Microstructural evolution of YSZ electrolyte aerosol-deposited on porous NiO-YSZ

Dense, crack-free, ～7.5 μm thick, 8 mol% yttria stabilized zirconia (YSZ) film was aerosol deposited on porous NiO-YSZ anode substrates at room temperature without additional high-temperature sintering. The films’ microstructures and gas permeability were observed after annealing at various temperatures. The dense, gas-tight film that was observed up to 1000 °C became porous at higher temperatures probably due to structural instability related to oxygen non-stoichiometry. A cell using such film as electrolyte showed an open cell voltage of 1.10 V and a maximum power density of 0.51 W/cm² at 750 °C.     

Interfacial Structure of Ordered Domains in Barium Lanthanum Magnesium Niobate

Microstructural studies on the interfacial boundaries of 1:1 and 1:2 ordered domains in (Ba_0.9La_0.1)(Mg_0.37Nb_0.63)O₃ were conducted using high-resolution transmission electron microscopy and X-ray diffractometry. Both 1:2 and 1:1 ordered domains coexisted in a fully ordered single grain. Each ordered domain occupied its own region, and the interfaces were atomically sharp and coherent. The wavelength of the superlattice modulation was ∼0.47 nm in the 1:1 ordered domain and ∼0.71 nm in the 1:2 ordered domain. The transition from the 1:2 ordered region to the 1:1 ordered region was clearly shown at the interface. These observations well support the structural models that have been previously presented.     

Supersonic Nozzle Flow Simulations for Particle Coating Applications: Effects of Shockwaves,Nozzle Geometry,Ambient Pressure,and Substrate Location upon Flow Characteristics

Characteristics of supersonic flow are examined with specific regard to nano-particle thin-film coating. Effects of shockwaves, nozzle geometry, chamber pressure, and substrate location were studied computationally. Shockwaves are minimized to reduce fluctuations in flow properties at the discontinuities across diamond shock structures. Nozzle geometry was adjusted to ensure optimal expansion (i.e., P _exit = P _ambient), where shock formation was significantly reduced and flow kinetic energy maximized. When the ambient pressure was reduced from 1 to 0.01316 bar, the nozzle’s diverging angle must be increased to yield the optimum condition of minimized adversed effects. Beyond some critical distance, substrate location did not seem to be a sensitive parameter on flow characteristics when P _amb = 0.01316 bar; however, overly close proximity to the nozzle exit caused flow disturbances inside the nozzle, thereby adversely affecting coating gas flow.     

LiNi<Subscript>0.4</Subscript>Co<Subscript>0.3</Subscript>Mn<Subscript>0.3</Subscript>O<Subscript>2</Subscript> thin film electrode by aerosol deposition

LiNi_0.4Co_0.3Mn_0.3O₂ thin film electrodes are fabricated from LiNi_0.4Co_0.3Mn_0.3O₂ raw powder at room temperature without pretreatments using aerosol deposition that is much faster and easier than conventional methods such as vaporization, pulsed laser deposition, and sputtering. The LiNi_0.4Co_0.3Mn_0.3O₂ thin film is composed of fine grains maintaining the crystal structure of the LiNi_0.4Co_0.3Mn_0.3O₂ raw powder. In the cyclic voltammogram, the LiNi_0.4Co_0.3Mn_0.3O₂ thin film electrode shows a 3.9-V anodic peak and a 3.6-V cathodic peak. The initial discharge capacity is 44.6 μAh/cm², and reversible behavior is observed in charge-discharge profiles. Based on the results, the aerosol deposition method is believed to be a potential candidate for the fabrication of thin film electrodes.     

Physicochemical,microbial, and sensory evaluation of cook-chilled Korean traditional rice cake (<Emphasis Type="Italic">Backseolgi</Emphasis>) during storage via various packaging methods

Backseolgi is a Korean traditional rice cake, which is prepared by steaming the rice flour. After cook-chilling processing, backseolgi samples packaged by a modified atmosphere package (MAP), top sealing package (TSP), and linear low density-polyethylene package (LDPA; control) were evaluated in regard to microbial safety and sensory characteristics during storage. During storage at 30°C, the cell numbers of aerobic, psychrophilic, and anaerobic bacteria for the MAP sample increased to below 2 log CFU/g for 10 days, whereas the control and TSP samples increased more than 5.0 log CFU/g after 4 days. After 50 days of storage at 3°C, the cell numbers in the MAP sample were below 1.0 log CFU/g, whereas they were approximately 3.0 log CFU/g in the control and TSP samples. In the case of the sensory evaluation, the MAP sample score was above 5.0, whereas the scores of the CON and TSP samples were 1.0. As a result, MAP was identified as the most effective packaging method for increasing microbial safety while maintaining the sensory characteristics of the cook-chilled backseolgi.     

