified experimentally. The results guide a framework to extract the true leak rate from the measured leak rate profile. An optical interferometry based hermeticity measurement technique for ultra-fine leaks is proposed. The setup to implement the technique is described and a preliminary experimental result is reported.     

Reflectarray research at the communications research centre Canada

It has been a decade since a research program began on reflectarray technology at the Communications Research Centre Canada (CRC). This endeavor has demonstrated the advantages and shortcomings of this technology, the issues that ought to be addressed, and future opportunities. This paper summarizes the outcome of this research in the context of projects that have been carried out, and the resulting insight into reflectarray technology. Design methodology, fabrication process, and measurements results will be briefly discussed for each particular development.     

Effective factors on synthesis of the hematite–silica red inclusion pigment

The work focuses on the synthesis of a red ceramic pigment by inclusion of hematite in a fumed silica matrix with different specific surface areas. Iron(II) sulfate was used as hematite precursor. Mixtures of iron(II) sulfate and fumed silica with different mole ratios were heated at different temperatures from 1000 to 1300 °C for 4 h.     

Identification of the temperature field and stresses in a thermosensitive cylinder according to the surface strains

We identify the time dependence of temperature of a surface of a long hollow thermosensitive cylinder and its thermal and thermal stressed states according to the known temperature and strains on the other surface. The posed problem is reduced to the inverse problem of thermoelasticity. By using the solution of the direct problem of thermoelasticity, we perform the numerical verification of the proposed procedure of solution of the inverse problem. __________ Translated from Fizyko-Khimichna Mekhanika Materialiv, Vol. 43, No. 6, pp. 55–61, November–December, 2007.     

Sensitometric characteristics of an all‐solid‐state photoelectrochromic pixel for an electrochromic light‐addressable display

Abstract— An all solid‐state photoelectrochromic element (PECE) was developed on the basis of electrochromic layers of WO₃ and polyaniline with a layer of polymer electrolyte placed on a base of polyamidosulfoacid, in which a thin‐film CdS_xSe_1?x photoresistor was used as an electronic key. The dependence of the sensitometric characteristics of the PECE on the applied voltage was studied.     

Aging response of the young’s modulus and mechanical properties of Ti-29Nb-13Ta-4.6Zr for biomedical applications

Alloys for implant devices require improved strength but a reduced Young’s modulus, in order to become mechanically more compatible with adjacent bone tissues. In this study, a new metastable β-type titanium alloy, Ti-29Nb-13Ta-4.6Zr (wt pct), was subjected to aging treatment to produce different microstructures, and the resulting mechanical properties, including the Young’s modulus, were measured. The Young’s modulus of this alloy is found to be sensitive to microstructures generated by various heat treatments. For microstructures varying from (α + β) to (α + β + ω) and (β + ω), the Young’s modulus increases with an accompanying increase in tensile strength and hardness, but decreases in ductility. The (β + ω) microstructure has a low strength, high modulus, and poor ductility and cannot be used for biomedical applications. For an (α + β) microstructure, the volume fraction of the phases is shown to be the main factor that determines the mechanical properties.     

Radio sensing of a cometary nucleus: Possibilities for investigating the surface layer

The possibility for determining the structure of the surface layer of a cometary nucleus from the data of bistatic radar sensing is investigated. A rigorous solution formulated for this problem on the basis of vector equations of the electromagnetic field is presented.     

Development of Stretch Solder Interconnections for Wafer Level Packaging

A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.