Vortex chain size effect and negative resistance in pin-free superconducting films

We investigate the static and dynamic behavior of vortices in a pin-free superconductor. A diffraction pattern is observed in the critical currentJ _cvs. applied fieldH parallel to the surface of a granular Al film. When one vortex chain is formed in the film,J _cbecomes nearly equal to zero, which verifies that the sample is actually pin-free. An interaction between a radiofrequency current and moving vortices occurs, and theI–V curve shows peculiar nonlinear effects such as real negative resistance. The results are analogous to dc and ac Josephson effects.     

Multiple pulse-heating experiments with different current to determine total emissivity, heat capacity, and electrical resistivity of electrically conductive materials at high temperatures

A modified pulse-heating method is proposed to improve the accuracy of measurement of the hemispherical total emissivity, specific heat capacity, and electrical resistivity of electrically conductive materials at high temperatures. The proposed method is based on the analysis of a series of rapid resistive self-heating experiments on a sample heated at different temperature rates. The method is used to measure the three properties of the IG-110 grade of isotropic graphite at temperatures from 850 to 1800 K. The problem of the extrinsic heating-rate effect, which reduces the accuracy of the measurements, is successfully mitigated by compensating for the generally neglected experimental error associated with the electrical measurands (current and voltage). The results obtained by the proposed method can be validated by the linearity of measured quantities used in the property determinations. The results are in reasonably good agreement with previously published data, which demonstrate the suitability of the proposed method, in particular, to the resistivity and total emissivity measurements. An interesting result is the existence of a minimum in the emissivity of the isotropic graphite at around 1120 K, consistent with the electrical resistivity results.     

A single-solenoid pulsed-magnet system for single-crystal scattering studies

We present a pulsed-magnet system that enables x-ray single-crystal diffraction in addition to powder and spectroscopic studies with the magnetic field applied on or close to the scattering plane. The apparatus consists of a single large-bore solenoid, cooled by liquid nitrogen. A second independent closed-cycle cryostat is used for cooling samples near liquid helium temperatures. Pulsed magnetic fields close to ~30 T with a zero-to-peak-field rise time of ~2.9 ms are generated by discharging a 40 kJ capacitor bank into the magnet coil. The unique characteristic of this instrument is the preservation of maximum scattering angle (~23.6°) on the entrance and exit sides of the magnet bore by virtue of a novel double-funnel insert. This instrument will facilitate x-ray diffraction and spectroscopic studies that are impractical, if not impossible, to perform using split-pair and narrow-opening solenoid magnets. Furthermore, it offers a practical solution for preserving optical access in future higher-field pulsed magnets.     

The effect of adding Ni and Ge microelements on the electromigration resistance of low-Ag based SnAgCu solder

Low-Ag-based Pb-free solder and its evaluation for electromigration (EM) reliability are research areas of active development. This paper studies the effect of adding Ni and Ge microelements on the EM behavior of low-Ag-based SnAgCu solder. Comparative measurements of the EM resistance of Sn1.0Ag0.5Cu (SAC) and Sn1.0Ag0.5Cu0.07Ni0.01Ge (SACNG) solders (in wt?%) were conducted. In these experiments, SACNG showed a higher EM resistance than SAC. It was concluded that adding Ni and Ge enhanced the EM resistance of low-Ag-based SnAgCu solders. This shows the same effect of Ni and Ge on the EM resistance as that which has been reported for Sn3.5Ag0.5Cu solder. An analysis of these observations suggests that grain boundary sliding plays a dominant role in stress relaxation and causes hillock growth. Based on this assumption, a possible mechanism was proposed to explain the effects of Ni and Ge on the EM resistance of SnAgCu solder.     

Multicomponent diffusion in phase-separating polymer blends with different frictional interactions: a mean-friction model

We present a compact formula for describing the mean frictional forces acting on a molecule in multicomponent systems. The friction-based diffusion theory of Zielinski and Hanley was extended to newly include the friction-average molar velocity as a reference frame. The results showed that the previous diffusion theories are unified by the friction-average concept by properly choosing the average velocity. The present model based on the diffusivity-related molar average velocity provides better predictions for the diffusive flux in a ternary miscible liquid compared to the other existing theories. The application of the model in phase-separating ternary systems revealed that the introduction of a highly diffusive third component into demixing polymer blends promotes a particular enhancement of the spinodal decomposition due to the difference in the frictional interactions between polymers.     

SiO2 thin film deposition on the inner surface of a poly(tetra-fluoroethylene) narrow tube by atmospheric-pressure glow microplasma

SiO₂ thin films were deposited on the inner surfaces of a commercial poly(tetrafluoroethylene) narrow tube with an inner diameter of 0.5 mm using tetraethoxysilane/O₂ feedstock gases and He carrier gas by atmospheric-pressure microplasma-enhanced chemical vapor deposition. A glow microplasma was generated inside the tube by radio frequency (RF) capacitively coupled discharge. X-ray photoelectron spectroscopy spectra showed that the tube inner surface was covered by a SiO₂ thin film. Transparent SiO₂ thin films were obtained with a deposition rate of 230 nm/min at an RF power of 6 W and substrate temperature of 100 °C. The wettability of the SiO₂-coated tube was about 3 times as large as that of an untreated sample tube.     

