Effect of various processing methods on the interfacial reactions in SiCp/2024 Al composites

SiC_p/2024 Al composites were prepared using various processing techniques, such as spray forming, powder metallurgical hot pressing, thixoforming, and compocasting. The interfacial characterizations of these composites were performed using scanning electron microscopy, Auger electron spectrometry, transmission electron microscopy, and X-ray diffraction on reaction products extracted using the electrochemical dissolution. The value of these combined techniques in elucidating the morphologies of the interfacial reaction products was also demonstrated. The influence that each fabrication process has on the extent of the interfacial reaction was studied. Adequate process parameters to fabricate SiC_p/Al alloy composites were proposed based on thermodynamic considerations.     

Improving inter-destination synchronization in hierarchical reliable multicast

In hierarchical reliable multicast schemes, the number of repair proxies and their locations influence inter-destination synchronization. The inter-destination synchronization in multicast environments means the adjustment of the output timing among destinations over the Internet. Improving the inter-destination synchronization is beneficial to collaborative applications such as multi-conference system and multi-playing online game. In this paper, we propose a scheme to find the optimal locations of repair proxies that can improve inter-destination synchronization maximally in heterogeneous network environments. The simulation results show that if repair proxies are placed by the proposed scheme, delivery delay fairness of inter-destination can be improved by 0.05 maximally. In addition, we perform t-Test on the simulation results in order to verify that our optimal placement improves synchronization.     

Free surface transition and momentum augmentation of liquid flow in Micro/Nano-scale channels with hydrophobic and hydrophilic surfaces

We propose a novel micro/nano-scale nozzle structure, featuring an interfacial line between the hydrophilic and the hydrophobic surfaces for a jetting system, such as an inkjet head or electrospray devices. This research will investigate the impact of the interfacial line on flow instability and momentum augmentation as the liquid meniscus moves across the line. The research methods used in this paper, in respect to micro-and nano-scale channels, are computational fluid dynamics (CFD) and non-equilibrium molecular dynamics (MD), respectively. With the growing interest in micro/nano electromechanical systems (MEMS/NEMS), many studies have been conducted to develop an advanced micro/nanofluidic system. However, until now, there have been few in-depth studies on passive flow control in micro and nano nozzles using the hydrophilic and hydrophobic surface characteristics. In this research, the sequential arrangement of hydrophilic and hydrophobic surfaces in the nozzle is presented along with an investigation into how flow instability and momentum augmentation are going to be applied to an efficient micro/nano jetting system. When a liquid meniscus arrives at the interfacial line between hydrophilic and hydrophobic surfaces, the meniscus shape changes from concave to convex and the fluid motion near the wall stops until the concave shape is fully converted. Because the momentum should be conserved, the lost momentum near the wall transfers to the center region, and therefore the liquid at the center region is accelerated as it crosses the line. If we use this nozzle structure and the augmentation of the momentum near the center, a tiny droplet can be easily generated. This paper was recommended for publication in revised form by Associate Editor Haecheon Choi Doyoung Byun received the B.S., M.S, and Ph.D. degrees in school of mechanical and aerospace engineering from the Korea Advanced Institute of Science and Technology (KAIST), Taejon, Korea, in 1994, 1996, and 2000, respectively. From 2000 to 2002, he was in the Korea Institute of Science and Technology Evaluation and Planning as a Senior Researcher. In 2003, he joined the faculty of the School of Mechanical and Aerospace Engineering, Konkuk University, Seoul, Korea. His current research topics are development of electrohydrodynamic inkjet head, microfluidic devices, and biomimetic robot systems. His research interests include microfluidics, MEMS, and biomimetics.     

On pattern classification of EMG signals for walking motions

We present a method to calssify electromyogram (EMG) signals which are utilized as control signals for a patient-responsive walker-supported system for paraplegics. Patterns of EMG signals for different walking motions are classified via adequate filtering, real EMG signal extraction, AR-modeling, and a modified self-organizing feature map (MSOFM). In particular, a data-reducing extraction algorithm is employed for real EMG signals. Moreover, MSOFM classifies and determines the results automatically using a fixed map. Finally, the experimental results are presented for validation.     

Surface‐treatment effects of a sapphire substrate by He+‐, Ar+‐, and Xe+‐ion implantations for GaN epitaxial layers

Abstract— The structural, electrical, and optical properties of GaN epilayers grown on various ion‐implanted sapphire(0001) substrates by MOCVD were investigated. GaN or AlN buffer layers and pre‐treatment were indispensably introduced before GaN‐epilayer growth. The ion‐implanted substrate's surface had decreased internal free energies during the growth of the ion‐implanted sapphire(0001) substrates. The crystal and optical properties of the GaN epilayers grown in ion‐implanted sapphire(0001) substrates were improved. Also, an excessively roughened and modified surface caused by ions degraded the GaN epilayers. Not only the ionic radius but also the chemical species of implanted sapphire(0001) substrates improved the properties of the GaN epilayers grown by MOCVD. It is obvious that the ion‐implanted pre‐treatment of sapphire(0001) substrates can be an alternative pre‐treatment procedure for GaN deposition and has the potential to improve the properties of the GaN epilayers on sapphire(0001) substrates.     

