Syntheses and biological activities of polymers containing methacryloyl‐2‐oxy‐1,2,3‐propanetricarboxylic acid or 5‐fluorouracil

A series of novel copolymers, poly(methacryloyl‐2‐oxy‐1,2,3‐propanetricarboxylic acid‐co‐exo‐3,6‐epoxy‐1,2,3,6‐tetrahydrophthalic acid) [poly(MTCA‐co‐ETAc)], poly(methacryloyl‐2‐oxy‐1,2,3‐propanetricarboxylic acid‐co‐hydrogenethyl‐exo‐3,6‐epoxy‐1,2,3,6‐tetrahydrophthalate) [poly(MTCA‐co‐HEET)], and poly(methacryloyl‐2‐oxy‐1,2,3‐propanetricarboxylic acid‐co‐α‐ethoxy‐exo‐3,6‐epoxy‐1,2,3,6‐tetrahydrophthaloyl‐5‐fluorouracil) [poly(MTCA‐co‐EETFU)], were prepared from corresponding monomers by photopolymerizations at 25°C for 48 h. The polymers were identified by FTIR, ¹H‐NMR, and ¹³C‐NMR spectroscopies. The number‐average molecular weights of the fractionated polymers determined by GPC were in the range from 9400 to 14,900 and polydispersity indices were 1.2–1.4. The in vitro IC₅₀ values of polymers against mouse mammary carcinoma (FM3A), mouse leukemia (P388), and human histiocytic lymphoma (U937) as cancer cell lines and mouse liver cells (AC2F) as a normal cell line were much higher compared to that of 5‐fluorouracil (5‐FU). The in vivo antitumor activities of monomers and polymers against mice bearing sarcoma 180 tumor cell line were better than those of 5‐FU. The inhibition of DNA replication and antiangiogenesis activities of MTCA and copolymers were better compared to those of 5‐FU. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 57–64, 2004     

Advanced underfill for high thermal reliability

The key to the success of flip‐chip technology lies in the availability of sucessful underfill materials. However, the reliability of flip‐chip technology using current underfill materials is generally found to be lower than that of conventional wire‐bond connection packaging materials such as epoxy molding compound (EMC) because of the high coefficients of thermal expansion (CTE) and moisture absorption of cured underfill material. In this study desbimide (DBMI), which has a low melting point (about 80°C), was used in the underfill materials as a cohardener. As a result, DBMI‐added underfill can show excellent thermal reliability, which is due to the superior properties of the CTE, the elastic modulus, and water resistance. When the properties of a 2 wt % DBMI‐added underfill were compared with those of a typical underfill (epoxy/anhydride), the CTE value was reduced to less than one‐half at the solder reflow temperature (about 200°C), the elastic modulus was reduced to less than one‐half in the temperature region below the glass‐transition temperature, and the water resistance was improved twofold. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 2617–2624, 2002     

Fully aliphatic polyimides from adamantane‐based diamines for enhanced thermal stability,solubility, transparency,and low dielectric constant

We have synthesized a series of fully aliphatic polyimides (APIs) from bicyclo[2,2,2]oct‐7‐ene‐2,3,5,6‐tetracarboxylic dianhydride (BOCA) and various aliphatic diamines, including linear aliphatic, flexible alicyclic, and rigid adamantyl diamines. We performed the polymerization reactions using one‐step syntheses in m‐cresol at elevated temperatures without the isolation of poly(amic) acid. The chemical composition and structure of the polymers were characterized by nuclear magnetic resonance (NMR) and infrared (IR) spectrometry. The characterization data are reported from analyses using gel permeation chromatography (GPC), thermogravimetric analysis (TGA), differential scanning calorimeter (DSC), and wide‐angle X‐ray diffraction (WXAD) measurements. The polyimides are also subjected to solubility, solution viscosity, tensile strength, transparency, and dielectric constant measurements. The resultant polyimides possess well‐controlled molecular weight, reasonable intrinsic viscosity, good transparency, enhanced solubility, low dielectric constants, and high glass transition temperature, together with marginal thermal and mechanical stability. These properties were enhanced in copolyimides containing equimolar amounts of rigid and flexible moieties. These rigid‐rod APIs derived from the alicyclic dianhydride and aliphatic diamines are promising candidates as advanced materials for future applications in micro‐ and photoelectronic devices. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 3316–3326, 2006     

Power management unit chip design for automobile active-matrix organic light-emitting diode display module

A power management unit (PMU) chip supplying dual panel supply voltage, which has a low electro-magnetic interference (EMI) characteristic and is favorable for miniaturization, is designed. A two-phase charge pump circuit using external pumping capacitor increases its pumping current and works out the charge-loss problem by using bulk-potential biasing circuit. A low-power start-up circuit is also proposed to reduce the power consumption of the band-gap reference voltage generator. And the ring oscillator used in the ELVSS power circuit is designed with logic devices by supplying the logic power supply to reduce the layout area. The PMU chip is designed with MagnaChip’s 0.25 μm high-voltage process. The driving currents of ELVDD and ELVSS are more than 50 mA when a SPICE simulation is done.     

