利用信息融合方法的三维特征提取

本文提出了一种基于信息融合的物体三维特征的提取方法，该方法利用两幅互相配准的三维测距图像和灰度图像，来提取多面体的三维特征。首先，通过分析灰度图像中的灰度变化及测距图像中的测距值变化，分别求取各自图像中物体的特征点及特征边；然后，利用两配准图像之间的对应关系，求得所有特征点、面与多边形在三维测距图像中的三维表示；接着，通过分析三维测距图像中所测得的各候选平面上特定点与边处的曲率及法向，验证候选平面     

R&D activities on wireless systems in China

Various wireless systems and the research preceding their practical use in China are described. The topics discussed include research establishments, research and development projects underway, challenges inherent to digital radio, and expansion opportunities afforded by satellite communications     

Internet网的服务方式与入网方式一览

目前，世界上最大的计算机网络Ｉｎｔｅｒｎｅｔ网，已成为通达１５０多个国家的国际互联网络。作为引导中国计算机用户进入Ｉｎｔｅｒｎｅｔ的中国公用计算机互联网ＣＨＩＮＡＮＥＴ也正迅速发展。本文就Ｉｎｔｅｒｎｅｔ网的服务方式和入网方式进行了综述。     

A new efficient method for one‐pot conversions of aryl carboxylic acids into nitriles without solvent

A new efficient method for synthesising nitriles, important organic reagents, is reported in this paper. In an environmentally benign solvent‐free system, aryl carboxylic acids were converted into the corresponding nitriles via one‐pot reactions, by amidation with ethyl carbamate followed by dehydration with thionyl chloride, in excellent yields. The results showed that the method has the advantages of lower cost, higher yield, less pollution and greater ease of work‐up. Copyright © 2008 Society of Chemical Industry     

Silicon-to-steel bonding using rapid thermal annealing

This paper presents the rapid, low-temperature bonding between silicon and steel using the rapid thermal annealing process. Three different thin-film adhesion layer systems including silver, gold, and nickel were utilized as the intermediate bonding material to assist the eutectic Pb/Sn bonding between silicon and steel. The bonding temperature was set at 220/spl deg/C for 20 s, with a 20-s ramp-up time. Five experiments were conducted to determine the strength of the bond, including static tensile and compressive four-point bend tests, axial extension tests, tensile bending fatigue tests, and corrosion resistance tests. The test results have shown that the gold adhesion layer is the most robust, demonstrating minimal creep during fatigue tests, no delamination during the tensile or compressive four-point bend tests, and acceptable strength during the axial extension tests. Additionally, all adhesion layers have withstood four months of submersion in various high-temperature solutions and lubricants without failure. Simulations of the axial stresses and strains that developed during the four-point bend and axial extension tests were performed and showed that the presence of the silicon die provides a local reinforcement of the bond as observed in the experimental tests.     

3-D MCM封装技术及其应用

介绍了超大规模集成电路（VLSI）用的3-D MCM封装技术的最新发展，重点介绍了3-D MCM封装垂直互连工艺，分析了3-D MCM封装技术的硅效率、复杂程度、热处理、互连密度、系统功率与速度等问题，并对3-D MCM封装的应用作了简要说明。     

On the SEP of Cooperative Diversity with Opportunistic Relaying

We analyze the exact symbol error probability (SEP) of cooperative diversity with opportunistic amplify-and-forward (AF) relaying. The benefit of this opportunism to the SEP is assessed by comparing with maximal ratio combining of orthogonal multiple AF relay transmissions.