Effects of Anisotropic Conductive Film Viscosity on ACF Fillet Formation and Chip-On-Board Packages

In this paper, the effects of anisotropic conductive film (ACF) viscosity on ACF fillet formation and, ultimately, on the pressure cooker test (PCT) reliability of ACF flip chip assemblies were investigated. The ACF viscosity was controlled by varying the molecular weight of the epoxy materials. It was found that the ACF viscosity increased as the increase of molecular weight of the epoxy materials. However, there was little variation of the thermomechanical properties among the evaluated ACFs with different viscosites. Also, the results showed that the ACFs have no differences in moisture absorption rate, die adhesion strength, and degree-of-cure. In scanning electron microscopy images, the lower ACF viscosity resulted in the smoother ACF fillet shape and the higher fillet height. From the results of PCT, the ACF flip chip assembly with the smoother fillet shape showed better reliability in terms of contact resistance changes. After 130 h of PCT, the flip chip assembly with lower ACF viscosity also showed a lesser degree of delamination at the ACF/chip interface.     

Epoxy/BaTiO/sub 3/ composite films and pastes for high dielectric constant and low-tolerance embedded capacitors fabrication in organic substrates

Epoxy/BaTiO/sub 3/ composite embedded capacitor films (ECFs) were newly designed for high dielectric constant and low-tolerance (less than /spl plusmn/5%) embedded capacitor fabrication for organic substrates. In terms of material formulation, ECFs are composed of a specially formulated epoxy resin and latent curing agent, and in terms of a coating process, a comma roll coating method is used for uniform film thickness in large area. The dielectric constant of ECF in high frequency range (0.5/spl sim/3 GHz) is measured using the cavity resonance method. In order to estimate dielectric constant, the reflection coefficient is measured with a network analyzer. The dielectric constant is calculated by observing the frequencies of the resonant cavity modes. Calculated dielectric constants in this frequency range are about 3/4 of the dielectric constants at 1 MHz. This difference is due to the decrease of the dielectric constant of the epoxy matrix. The dielectric relaxation of barium titanate (BaTiO/sub 3/: BT) powder is not observed within measured frequency. An alternative material for embedded capacitor fabrication is epoxy/BaTiO/sub 3/ composite embedded capacitor paste (ECP). It uses similar materials formulation like ECF and a screen printing method for film coating. The screen printing method has the advantage of forming a capacitor partially in the desired part. However, the screen printing makes surface irregularities during mask peel-off. Surface flatness is significantly improved by adding some additives and by applying pressure during curing. As a result, a dielectric layer with improved thickness uniformity is successfully demonstrated. Using epoxy/BaTiO/sub 3/ composite ECP, a dielectric constant of 63 and specific capacitance of 5.1 nF/cm/sup 2/ were achieved.     

Simultaneous removal of organic and strong nitrogen from sewage in a pilot-scale BNR process supplemented with food waste.

As the sewerage system is incomplete, sewage in Korea lacks easily biodegradable organics for nutrient removal. In this country, about 11,400 tons of food waste of high organic materials is produced daily. Therefore, the potential of food waste as an external carbon source was examined in a pilot-scale BNR (biological nutrient removal) process for a half year. It was found that as the supply of the external carbon increased, the average removal efficiencies of T-N (total nitrogen) and T-P (total phosphorus) increased from 53% and 55% to 97% and 93%, respectively. VFAs (volatile fatty acids) concentration of the external carbon source strongly affected denitrification efficiency and EBPR (enhanced biological phosphorus removal) activity. Biological phosphorus removal was increased to 93% when T-N removal efficiency increased from 78% to 97%. In this study, several kinds of PHAs (poly-hydroxyalkanoates) in cells were observed. The observed PHAs was composed of 37% 3HB (poly-3-hydroxybutyrate), 47% 3HV (poly-3-hydroxyvalerate), 9% 3HH (poly-3-hydroxyhexanoate), 5% 3HO (poly-3-hydroxyoctanoate), and 2% 3HD (poly-3-hydroxydecanoate).     

Formation of Pb/63Sn solder bumps using a solder droplet jetting method

Formation processes of Pb/63Sn solder droplets using a solder droplet jetting have not been sufficiently reported. Solving problems such as satellite droplets and position errors are very important for a uniform bump size and reliable flip-chip solder bump formation process. First, this paper presents the optimization of jet conditions of Pb/63Sn solder droplets and the formation process of Pb/63Sn solder bumps using a solder droplet jetting method. Second, interfacial reactions and mechanical strength of jetted Pb/63Sn solder bumps and electroless Ni-P/Au UBM joints have been investigated. Interfacial reactions have been investigated after the second solder reflow and aging, and results were compared with those of solder bumps formed by a solder screen-printing method. Third, jetted solder bumps with variable bump sizes have been demonstrated by a multiple jetting method and the control of waveform induced to a jet nozzle. Multiple droplets jetting method can control various height and size of solder bumps. Finally, real applications of jetted Pb/63Sn solder bumps have been successfully demonstrated on conventional DRAM chips and integrated passive devices (IPDs).