Nuclear-cytoplasmic incompatibility and inefficient development of pig-mouse cytoplasmic hybrid embryos

Inter-species somatic cell nuclear transfer (iSCNT) embryos usually fail to develop to the blastocyst stage and beyond due to incomplete reprogramming of donor cell. We evaluated whether using a karyoplast that would require less extensive reprogramming such as an embryonic blastomere or the meiotic spindle from metaphase II oocytes would provide additional insight into the development of iSCNT embryos. Our results showed that karyoplasts of embryonic or oocyte origin are no different from somatic cells; all iSCNT embryos, irrespective of karyoplast origin, were arrested during early development. We hypothesized that nuclear-cytoplasmic incompatibility could be another reason for failure of embryonic development from iSCNT. We used pig-mouse cytoplasmic hybrids as a model to address nuclear-cytoplasmic incompatibility in iSCNT embryos. Fertilized murine zygotes were reconstructed by fusing with porcine cytoplasts of varying cytoplasmic volumes (1/10 (small) and 1/5 (large) total volume of mouse zygote). The presence of pig cytoplasm significantly reduced the development of mouse zygotes to the blastocyst stage compared with control embryos at 120?h post-human chorionic gondotropin (41 vs 6 vs 94%, P<0.05; 1/10, 1/5, control respectively). While mitochondrial DNA copy numbers remained relatively unchanged, expression of several important genes namely Tfam, Polg, Polg2, Mfn2, Slc2a3 (Glut3), Slc2a1 (Glut1), Bcl2, Hspb1, Pou5f1 (Oct4), Nanog, Cdx2, Gata3, Tcfap2c, mt-Cox1 and mt-Cox2 was significantly reduced in cytoplasmic hybrids compared with control embryos. These results demonstrate that the presence of even a small amount of porcine cytoplasm is detrimental to murine embryo development and suggest that a range of factors are likely to contribute to the failure of inter-species nuclear transfer embryos.     

Active wafer shape modulation using a multi-actuator chucking system

Jet and Flash Imprint Lithography has proven to be a viable alternative to optical lithography for fabrication of sub 30 nm nanostructures for large volume semiconductor manufacturing. Machine throughput, overlay and process defectivity that meet and exceed the International Technology Roadmap for Semiconductors (ITRS) are essential for commercial viability of any new lithography technology. Jet and Flash Imprint Lithography uses an inkjet head to dispense a grid of liquid drops on the wafer surface to match the volume requirements of the pattern being imprinted. Wafer shape modulation has been shown to increase imprinting speed significantly by reducing air bubble trapping in the drop interstitial sites. A wafer shape modulation chuck that can address arbitrary field locations and sizes on a wafer with a novel actuation scheme that minimizes the number of actuators while increasing imprinting speed and reducing process defects significantly is presented.     

Reliability estimation of washing machine spider assembly via classification

This paper presents a study on the reliability estimation of the spider assembly of the front loading washing machine. To achieve the analytical certification of the current design of the spider assembly of the washing machine, fatigue life test, finite element analysis, physical experimentation, and a classification processes were conducted. First, the conventional finite element analysis and fatigue life analysis were conducted and their simulation results have been validated by physical experiments in this research. The probability of failure is estimated by a classification process. Specifically, the probabilistic neural network classifier is incorporated into the simulation process to reduce the number of finite element analysis calculations while ensuring the prediction accuracy of the failure probability. Based on the estimated failure probability and other structural analysis results, the margin of the performance of the spider assembly is fully identified.     

An efficient one-step lookahead A* algorithm for PM-CT scheduling problems

In this paper, we present an improved one-step lookahead A* algorithm for the scheduling problem for parallel-mode cluster tools, where n wafer types are simultaneously processed on a cluster tool with m chambers. Specifically, we suggest a refined cost function, priority-based node selection, N-chamber cycle detection to identify deadlock situations, and a one-step lookahead method to reduce the number of unsafe states generated. Using numerical experiments, we show that the proposed algorithm leads to a significant reduction in the number of explored states and execution time necessary to find an optimal solution.     

Multifunctional Ru-AlN heating resistor films for high efficiency inkjet printhead

Ru-AlN thin films were suggested as a novel multifunctional heating resistor film for non-passivated type thermal inkjet printer devices. Ru-AlN thin films were prepared by plasma-enhanced atomic layer deposition in order to intermix Ru and AlN precisely. When the Ru intermixing ratios were optimized, Ru-AlN films showed a favorable electrical resistivity (from 490.9 to 75.3 μΩcm) and minimized temperature coefficient of resistance (TCR) values (from 335 to 360 ppm/K). Moreover, the Ru-AlN films showed a strong oxidation resistant as compared with commercially used TaN_0.8 films because the prepared Ru-AlN thin films had a typical nanocomposite structure. By applying electrical pulses to the heater device using Ru-AlN thin films for a Joule heating, a reliable operation was also proven.