Voltage‐Mode 1.5 Gbps Interface Circuits for Chip‐to‐Chip Communication

In this paper, interface circuits that are suitable for point‐to‐point interconnection with an over 1 Gbps data rate per pin are proposed. To achieve a successful data transfer rate of multi‐gigabits per‐second between two chips with a point‐to‐point interconnection, the input receiver uses an on‐chip parallel terminator of the pass gate style, while the output driver uses the pullup and pulldown transistors of the diode‐connected style. In addition, the novel dynamic voltage level converter (DVLC) has solved such problems as the access time increase and valid data window reduction. These schemes were adopted on a 64 Mb DDR SRAM with a 1.5 Gbps data rate per pin and fabricated using a 0.10 µm dual gate oxide CMOS technology.     

Board-level reliability of Pb-free solder joints of TSOP and various CSPs

To evaluate various Pb-free solder systems for leaded package, thin small outline packages (TSOPs) and chip scale packages (CSPs) including leadframe CSP (LFCSP), fine pitch BGA (FBGA), and wafer level CSP (WLCSP) were characterized in terms of board level and mechanical solder joint reliability. For board level solder joint reliability test of TSOPs, daisy chain samples having pure-Sn were prepared and placed on daisy chain printed circuit board (PCB) with Pb-free solder pastes. For CSPs, the same composition of Pb-free solder balls and solder pastes were used for assembly of daisy chain PCB. The samples were subjected to temperature cycle (T/C) tests (-65/spl deg/C/spl sim/150/spl deg/C, -55/spl deg/C/spl sim/125/spl deg/C, 2 cycles/h). Solder joint lifetime was electrically monitored by resistance measurement and the metallurgical characteristics of solder joint were analyzed by microstructural observation on a cross-section sample. In addition, mechanical tests including shock test, variable frequency vibration test, and four point twisting test were carried out with daisy chain packages too. In order to compare the effect of Pb-free solders with those of Sn-Pb solder, Sn-Pb solder balls and solder paste were included. According to this paper, most Pb-free solder systems were compatible with the conventional Sn-Pb solder with respect to board level and mechanical solder joint reliability. For application of Pb-free solder to WLCSP, Cu diffusion barrier layer is required to block the excessive Cu diffusion, which induced Cu trace failure.     

40 GHz Vertical Transition with a Dual‐Mode Cavity for a Low‐Temperature Co‐fired Ceramic Transceiver Module

A new vertical transition between a substrate integrated waveguide in a low‐temperature co‐fired ceramic substrate and an air‐filled standard waveguide is proposed in this paper. A rectangular cavity resonator with closely spaced metallic vias is designed to connect the substrate integrated waveguide to the standard air‐filled waveguide. Physical characteristics of an air‐filled WR‐22 to WR‐22 transition are compared with those of the proposed transition. Simulation and experiment demonstrate that the proposed transition shows a ?1.3 dB insertion loss and 6.2 GHz bandwidth with a 10 dB return loss for the back‐to‐back module. A 40 GHz low‐temperature co‐fired ceramic module with the proposed vertical transition is also implemented. The implemented module is very compact, measuring 57 mm × 28 mm × 3.3 mm.     

Functional foods with antiviral activity

Food Science and Biotechnology - Viruses are known to cause a variety of diseases, ranging from mild respiratory diseases, such as the common cold, to fatal illnesses. Although the development of...     

Refrigerant Distribution in a Minichannel Evaporator Having Vertical Headers

Refrigerant R-410a flow distribution is experimentally studied in a test section simulating a minichannel heat exchanger having vertical headers with two pass configuration. Tubes are heated to yield a test section outlet superheat of 5°C with inlet quality of 0.3. Mass flux is varied from 60 kg/m²-s to 70 kg/m²-s. Effects of outlet locations are investigated in a search for an optimum configuration. The effect of varying the number of tubes of each pass is also investigated. Results show that significant liquid flows through bottom channels, and less liquid is supplied to top channels. For the outlet location, a bottom outlet is better than a middle or top outlet. In addition, assigning a lower number of tubes to inlet pass yields better flow distribution. Correlations are developed for the fraction of liquid or gas taken off by the downstream channel as a function of header gas Reynolds number immediately upstream. The correlations may be used to predict the liquid or gas distribution in a parallel-flow heat exchanger havin vertical headers.