A Method of Combined SHPB Technique and BP Neural Network to Study Impact Response of Materials

Abstract:  A new method combining the split Hopkinson pressure bar (SHPB) technique with the back-propagation (BP) neural network program is proposed. By this method, the treated strain wave signals become smooth with less noises induced by the transverse inertia. Moreover, the dynamic rate-dependent constitutive behaviour of materials can be identified, without any pre-assumption of a constitutive model. It is found that by taking the experimentally measured data of strain, strain rate and time as 'input' and the corresponding data of stress as 'output' of the BP neural network, the dynamic constitutive behaviour with internal damage or phase transformation evolution is easy to be identified, where the time could represent either the internal damage evolution or phase transformation process accompanied with the deformation process. It is emphasised that the data learnt by the BP neural network must include both loading and unloading processes, if the whole loading and unloading response is to be correctly predicted. The comparisons between the predictions and experimental results are in good agreement for both polyamide (PA) polymer (as an example of nonlinear viscoelastic materials) and Ti–Ni alloy (as an example of superelastic materials with stress-induced phase transformation).     

高非线性光纤及其应用

介绍了各种高非线性光纤的原理，并对其在超连续（SC）脉冲的产生和波长变换上的应用作了讨论。     

宣汉——达县地区飞仙关组储层预测方法研究

在宣汉-达县地区,以往仅依据地震属性来预测飞仙关组储层分布,钻探结果与实际情况不符,为此本文提出量化分析预测结合主参数分析的新方法和新思路。在量化分析中首先对飞仙关组储层进行高分辨率反演,获得储能系数图;然后结合主振幅剖面和主频率剖面分析,对储层进行预测。在研究区,本方法的预测结果与实钻情况相吻合。     

工艺空气压缩机组开车过程的思考

通过汽轮机组调速系统伺服马达不复位、主汽门不动作，反推出电磁阀控制线路接线错误，用人为短路压力开关等手段判断出组合油脱扣器活塞卡涩是造成现场延误开车的根本原因，提出完善大机组开车工作票制度、提高人员素质等措施。     

网络化永久性油气藏远程动态实时监测系统设计

本文设计了一种应用于油气藏永久性实时动态监测系统。该系统用光纤Bragg光栅(FBG)传感器作为井下永久性传感器,测量目的层的温度、压力等参数的模拟信号;在井口建立数据采集处理系统,将模拟信号解调成数字信号;通过GPRS无线移动通信网络传输到监测中心的数据库服务器上,并以Web形式发布到Internet网络上,同时提供移动用户浏览接口,且当数据异常时可以发送报警短消息。该系统实现了油气藏的远程实时动态监测,可以为油藏管理人员和技术人员及时、准确地做出决策提供可靠依据。     

High power mid-infrared optically pumped PbSe/PbSrSe multiple-quantum-well vertical-cavity surface-emitting laser operation at 325 K

A high power, mid-infrared (/spl lambda/=3.8 /spl mu/m) lead-salt vertical-cavity surface-emitting laser (VCSEL) operating at 325 K is demonstrated. The laser emission is generated in a half-wavelength microcavity consisting of seven pairs of PbSe/PbSrSe multiple-quantum-wells embedded in two mirrors and optically pumped with 5 ns laser pulses.     

永州市抗御"碧利斯"台风的实践与思考

受2006年第四号台风“碧利斯”的影响,永州市出现了持续的强降雨过程,部分地区出现了大暴雨,引发了严重的洪涝灾害,成为近年来影响较为严重的一次台风暴雨。永州市在抗御这次台风暴雨过程中,高度警惕,充分准备,周密部署,科学调度,全力以赴抗灾救灾,将灾害损失降到了最低程度,全市没有垮一库一坝,没有因山洪灾害发生人员伤亡。文章总结了永州市的防灾抗灾经验,并针对防御台风暴雨存在的问题,探讨了进一步减轻台风暴雨灾害损失的对策。     

Process and design analysis for ultrafine-pitched wiresweep elimination in advanced copper heat spreader BGA package

The semiconductor device trend for increasing functionalities and performances yet with smaller overall feature sizes presents escalating obstacles to the decreasing form factor along with demanding thermal carrying capability required at the package level. To confront this compounding issue, ultrafine-pitch wirebond interconnect coupled with thermally enhanced copper heat spreader attached to the package are introduced. However, the additional copper heat spreader thickness introduced within the package challenges the design of the package's wire, its loop height, and the molding process control to prevent wire sweeping occurrences. This study investigates the impact of different ultrafine pitched wire types, wire loop designs, copper heat spreader structures, and mold material types on eliminating device short from occurring due to the wire sweeping phenomena. A full factorial experiment is performed using an active silicon device packaged in a thermally enhanced ball grid array (BGA) test vehicle. In addition, test characterization is carried out using x-ray and multiinsertions hot/cold continuity tests. Then, a detailed failure analysis is performed by package decapsulation and scanning electron microscopy/energy-dispersive x-ray (SEM/EDX) to confirm the experimental findings. In conclusion, the study finds that for an ultrafine-pitched thermally enhanced BGA package, wire type is insignificant to reduce wire shorting occurrences. However, mold material and copper heat spreader structure using an optimized wire loop design are significant factors in eliminating wiresweep shorting phenomena. This study concludes with a wirebond interconnect and heat slug design recommended along with an improved process parameters and assembly material sets found from the experiment.