Proline-derived in situ synthesis of nitrogen-doped porous carbon nanosheets with encaged Fe2O3@Fe3C nanoparticles for lithium-ion battery anodes

The homogeneous incorporation of heteroatoms into two-dimensional C nanostructures, which leads to an increased chemical reactivity and electrical conductivity as well as enhanced synergistic catalysis as a conductive matrix to disperse and encapsulate active nanocatalysts, is highly attractive and quite challenging. In this study, by using the natural and cheap hydrotropic amino acid proline—which has remarkably high solubility in water and a desirable N content of ~12.2 wt.%—as a C precursor pyrolyzed in the presence of a cubic KCl template, we developed a facile protocol for the large-scale production of N-doped C nanosheets with a hierarchically porous structure in a homogeneous dispersion. With concomitantly encapsulated and evenly spread Fe₂O₃ nanoparticles surrounded by two protective ultrathin layers of inner Fe₃C and outer onion-like C, the resulting N-doped graphitic C nanosheet hybrids (Fe₂O₃@Fe₃C-NGCNs) exhibited a very high Li-storage capacity and excellent rate capability with a reliable and prolonged cycle life. A reversible capacity as high as 857 mAh•g^–1 at a current density of 100 mA•g^–1 was observed even after 100 cycles. The capacity retention at a current density 10 times higher—1,000 mA•g^–1—reached 680 mAh•g^–1, which is 79% of that at 100 mA•g^–1, indicating that the hybrids are promising as anodes for advanced Li-ion batteries. The results highlight the importance of the heteroatomic dopant modification of the NGCNs host with tailored electronic and crystalline structures for competitive Li-storage features.

     

2HL055恒流二极管参数测试

2HL055是贵州博越公司生产的恒流二极管,该类器件恒定电流大,极限电压低,可以直接驱动负载,但器件形成实验室成品后,没有进行过参数测试,其基本参数范围不能确定。文章拟通过试验,进一步测试2HL055器件的基本参数,并确定部分参数的测试方法。     

Reversible data hiding in encrypted images based on multi-level encryption and block histogram modification

Multimedia Tools and Applications - In recent years there has been significant interest in reversible data hiding, and also in particular, reversible data hiding in encrypted images (RDH-EI). This...     

Time-variant global reliability sensitivity analysis of structures with both input random variables and stochastic processes

Structural and Multidisciplinary Optimization - The ubiquitous uncertainties presented in the input factors (e.g., material properties and loads) commonly lead to occasional failure of mechanical...     

Re-engineering of the design process for concurrent engineering

According to the requirements of concurrent engineering, three interdependency relationships (uncoupled relationship, coupled relationship and decoupled relationship) between design activities are presented in this paper. And the coupled relationship plays an important role in concurrent product design process. To represent the precedence relationships among design activities, a directed graph is used to describe the design process. And the interdependency relationship between activities is illustrated by a Design Structure Matrix which is the transpose of the accessibility matrix of the corresponding graph. Using the DSM, an algorithm of recognizing the coupled activities during the design process is presented. Moreover, an algorithm to figure out the order levels of activities during the design process is proposed. And both algorithms are illustrated with a die design example.     

A Compact Fourth-Order Finite Difference Scheme for Unsteady Viscous Incompressible Flows

In this paper, we extend a previous work on a compact scheme for the steady Navier–Stokes equations [Li, Tang, and Fornberg (1995), Int. J. Numer. Methods Fluids, 20, 1137–1151] to the unsteady case. By exploiting the coupling relation between the streamfunction and vorticity equations, the Navier–Stokes equations are discretized in space within a 3×3 stencil such that a fourth order accuracy is achieved. The time derivatives are discretized in such a way as to maintain the compactness of the stencil. We explore several known time-stepping approaches including second-order BDF method, fourth-order BDF method and the Crank–Nicolson method. Numerical solutions are obtained for the driven cavity problem and are compared with solutions available in the literature. For large values of the Reynolds number, it is found that high-order time discretizations outperform the low-order ones.     

Wafer-level multilayer integration of RF passives with thick BCB/metal interlayer connection in silicon-based SiP

This paper presents an integration technology for RF passives using benzocyclobutene (BCB)/metal multilayer interconnection for system-in-package applications. This technology has been specially developed for RF subsystem packages in which a thick polymer, BCB (more than 15 μm thick), is adopted as dielectric with lossy silicon as substrate for its excellent characteristics. Both dry-etch BCB and photosensitive BCB are applied in this work, and their processes are briefly introduced and compared. An RF power divider, an MIM capacitor, different types of RF inductors as well as a coupled microstrip based band-pass filter are fabricated and measured at wafer level. The results show good electrical performances, and accordingly the passives are well applicable in RF band. Moreover, the subsystem models including monolithic chips connected with passives are presented.