Preparation of gold nanoparticles (GNP) aqueous suspensions by a new method involving Tiron

A new method is proposed to produce gold nanoparticles (GNP) by in situ reduction of a gold salt dissolved in water. The reducing agent used is Tiron instead of the citrate anion most often mentioned in literature. The influence of various parameters has been investigated, such as the content of Tiron with respect to that of the precursor of gold HAuCl₄, or the initial pH of the solution after mixing of reactants. It is shown that Tiron also exerts a positive influence as a dispersant, which impedes agglomeration of gold nanoparticles. The typical average size of GNP synthesized in the present work is close to 7 nm.     

Atomistic simulations of the solubilization of single-walled carbon nanotubes in toluene

Solubilization of the armchair, metallic (10,10) single-walled carbon nanotubes (SWCNTs) in toluene is modeled using molecular dynamics simulations. Inter- and intra-molecular atomic interactions in the SWCNT + toluene system are represented using COMPASS (Condensed-phased Optimized Molecular Potential for Atomistic Simulation Studies), the first ab initio forcefield that enables an accurate and simultaneous prediction of various gas-phase and condensed-phase properties of organic and inorganic materials.The results obtained show that due to a significant drop in the configurational entropy of toluene, the solvation Gibbs free energy for these nanotubes in toluene is small but positive suggesting that a suspension of these nanotubes in toluene is not stable and that the nanotubes would fall out of the solution. This prediction is consistent with experimental observations.     

Silicon-to-steel bonding using rapid thermal annealing

This paper presents the rapid, low-temperature bonding between silicon and steel using the rapid thermal annealing process. Three different thin-film adhesion layer systems including silver, gold, and nickel were utilized as the intermediate bonding material to assist the eutectic Pb/Sn bonding between silicon and steel. The bonding temperature was set at 220/spl deg/C for 20 s, with a 20-s ramp-up time. Five experiments were conducted to determine the strength of the bond, including static tensile and compressive four-point bend tests, axial extension tests, tensile bending fatigue tests, and corrosion resistance tests. The test results have shown that the gold adhesion layer is the most robust, demonstrating minimal creep during fatigue tests, no delamination during the tensile or compressive four-point bend tests, and acceptable strength during the axial extension tests. Additionally, all adhesion layers have withstood four months of submersion in various high-temperature solutions and lubricants without failure. Simulations of the axial stresses and strains that developed during the four-point bend and axial extension tests were performed and showed that the presence of the silicon die provides a local reinforcement of the bond as observed in the experimental tests.     

Nanoscale structural characteristics and electron field emission properties of transition metal–fullerene compound TiC60 films

Transition-metal compound TiC₆₀ thin films were grown by co-deposition from two separated sources of fullerene C₆₀ powder and titanium. Study of structural properties of the films, by Raman spectroscopy, atomic force microscopy, and scanning tunneling spectroscopy reveals that the films have a deformed C₆₀ structure with certain amount of sp³ bonds and a rough surface with a large number of nanoclusters. z–V tunnelling spectroscopic measurements suggest that several charge transport mechanisms are involved in as the tip penetrates into the thin film. Conventional field electron emission (FEE) measurements show a high emission current density of 10 mA/cm² and a low turn-on field less than 8 V/μm, with the field enhancement factors being 659 and 1947 for low-field region and high-field region, respectively. By exploiting STM tunneling spectroscopy, local FEE on nanometer scale has also been characterized in comparison with the conventional FEE. The respective field enhancement factors are estimated to be 99–355 for a gap varying from 36 to 6 nm. The enhanced FEE of TiC₆₀ thin films can be ascribed to structural variation of C₆₀ in the films and the electrical conducting paths formed by titanium nanocrystallites embedded in C₆₀ matrix.     

Stimulation of negative magnetoresistance by an electric field and light in silicon doped with boron and manganese

It is experimentally ascertained that light stimulates the negative magnetoresistance observed in a high electric field in silicon doped with boron and manganese. The optimum conditions (the electric field, temperature, illumination, and resistivity of the material) for observation of the largest magnitude of negative magnetoresistance in (Si:B):Mn are determined. The dependence of the negative magnetoresistance on the concentration of compensating impurity is established.     

The stress intensity factors for a short crack partially penetrating an inclusion of arbitrary shape

Some approximate solutions for predicting the stress intensity factor of a short crack penetrating an inclusion of arbitrary shape have been developed under mode I and mode II loading conditions. The derivation of the fundamental formula is based on the transformation toughening theory. The transformation strains in the inclusion are induced by the crack-tip field and remotely applied stresses, and approximately evaluated by the Eshelby equivalent inclusion theory. As validated by detailed finite element (FE) analyses, the developed solutions have good accuracy for different inclusion shape and for a wide range of modulus ratio between inclusion and matrix material.     

An overview of nondestructive evaluation methods

ondestructive evaluation is described as nondestructive testing (NDT), nondestructive inspection (NDI), and nondestructive examination (NDE). The activities associated with the evaluation include testing, inspection, and examination and primarily involve looking at (or through) and/or measuring some characteristic of an object. Frequently there is a desire to determine some characteristic of the object or to determine whether the object contains irregularities, discontinuities, or flaws. These examinations, inspections, or tests are used to determine the physical soundness of a material without impairing its usefulness. Nondestructive evaluation is a powerful tool that can help assure safety, quality, and reliability; increase productivity; decrease liability; protect the environment; and save money. In this article, nondestructive evaluation is represented by the acronym NDE.