管道风险管理方法研究

按照管道风险管理的流程分别对管道风险评价、风险控制和决策支持、效能测试和响应进行了论述。针对目前国内管道行业的情况，提出了进行管道风险评价的有效方法及维护措施。着重介绍了国外管道风险可接受标准的情况，作为国内制定管道风险评价标准的参考。     

浅析高校新校区选址主要影响因素

从政策、城市与区域规划、环境、文化及其传承因素、基础设施等方面探析了高校新校区选址有关的主要影响因素，以满足高等学校大规模的扩建要求，促进高等教育的发展。     

智能动态网络资源分配系统

通过对解决GSM移动通信网络热点区域话务拥塞问题的研究，提出了利用可控功分器实现智能动态网络资源的分配，解决不同种类的话务拥塞问题，并着重讨论了该系统目前的成功运用及前景。     

Finding all hops shortest paths

In this letter, we introduce and investigate a new problem referred to as the All Hops Shortest Paths (AHSP) problem. The AHSP problem involves selecting, for all hop counts, the shortest paths from a given source to any other node in a network. We derive a tight lower bound on the worst-case computational complexities of the optimal comparison-based solutions to AHSP.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

炼油厂碱性污水生物催化氧化预处理工艺研究

在对炼油厂碱性污水水质分析的基础上,提出采用生物催化氧化工艺对碱性污水进行预处理。试验结果表明,在水力停留时间为4 h,曝气量(标准状态)为8 m3／h的条件下,碱性污水的硫化物去除率可达90％以上,出水中的硫化物平均值为15．2 mg/L,CODCR、酚和油的去除率分别为47．5％,44．1％,50．8％,其中CODCR体积负荷为3．85 kg／(m3·d),是传统生化处理的10倍, 达到了污水预处理的目的。     

润滑油用纳米TiO2的表面改性及自修复性能研究

采用油酸对纳米TiO2进行表面改性，使其稳定分散于基础油中。利用HQ-1摩擦磨损试验机考察纳米TiO2的自修复性能，并探讨其自修复机理。试验结果表明，经改性后的纳米TiO2粉体作为润滑添加剂具有良好的分散稳定性、减摩抗磨性和自修复性。     

基于PCI总线的扫描电镜图像采集系统

图像采集系统是扫描电镜的一个重要组成部分，用于控制扫描电镜的扫描电源，视频图像采集，数字化与显示，电镜主控计算机与底层微机板的通讯和电镜照相，本图像采集系统基于PCI总线接口设计，硬件主要设计采用FPGA技术，实现了数字电路的模块化设计，集成度和灵活性高，目前，电镜图像卡已达到所要求的设计水平。     

包装件压力试验机计算机测控系统

针对YE-50包装件压力试验机落后的测控系统，提出一种基于压力和位移闭环控制的计算机测控系统。根据测得的压力、位移和设定值，通过模糊控制输出驱动伺服阀实现了压力试验时的恒速控制和堆码试验时的恒力控制。并实时显示力——位移及应力——应变曲线。文中还对模糊控制器的实验整定方法进行了探讨。