首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   2875篇
  免费   58篇
  国内免费   4篇
电工技术   67篇
综合类   8篇
化学工业   588篇
金属工艺   75篇
机械仪表   44篇
建筑科学   139篇
矿业工程   13篇
能源动力   36篇
轻工业   307篇
水利工程   11篇
石油天然气   7篇
无线电   216篇
一般工业技术   365篇
冶金工业   783篇
原子能技术   18篇
自动化技术   260篇
  2020年   27篇
  2019年   30篇
  2018年   29篇
  2016年   48篇
  2015年   40篇
  2014年   37篇
  2013年   134篇
  2012年   63篇
  2011年   94篇
  2010年   67篇
  2009年   80篇
  2008年   82篇
  2007年   85篇
  2006年   89篇
  2005年   84篇
  2004年   70篇
  2003年   71篇
  2002年   68篇
  2001年   42篇
  2000年   46篇
  1999年   56篇
  1998年   75篇
  1997年   74篇
  1996年   57篇
  1995年   43篇
  1994年   53篇
  1993年   59篇
  1992年   46篇
  1991年   41篇
  1990年   37篇
  1989年   51篇
  1988年   42篇
  1987年   32篇
  1986年   31篇
  1985年   44篇
  1984年   56篇
  1983年   53篇
  1982年   39篇
  1981年   38篇
  1980年   41篇
  1979年   35篇
  1978年   43篇
  1977年   41篇
  1976年   54篇
  1975年   35篇
  1974年   31篇
  1973年   27篇
  1972年   35篇
  1971年   30篇
  1966年   28篇
排序方式: 共有2937条查询结果,搜索用时 9 毫秒
21.
Due to the requirements of new light, mobile, small and multifunctional electronic products the density of electronic packages continues to increase. Especially in medical electronics like pace makers the minimisation of the whole product size is an important factor. So flip chip technology becomes more and more attractive to reduce the height of an electronic package. At the same time the use of flexible and foldable substrates offers the possibility to create complex electronic devices with a very high density. In terms of human health the reliability of electronic products in medical applications has top priority.In this work flip chip interconnections to a flexible substrate are studied with regard to long time reliability. Test chips and substrates have been designed to give the possibility for electrical measurements. Solder was applied using conventional stencil printing method. The flip chip contacts on flexible substrates were created in a reflow process and underfilled subsequently.The assemblies have been tested according to JEDEC level 3. The focus in this paper is the long time reliability up to 10,000 h in thermal ageing at 125 °C and temperature/humidity testing at 85 °C/85% relative humidity as well as thermal cycling (0 °C/+100 °C) up to 5000 cycles. Daisy chain and four point Kelvin resistances have been measured to characterise the interconnections and monitor degradation effects.The failures have been analysed in terms of metallurgical investigations of formation and growing of intermetallic phases between underbump metallisation, solder bumps and conductor lines. CSAM was used to detect delaminations at the interfaces underfiller/chip and underfiller/substrate respectively.  相似文献   
22.
Glutenin was prepared from gluten of the wheat variety Rektor by extraction of gliadin with aqueous ethanol. It was cleaved successively into soluble peptides by the enzymes trypsin and thermolysin. Separation of the peptide mixtures was performed by gel permeation chromatography (GPC) on Sephadex G25 and reversed phase high performance liquid chromatography (RP-HPLC) on ODS-Hypersil. Cystine peptides were detected by differential chromatography of the samples prior to and after reduction. After isolation by multi-step RP-HPLC, the cystine peptides were reduced. The resulting cysteine peptides were alkylated with 4-vinylpyridine, separated by RP-HPLC and sequenced by means of the Edman degradation. The isolated cystine peptides represented a considerable portion of the total cysteine in glutenin: four out of seven cysteine residues of HMW subunits, and eight out of nine cysteine residues of LMW subunits are documented by at least one cystine peptide. Most of the peptides corresponded to known sequences of gluten protein components. From the structures of some tryptic peptides, inter- and intramolecular disulphide bonds for HMW subunits of glutenin have been proven. Cystine peptides from the thermolytic digest have been assigned to LMW subunits of glutenin and toγ-gliadins. Other peptides have been closely related to partial sequences of these protein components. The results have allowed several conclusions about the arrangement of intra- and intermolecular disulphide bridges in gluten proteins.  相似文献   
23.