Dominant stress region for crack initiation at interface edge of microdot on a substrate

In order to examine the mechanics of crack initiation at the free interface edge of a microcomponent on a substrate, delamination tests are carried out for two specimen shapes of Cr microdots on a SiO₂ substrate. The microdots of the first specimen are shaped like the frustum of a round cone. The Cr microdots are successfully delaminated from the SiO₂ substrate in a brittle manner and the critical load is measured by atomic force microscopy (AFM) with a lateral loading apparatus. Stress analysis reveals that a singular stress field exists near the interface edge and the strength for the crack initiation is governed by the intensified normal stress field. The critical stress intensity parameter is evaluated as K_σC ≈ 0.24 MPa m^0.39. Similar delamination tests are conducted for microdots shaped like the frustum of an oval cone. The stress distributions at the crack initiation of this specimen shape show a higher normal stress than the first specimen shape in the region near the interface edge of about x < 40 nm, while it is lower in the region of about x > 50 nm (x: distance from the edge). This suggests a limitation of conventional fracture mechanics: namely, the crack initiation in these specimens is not uniquely governed by the intensity of the singular field. It is found that the delamination crack is initiated when the averaged stress σ_ya in the region of 90-130 nm reaches 190-270 MPa, regardless of the specimen shape. This indicates that the dominant stress region of crack initiation is roughly estimated as 90-130 nm and the criterion is given in terms of the averaged stress in the region.     

Effects of neural refractoriness on spatio-temporal variability in spike initiations with Electrical stimulation.

In this paper, the effects of neural refractoriness on action potential (spike) initiations with electrical stimulation are investigated using computer modeling and simulation techniques. The computational model was composed of a myelinated nerve fiber with 50 nodes of Ranvier, each consisting of stochastic sodium and potassium channels, making it possible to represent the fluctuations of spike initiation. A series of two-pulse stimuli was presented by a stimulating electrode above the central (26th) node of Ranvier. The amplitude of the first (masker) pulse stimulus was set such that the masker pulse stimulus evoked spikes on each trial, while that of the second (probe) pulse stimulus was set such that the probe pulse stimulus evoked spikes on a half of trials, threshold values. Then the transmembrane potentials in response to the probe pulse stimulus were recorded at each node (i.e., 1-50 nodes) in order to determine the spike initiation node and time. From the observation of the spike initiation node and time, a spatio-temporal histogram as well as a spatial variability and a temporal variability of spike initiations was generated which allowed us to interpret fluctuations in spike initiation node and time. It was shown that the distribution of spike initiations tended to become greater spatially and longer temporally as the masker-probe intervals (MPIs) of the two-pulse stimuli shortened. It was also shown that the number of activated sodium channels as functions of space and time tended to become smaller due to inactivation of sodium channels and varied spatially and temporally as MPIs shortened. These findings may imply that the stochastic sodium channels during a relative refractory period may contribute to enhancing the fluctuations in spike initiations, and give us an insight into encoding information with electric stimuli to improve the performance of the prosthetic devices, especially cochlear implants.     

Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure

Shear and tensile tests were carried out on joints made with an isotropic conductive adhesive (ICA) consisting of Ag and epoxy: Sn–Pb plated components mounted on printed boards and tensile bars consisting of Sn plated Ni and Cu joined under various joining pressures. After 150 °C–100 h, shear strength degraded to 72% and Sn in the plating diffused slightly to the Ag fillers in the ICA for the component mounting. High joining pressure increased the initial tensile strength and volume percentage of Ag fillers in the ICA. After 150 °C–100 h, tensile strengths for all joining pressures degraded on average to 36% of the initial strengths. In the case of low joining pressures, an Ag–Sn intermetallic was formed at only the Ag–Sn contact points of the Sn/ICA interface; leading to reproducibility of the component mounting. The difference of degradation ratios between the mounted components and tensile bars could be explained by the offset of the Sn–Pb area at the component/ICA interface.     

Stimulus Selectivity of Figural Aftereffects for Faces.

Viewing a distorted face induces large aftereffects in the appearance of an undistorted face. The authors examined the processes underlying this adaptation by comparing how selective the aftereffects are for different dimensions of the images including size, spatial frequency content, contrast, and color. Face aftereffects had weaker selectivity for changes in the size, contrast, or color of the images and stronger selectivity for changes in contrast polarity or spatial frequency. This pattern could arise if the adaptation is contingent on the perceived similarity of the stimuli as faces. Consistent with this, changing contrast polarity or spatial frequency had larger effects on the perceived identity of a face, and aftereffects were also selective for different individual faces. These results suggest that part of the sensitivity changes underlying the adaptation may arise at visual levels closely associated with the representation of faces. (PsycINFO Database Record (c) 2010 APA, all rights reserved)