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21.
A novel integrated vacuum field emission (VFE) differential amplifier (diff-amp) utilizing carbon nanotube (CNT) emitters has been developed. A dual-mask microfabrication process was employed to achieve a VFE diff-amp by integrating identical CNT VFE transistors with built-in split gates and integrated anodes. The identical pair of triode amplifiers was well-matched in their device characteristics. The measured ac small-signal characteristics of the diff-amp showed a common-mode-rejection ratio (CMRR) of ~ 320 (~ 50 dB). The proposed analytical model of the CMRR was verified to be in good agreement with the experimental data. The successful implementation of the CNT diff-amp demonstrates a new way to achieve temperature and radiation tolerant VFE integrated microelectronics.  相似文献   
22.
We report the growth of highly C-axis orientation of Sr x Ba1−x Nb2O6 (SBN) thin films on p-type (100) Si substrates by using a potassium-substituted SBN template layer with the sol–gel method. The crystallization of SBN thin films was found closely related to the potassium ion doping concentration and the postannealing temperature of the K-SBN template layer. Secondary ion mass spectrometry analysis showed that potassium elements were accumulated at the interface of the template layer and silicon substrate. SBN films postannealed at 750 °C with K-SBN template layer has a smaller full width at half maximum of X-ray rocking curve of 2.45° than that of 5.40° for the pure SBN films. By introducing a template layer, the surface morphologies of SBN films fabricated on silicon substrate were greatly improved.  相似文献   
23.
Editorial     
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24.
A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.  相似文献   
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A good understanding of environmental effects on structural modal properties is essential for reliable performance of vibration-based damage diagnosis methods. In this paper, a method of combining principal component analysis (PCA) and support vector regression (SVR) technique is proposed for modeling temperature-caused variability of modal frequencies for structures instrumented with long-term monitoring systems. PCA is first applied to extract principal components from the measured temperatures for dimensionality reduction. The predominant feature vectors in conjunction with the measured modal frequencies are then fed into a support vector algorithm to formulate regression models that may take into account thermal inertia effect. The research is focused on proper selection of the hyperparameters to obtain SVR models with good generalization performance. A grid search method with cross validation and a heuristic method are utilized for determining the optimal values of SVR hyperparameters. The proposed method is compared with the method directly using measurement data to train SVR models and the multivariate linear regression (MLR) method through the use of long-term measurement data from a cable-stayed bridge. It is shown that PCA-compressed features make the training and validation of SVR models more efficient in both model accuracy and computational costs, and the formulated SVR model performs much better than the MLR model in generalization performance. When continuously measured data is available, the SVR model formulated taking into account thermal inertia effect can achieve more accurate prediction than that without considering thermal inertia effect.  相似文献   
27.
This paper proposes an optimized content-aware authentication scheme for JPEG-2000 streams over lossy networks, where a received packet is consumed only when it is both decodable and authenticated. In a JPEG-2000 codestream, some packets are more important than others in terms of coding dependency and image quality. This naturally motivates allocating more redundant authentication information for the more important packets in order to maximize their probability of authentication and thereby minimize the distortion at the receiver. Towards this goal, with the awareness of its corresponding image content, we formulate an optimization framework to compute an authentication graph to maximize the expected media quality at the receiver, given specific authentication overhead and knowledge of network loss rate. System analysis and experimental results demonstrate that the proposed scheme achieves our design goal in that the rate-distortion (R-D) curve of the authenticated image is very close to the R-D curve when no authentication is required  相似文献   
28.
Multichannel security protocols transmit messages over multiple communication channels, taking into account each channel's security properties. Our first intentional use of these protocols goes back to a 1999 article that proposed physical contact for imprinting as opposed to the wireless channel used in subsequent operations. Only later did we understand three key points. First, explicit use of multiple channels in the same protocol can offer significant advantages for both security and usability. Second, explicitly stating the properties of the channel on which each protocol message is transmitted is useful for understanding one's own protocol in greater depth and therefore for addressing subtle vulnerabilities early on. Third, multichannel protocols existed long before we recognized them as such - think of the courier handcuffed to the briefcase carrying the code book that will later protect postal or telegraphic traffic. The paper presents a security protocol that exploit additional transmissions over lower-capacity channels, typically found in ubicomp environments, that offer a different combination of security properties.  相似文献   
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30.
Analysis and synthesis of on-chip spiral inductors   总被引:3,自引:0,他引:3  
This paper presents a physically based compact model for estimating high-frequency performance of spiral inductors. The model accurately accounts for skin and proximity effects in the metal conductors as well as eddy current losses in the substrate. The model shows excellent agreement with measured data mostly within 10% across a variety of inductor geometries and substrate dopings up to 20 GHz. A web-based spiral inductor synthesis and analysis tool COILS, which makes use of the compact models, is presented. An optimization algorithm using binary searches speeds up the synthesis of inductor designs.  相似文献   
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