The present investigation examines anxiety sensitivity, distress tolerance, and fear reactivity to bodily sensations in relation to Coping and Conformity marijuana use motives among a sample of young adult marijuana users (n = 135; 46.7% women; Mage = 20.45, SD = 5.0). After controlling for current marijuana use frequency (past 30 days), daily cigarette smoking rate, average volume of alcohol used over the past year, negative affectivity, and other marijuana use motives, anxiety sensitivity was significantly and uniquely associated with Coping and Conformity motives for marijuana use. Distress tolerance evidenced significant and unique incremental relations to Coping motives, whereas fear reactivity to bodily sensations was unrelated to any marijuana use motive. These results provide novel information related to the role of emotional sensitivity and tolerance factors as they pertain to specific types of motives for marijuana use among young adults. (PsycINFO Database Record (c) 2010 APA, all rights reserved) 相似文献
A framework for modeling controlled plastic flow through grain boundaries using a continuum plasticity theory, phenomenological
mesoscopic field dislocation mechanics (PMFDM), is presented in this article. The developed tool is used to analyze the effect
of different classes of constraints to plastic flow through grain boundaries, as it relates to dislocation microstructure
development and mechanical response of a bicrystal. It is found that in the case of low misorientation angle between adjacent
grains, impenetrable grain boundaries cause significant work hardening as compared to penetrable grain boundaries due to the
accumulation of excess dislocations along them. However, a penetrable grain boundary with a high misorientation angle effectively
behaves as an impenetrable boundary, with respect to the stress-strain response. 相似文献
Carbon nanotube (CNT) reinforced nanostructured Cu matrix composite with a grain size less than 25 nm has been successfully fabricated via a combination of ball milling and high-pressure torsion. CNTs were found to be homogeneously dispersed into the metal matrix, leading to grain refinement with a narrow grain size distribution and significant increase in hardness. 相似文献
Cryogenic aerosol cleaning is a dry cleaning method used in the back end of line (BEOL) semiconductor manufacturing to remove defects from planar hydrophobic surfaces such as SiCOH and SiCxNyHz. Cryogenic aerosol cleaning is preferred over conventional wet cleaning methods as it is a non-contact cleaning method, which uses inert gases to generate sub-micrometer-sized solid aerosol particles that physically remove nanometer-sized contaminants on wafer surfaces. Particle removal mechanism involves detachment of the particles upon impact with aerosol, diffusion, and finally entrainment away from the wafer. In BEOL metal line patterning, particles on the dielectric isolation surfaces translate through the subsequent lithography and copper fill steps in to single or multiple metal line open defects that are yield killers. In this study, we show that the particle removal performance of the standard aerosol cleaning can be enhanced by pre-heating the wafer and use of a higher molecular weight inert gas, namely Ar, for aerosol generation. Both the addition of a Pre-heat step and the use of Ar as the aerosol source showed 47–52% reduction in single and multiple line opens detected through wafer electrical tests during high volume semiconductor manufacturing process. 相似文献
The selective wetting behavior of silica in emulsion styrene butadiene rubber (ESBR)/solution styrene butadiene rubber (SSBR) blends is characterized by the wetting concept, which is further developed for filled blends based on miscible rubbers. It is found that not only the chemical rubber–filler affinity but also the topology of the filler surface significantly influences the selective filler wetting in rubber blends. The nanopore structure of the silica surface has been recognized as the main reason for the difference in the wetting behavior of the branched ESBR molecules and linear SSBR molecules. However, the effect of nanopore structure becomes more significant in the presence of silane. It is discussed that the adsorption of silane on silica surface constricts the nanopore to some extent that hinders effectively the space filling of the nanopores by the branched ESBR molecules but not by the linear SSBR molecules. As a result, in silanized ESBR/SSBR blends the dominant wetting of silica surface by the tightly bonded layer of SSBR molecules causes a low‐energy dissipation in the rubber–filler interphase. That imparts the low rolling resistance to the blends similar to that of a silica‐filled SSBR compound, while the ESBR‐rich matrix warrants the good tensile behavior, i.e., good abrasion and wear resistance of the blends.
Journal of Mechanical Science and Technology - A dielectric fluid plays a significant role on the machining efficiency of Electric discharge machining (EDM). Two phase (liquid-air) dielectric... 相似文献