Comparative experiments are performed in friction stir welding (FSW) of dissimilar Al/Mg alloys with and without assistance of ultrasonic vibration. Metallographic characterization of the welds at transverse cross sections reveals that ultrasonic vibration induces differences in plastic material flow in two conditions. In FSW, the plastic material in the peripheral area of shoulder-affected zone (SAZ) tends to flow downward because of the weakening of the driving force of the shoulder, and a plastic material insulation layer is formed at the SAZ edge. When ultrasonic vibration is exerted, the stirred zone is divided into the inner and outer shear layers, the downward material flow trend of the inner shear layer disappears and tends to flow upward, and the onion-ring structure caused by the swirl motion is avoided in the pin-affected zone. By improving the flow behavior of plastic materials in the stirred zone, ultrasonic vibration reduces the heat generation, accelerates the heat dissipation in nugget zone and changes the thermal cycles, thus inhibiting the formation of intermetallic compound layers.
Hardware security has become more and more important in current information security architecture. Recently collected reports have shown that there may have been considerable hardware attacks prepared for possible military usage from all over the world. Due to the intrinsic difference from software security, hardware security has some special features and challenges. In order to guarantee hardware security, academia has proposed the concept of trusted integrated circuits, which aims at a secure circulation of IC design, manufacture and chip using. This paper reviews the main problems of trusted integrated circuits, and concludes four key domains of the trusted IC, namely the trusted IC design, trusted manufacture, trusted IP protection, and trusted chip authentication. The main challenges in those domains are also analyzed based on the current known techniques. Finally, the main limitations of the current techniques and possible future trends are discussed. 相似文献