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71.
72.
This article reviews the application of a coupled squeeze flow and intermolecular diffusion model, which was used to predict the quality and size of microwelds in plastics. Weld widths predictions were compared with previously presented experimental results using moving heat source models and temperature fields. The motivation for this work was to develop and verify a model based on fundamental principles that could accurately predict weld size and strength for conventional plastic welding techniques as well as novel techniques such as laser microwelding. It is envisioned that the resulting model could be used to predict proper welding parameters, including laser power and travel speed, to produce welds of varying size. Although insight into weld quality can be derived from this model, it was not the goal of this work to accurately predict weld strength for laser microwelding because of the difficulty in measuring weld strength on the micron scale. However, as reported in Part 1, weld strength for impulse welds were accurately predicted. In this model it was found that variable temperature histories, rather than a single value of maximum weld temperature, allows more accurate modeling of the welding process. In this work (Part 2), microwelds as small as 11 μm in width were produced with transmission infrared welding. In addition, welds over 150‐μm wide were also generated and the model was able to predict the range of weld widths that were found experimentally. It was found that the predictions were in very good agreement with the experimental results. There was some deviation between the experimental data and the model at the extreme parameters and it is believed that this was due to the temperature‐dependent material properties as well as optical aberrations. POLYM. ENG. SCI., 2008. © 2008 Society of Plastics Engineers  相似文献   
73.
This study develops a mathematical model for coupled heat and mass transfer in an unsaturated porous slab exposed to a flowing hot gas. Effects of the initial saturation conditions on associated variables, i.e., total pressure, temperature, moisture content, and multiphase flow, are studied. The Newton-Raphson method based on a finite volume technique is applied. This study emphasizes the influence of initial saturation level and gravitational effect in heat and multiphase flow phenomena associated with this system. Gravity enhances the downward flow of liquid within the porous slab. Pressure buildup occurs near the interface between the wet and the dry zone. However, it appears that the order of magnitude to the total pressure is small. This study explains the fundamental mechanism of multiphase flow that involves heat and mass transfer in a heated unsaturated porous slab.  相似文献   
74.
75.
The ennoblement of corrosion potential (Ecorr) of passive metal immersed in seawater was investigated with electrochemical technology and epifluorescence microscopy. The in situ observation showed that the bacteria number increased on the metal surface according to an exponential law which was in the same way with the ennoblement of Ecorr. At the same time, the anodic polarization current of high‐Mo stainless steel decreased in the initial days. According to the mix‐potential theory and the characteristics of polarization curves of high‐Mo steel in natural seawater, the ennoblement of corrosion potential may be induced by the decrease of the passive current density.  相似文献   
76.
Industry widely uses rotary valves and blow tanks for the pneumatic conveying of products, each having their pros and cons depending on the specific application. This article shows the differing results obtained when low-velocity conveying a product through a common pipeline using both a drop-through rotary valve and a bottom-discharge blow tank feeder. A number of issues arise in the rotary valve system, the main one being rotary valve air leakage. A blow tank system, on the other hand, does not leak, as it is an enclosed system. The experimental results show dramatic differences in product throughput. Further exploration leads to a novel modification being made to the rotary valve system in an attempt to increase its capacity. The result of this modification shows a slight increase in output tonnage, but still significantly less than that obtained from the blow tank.  相似文献   
77.
Exposed pad packages were introduced in the late 1980s and early 1990s because of their excellent thermal and electrical performance. Despite these advantages, the exposed pad packages experience a lot of thermo-hygro-mechanical related reliability problems during qualification and testing. Examples are die lift, which occurs predominantly after moisture sensitivity level conditions, and die-attach to leadframe delamination leading to downbond stitch breaks during temperature cycling. In this chapter, nonlinear finite element (FE) models using fracture mechanics based J-integral calculations are used to assess the reliability problems of the exposed pad package family. Using the parametric FE models any geometrical and material effects can be explored to their impact on the occurrence diepad delamination, and dielift. For instance the impact of diepad size is found to be of much less importance as the impact of die thickness is. Using the fracture mechanics approach, the starting location for the delamination from thermo-hygro-mechanical point of view is deducted. The results indicate that when diepad delamination is present, cracks are likely to grow beneath the die and dielift will occur. The interaction between dielift and other failure modes, such as lifted ball bonds, are not found to be very significant. The FE models are combined with simulation-based optimization methods to deduct design guidelines for optimal reliability of the exposed pad family.  相似文献   
78.
A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.  相似文献   
79.
The following letter presents a study regarding GaN-based light-emitting diodes (LEDs) with p-type AlGaN electron blocking layers (EBLs) of different thicknesses. The study revealed that the LEDs could endure higher electrostatic discharge (ESD) levels as the thickness of the AlGaN EBL increased. The observed improvement in the ESD endurance ability could be attributed to the fact that the thickened p-AlGaN EBL may partly fill the dislocation-related pits that occur on the surface of the InGaN-GaN multiple-quantum well (MQW) and that are due to the strain and the low-temperature-growth process. If these dislocation-related pits are not partly suppressed, they will eventually result in numerous surface pits associated with threading dislocations that intersect the InGaN-GaN (MQW), thereby reducing the ESD endurance ability. The results of the experiment show that the ESD endurance voltages could increase from 1500 to 6000 V when the thickness of the p-AlGaN EBL in the GaN LEDs is increased from 32.5 to 130 nm, while the forward voltages and light output powers remained almost the same.  相似文献   
80.
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