The Soxtec System and the AOCS method were compared for oil determination in soybeans, and no significant difference was found between the two methods. The Root Mean Square Error (RMSE) and standard deviation for individual samples were higher for the Soxtec, but this was attributable to the regrinding step used. The study suggests that the Soxtec System is faster and just as accurate as the AOCS method.  相似文献   
24.
25.
Temperature profiles in the source/drain (S/D) opening of a single finger AlGaN-GaN heterostructure field-effect transistor were studied at increasing S/D voltages by micro-Raman spectroscopy with <1 /spl mu/m spatial resolution. These profiles imply high field regions near the gate edge of length /spl sim/0.4 /spl mu/m for S/D voltages between 45 and 75 V. Electric field strengths of /spl sim/1.2 and /spl sim/1.9 MV/cm are estimated for 45 and 75 V S/D voltage. The experimental results are in excellent agreement with 2-D Monte Carlo simulations.  相似文献   
26.
Sallen-Key实现的5.25MHz三极点巴特沃兹滤波器具有2V/V的增益,并能以总增益为1驱动75Ω反接同轴电缆(图1)。这种用来重建视频分量(Y,P_b,P_r)和RGB信号的滤波器,其插入损耗在13.5MHz时大于20dB,在27MHz时大于40dB(图2)。与  相似文献   
27.
采用交流耦合视频信号时必须恢复直流电压,以确保信号位于下级电路的线性区域内。这项工作称为偏置,对于不同的视频信号需使用不同的电路,要求偏置点准确和稳定。对于正弦波信号,用阻容(R-C)耦合即可建立一个稳定的偏置电压。不幸的是,只有S视频端子的色度信号(C)类似  相似文献   
28.
Short-time Fourier transform (STFT), Gabor transform (GT), wavelet transform (WT), and the Wigner-Ville distribution (WVD) are just some examples of time-frequency analysis methods which are frequently applied in biomedical signal analysis. However, all of these methods have their individual drawbacks. The STFT, GT, and WT have a time-frequency resolution that is determined by algorithm parameters and the WVD is contaminated by cross terms. In 1993, Mallat and Zhang introduced the matching pursuit (MP) algorithm that decomposes a signal into a sum of atoms and uses a cross-term free pseudo-WVD to generate a data-adaptive power distribution in the time-frequency space. Thus, it solved some of the problems of the GT and WT but lacks phase information that is crucial e.g., for synchronization analysis. We introduce a new time-frequency analysis method that combines the MP with a pseudo-GT. Therefore, the signal is decomposed into a set of Gabor atoms. Afterward, each atom is analyzed with a Gabor analysis, where the time-domain gaussian window of the analysis matches that of the specific atom envelope. A superposition of the single time-frequency planes gives the final result. This is the first time that a complete analysis of the complex time-frequency plane can be performed in a fully data-adaptive and frequency-selective manner. We demonstrate the capabilities of our approach on a simulation and on real-life magnetoencephalogram data.  相似文献   
29.
There is much to be gained from an integration of sensory evaluation and market research to provide a full understanding of the overall evaluation and acceptance of food. This can be achieved if research paradigms and practical applications are broadened to address key issues: the choice of appropriate research subjects, the use of realistic foods and of more complex and realistic environments, the appropriate selection of sensory methods, and the consideration of contextual influences. Improved research paradigms will contribute to our theories of how human eating is controlled and, hence, to the use of this information in product development and biomedical applications.  相似文献   
30.
Up to now, C–V profiling through isotype heterojunctions has been performed assuming a uniform dielectric permittivity throughout the heterostructure. We extend the interpretation of C–V data to the case of a semiconductor with position-dependent dielectric permittivity, and we show that the variation of the dielectric permittivity across an isotype heterojunction interface has no effect on the determination of the heterojunction band discontinuity and the interface charge density.  相似文献   
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号