Design of small-area multi-bit antifuse-type 1 kbit OTP memory

A multi-bit antifuse-type one-time programmable (OTP) memory is designed, which has a smaller area and a shorter programming time compared with the conventional single-bit antifuse-type OTP memory. While the conventional antifuse-type OTP memory can store a bit per cell, a proposed OTP memory can store two consecutive bits per cell through a data compression technique. The 1 kbit OTP memory designed with Magnachip 0.18 μm CMOS (complementary metal-oxide semiconductor) process is 34% smaller than the conventional single-bit antifuse-type OTP memory since the sizes of cell array and row decoder are reduced. And the programming time of the proposed OTP memory is nearly 50% smaller than that of the conventional counterpart since two consecutive bytes can be compressed and programmed into eight OTP cells at once. The layout area is 214 μm × 327 μm, and the read current is simulated to be 30.4 μA. Foundation item: Project supported by the 2nd Stage of Brain Korea; Project supported by the Korea Research Foundation     

Adhesion properties of UV crosslinked polystyrene-block-polybutadiene-block-polystyrene copolymer and tackifier mixture

The peel and tack properties of mixtures of polystyrene-block-polybutadiene-block-polystyrene (SBS) and a tackifier were investigated after these were crosslinked by ultraviolet (UV) irradiation at various amounts of benzophenone (BP) as a photoinitiator and trimethylolpropane mercaptopropionate (TRIS) as a crosslinking agent.The degree of crosslinking of polybutadiene (PB) block in the SBS mixture was qualitatively estimated from the amount of gel fraction as well as the change in the glass transition temperature of the PB block. The crosslinking of the PB block was done within 3 min after UV irradiation and the peel strength of crosslinked specimens was as low as 45[percnt] of specimens without crosslinking. Nano-tack and bulk tack properties as well as the surface tension of mixtures were measured depending upon amounts of BP and TRIS.     

Durability of glass‐fiber‐reinforced polymer nanocomposites in an alkaline environment

This study was conducted to determine the effect of clay content in GFRP (glass‐fiber‐reinforced polymer) composite samples as they were aged in an alkaline solution. Two kinds of GFRP composite samples were prepared. One was E‐glass‐fiber‐reinforced vinyl ester polymer, and the other was nano‐GFRP composites prepared with the addition of 1 and 2 wt% of montmorillonite clay to the polymer matrix. These samples were aged in alkaline solution of pH 13.2 with and without sustained load. The load was 1335 N or 18.7% of the tensile strength of the composite samples. The aging was evaluated by measuring the reduction in tensile strength after 6 months. Also, absorption of alkaline solution into the plain and nano‐GFRP samples was investigated so as to elucidate the diffusion behaviors. It was found that for a short exposure time (e.g. 1 month) and without sustained load, dispersing 2 wt% of the nanoclay in the polymer matrix of the GFRP samples reduces the diffusivity by 39%. However, with the application of sustained load, the glass fiber composite samples deteriorate more with increasing clay content. The reduction in tensile strength was 7.1%, 12.1%, and 18.1% for the samples containing 0, 1, and 2 wt% of clay, respectively. J. VINYL. ADDIT. TECHNOL., 12:25–32, 2006. © 2006 Society of Plastics Engineers     

沧州市2006~2016年春季大到暴雨特征分析

根据沧州市92个雨量监测站2006~2016年间的春季大到暴雨资料,研究了11年来沧州市春季大到暴雨的特征指标、时间变化规律以及空间变化趋势.研究发现:沧州市11年间春季大到暴雨强度(站点数)的时间变化呈抛物线趋势,与沧州市年降水量变化趋势非常接近;沧州市春季大到暴雨的空间分布情况为各县市均有发生,但分布不均匀,子牙新河沿岸出现高值区,以子牙新河为界,向两侧递减.     

Temperature and grain size dependence of superplasticity in a Zn−0.3wt.%Al alloy

The superplastic deformation behavior of quasi-single phase Zn-0.3 wt. %Al was investigated. A series of load relaxation and tensile tests was conducted at various temperatures ranging from RT (20 °C) to 200 °C. The recently proposed internal variable theory of structural superplasticity was applied. The flow curves obtained from load relaxation tests were shown to consist of contributions from interface sliding (IS) and accommodating plastic deformation. In the case of quasi-single phase Zn-0.3 wt.% Al alloy with an average agrain size of 1 μm, the IS behavior could be described as a viscous flow process characterized by a power index of M_g=0.5. A large elongation of about 1400% was obtained at room temperature and the strain rate sensitivity parameter was about 0.4. Although relatively large-grained (10 μm) single phase alloy showed a high value of strain rate sensitivity comparable to that of fine-grained alloy at very low strain rate range, IS was not expected from the analysis based on the internal variable theory of structural superplasticity at room temperature. As the temperature increased above 100 °C, however, the contribution from IS was observed at a very low strain rate range. A high elongation of ∼400% was obtained in a specimen of 10-μm-grain-size at 200 °C under a strain rate of 2×10⁻⁴/sec. Jointly appointed at Center for Advanced Aerospace Materials (CAAM)     

Image processing acceleration for intelligent unmanned aerial vehicle on mobile GPU

In this paper, we present an algorithm for providing visually-guided unmanned aerial vehicle (UAV) control using visual information that is processed on a mobile graphic processing unit (GPU). Most real-time machine vision applications for UAVs exploit low-resolution images because the shortage of computational resources comes from size, weight and power issue. This leads to the limitation that the data are insufficient to provide the UAV with intelligent behavior. However, GPUs have emerged as inexpensive parallel processors that are capable of providing high computational power in mobile environments. We present an approach for detecting and tracking lines that use a mobile GPU. Hough transform and clustering techniques were used for robust and fast tracking. We achieved accurate line detection and faster tracking performance using the mobile GPU as compared with an x86 i5 CPU. Moreover, the average results showed that the GPU provided approximately five times speedup as compared to an ARM quad-core Cortex-A15. We conducted a detailed analysis of the performance of proposed tracking and detection algorithm and obtained meaningful results that could be utilized in real flight.