Diamond coating tools have been increasingly used for machining advanced materials. Recently, a microwave plasma-assisted chemical vapor deposition (CVD) technology was developed to produce diamond coatings which consist of nano-diamond crystals embedded into a hard amorphous diamond-like carbon matrix. In this study, the nanocrystalline diamond (NCD) coating tools were evaluated in machining high-strength aluminum (Al) alloy. The conventional CVD microcrystalline diamond coating (MCD) tools and PCD tools were also tested for performance comparisons. In addition, stress distributions in diamond coating tools, after deposition and during machining, were analyzed using a 2D finite element (FE) thermomechanical model.
The results show that catastrophic failures, reached in all except one machining conditions, limit the NCD tool life, which is primarily affected by the cutting speed. In addition, coating delamination in the worn NCD tools is clearly evident from scanning electron microscopy (SEM) and force monitoring in machining can capture the delamination incident. At a high feed, coating delamination may extend to the rake face. Furthermore, SEM observations of coating failure boundaries show intimate coating-substrate contact. Though the NCD tools are inferior to the PCD tools, they substantially outperform the MCD tools, which failed by premature delamination. The diamond coating tools can have high residual stresses from the deposition and stresses at the cutting edge are highly augmented. Further machining loading causes the stress reversal pattern which seems to correlate with the tool wear severity. 相似文献
The purpose of the present work was to investigate the effect of oxide fluxes on weld morphology, arc voltage, mechanical
properties, angular distortion and hot cracking susceptibility obtained with TIG welding, which applied to the welding of
5 mm thick austenitic stainless steel plates. A novel variant of the autogenous TIG welding process, oxide powders (Al2O3, Cr2O3, TiO2, SiO2 and CaO) was applied on a type 304 stainless steel through a thin layer of the flux to produce a bead on plate welds. The
experimental results indicated that the increase in the penetration is significant with the use of Cr2O3, TiO2, and SiO2. A-TIG welding can increase the weld depth to bead-width ratio, and tends to reduce the angular distortion of the weldment.
It was also found that A-TIG welding can increase the retained delta-ferrite content of stainless steel 304 welds and, in
consequence, the hot-cracking susceptibility of as-welded is reduced. Physically constricting the plasma column and reducing
the anode spot are the possible mechanism for the effect of certain flux on A-TIG penetration. 相似文献
In this paper a new model has been proposed to describe the oxidation of Si–Al–O–N materials in both isothermal and non-isothermal conditions in the form of powders and pellets. All these formulae are analytic with a form of explicit function; therefore, they are not only easy to use but also enable the easy performance of a theoretical analysis. The application of these formulae to practical systems shows that this model is feasible; moreover, these formulae can not only be used to treat the oxidation for Si–Al–O–N materials but also be applied to treat reactions in other fields of materials. 相似文献
The present study details the microstructure evolution of the interfacial intermetallic compounds (IMCs) layer formed between
the Sn-xAg-0.5Cu (x = 1, 3, and 4 wt.%) solder balls and electroless Ni-P layer, and their bond strength variation during aging. The interfacial
IMCs layer in the as-reflowed specimens was only (Cu,Ni)6Sn5 for Sn-xAg-0.5Cu solders. The (Ni,Cu)3Sn4 IMCs layer formed when Sn-4Ag-0.5Cu and Sn-3Ag-0.5Cu solders were used as aging time increased. However, only (Cu,Ni)6Sn5 IMCs formed in Sn-1Ag-0.5Cu solders, when the aging time was extended beyond 1500 h. Two factors are expected to influence
bond strength and fracture modes. One of the factors is that the interfacial (Ni,Cu)3Sn4 IMCs formed at the interface and the fact that fracture occurs along the interface. The other factor is Ag3Sn IMCs coarsening in the solder matrix, and fracture reveals the ductility of the solder balls. The above analysis indicates
that during aging, the formation of interfacial (Ni,Cu)3Sn4 IMCs layers strongly influences the pull strength and the fracture behavior of a solder joint. This fact demonstrates that
interfacial layers are key to understanding the changes in bonding strength. Additionally, comparison of the bond strength
with various Sn-Ag-Cu lead-free solders for various Ag contents show that the Sn-1Ag-0.5Cu solder joint is not sensitive to
extended aging time. 相似文献
Meiosis and recombination are the two opposite aspects that coexist in a DNA system. As a driving force for evolution by generating natural genetic variations, meiotic recombination plays a very important role in the formation of eggs and sperm. Interestingly, the recombination does not occur randomly across a genome, but with higher probability in some genomic regions called “hotspots”, while with lower probability in so-called “coldspots”. With the ever-increasing amount of genome sequence data in the postgenomic era, computational methods for effectively identifying the hotspots and coldspots have become urgent as they can timely provide us with useful insights into the mechanism of meiotic recombination and the process of genome evolution as well. To meet the need, we developed a new predictor called “iRSpot-TNCPseAAC”, in which a DNA sample was formulated by combining its trinucleotide composition (TNC) and the pseudo amino acid components (PseAAC) of the protein translated from the DNA sample according to its genetic codes. The former was used to incorporate its local or short-rage sequence order information; while the latter, its global and long-range one. Compared with the best existing predictor in this area, iRSpot-TNCPseAAC achieved higher rates in accuracy, Mathew’s correlation coefficient, and sensitivity, indicating that the new predictor may become a useful tool for identifying the recombination hotspots and coldspots, or, at least, become a complementary tool to the existing methods. It has not escaped our notice that the aforementioned novel approach to incorporate the DNA sequence order information into a discrete model may also be used for many other genome analysis problems. The web-server for iRSpot-TNCPseAAC is available at http://www.jci-bioinfo.cn/iRSpot-TNCPseAAC. Furthermore, for the convenience of the vast majority of experimental scientists, a step-by-step guide is provided on how to use the current web server to obtain their desired result without the need to follow the complicated mathematical equations. 相似文献
This study is carried out to develop a direct link between a laser digitiser and a rapid prototyping system for biomedical applications. Two CAD/CAM systems, DUCT and Pro-Engineer, are investigated and the DUCT system is found to be more suitable for this purpose. A laser digitiser is used to capture three-dimensional surface data for the object. With the aid of the CAD/CAM system, the data can be manipulated in a number of ways for display, modification and enhancement. In addition, the object scanned by the laser digitiser can be physically produced relatively quickly and accurately using StereoLithography Apparatus (SLA), a leading rapid prototyping system. Feasible and practical solutions to the problems encountered in the CAD surface model construction are proposed and illustrated. Two case studies, a facial and a breast model, are presented. Results show that this integrated approach can be applied effectively in the biomedical field. 相似文献