一种新型高精度高温度稳定性恒流源研究

研究一种应用混合集成电路技术实现的新型高精度和高温度稳定性的恒流源,以适应当前系统对恒流源高精度、高温度稳定性和较大电流的需求。在详细分析电路结构和工作原理的基础上,讨论如何提高电路的精度和温度稳定性,并给出具体的解决方案,对关键部分给出了设计电路图,最后对采样电阻的设计和布线艺术给出了合理的方案。投片测试分析表明:该设计安全可靠,达到高温度稳定性和高精度设计目标。该电路具有较小的体积和较好的性能,满足型号系统的要求。灵活的设计方式使其具有较好的使用价值和应用前景。     

带并联凹腔的超燃燃烧室数值研究

采用离散相模型对带并联凹腔结构的煤油超燃燃烧室进行数值模拟,分析了正对并联凹腔和交错并联凹腔对支板直接喷入煤油的燃烧室燃烧性能的影响.结果表明,并联凹腔会使煤油进一步向展向扩展,混合效率得到明显提高;正对并联凹腔能极大提升煤油的穿透深度,拓宽煤油的亚声速燃烧范围,而对燃烧条件下总压损失系数影响不大;交错并联布置的凹腔可进一步增加煤油的混合效果,热力喉道的位置后移,亚声速燃烧范围扩大,燃烧效率提高.     

决策表中加权关联规则挖掘的研究

通过对规则支持高度提出新的定义 ,对现有的模型进行了扩展 ,并由此提出了新的关联规则挖掘算法     

用SEM研究高聚物的微观形态结构

用扫描电子显微镜（ＳＥＭ）,对ＨＤＰＥ／ＣａＣＯ３填充高聚物、ＰＰ／ＥＰＤＭ高聚物共混物和ＰＡ／ＣＦ增强复合材料的微观结构形态进行了研究,并分析了各材料的改性机理,证明了ＳＥＭ技术在高分子多相体系的形态结构、界面状况、损伤机制及材料性能预测等研究中发挥着重要作用。     

选择重传ARQ重排序方法研究

分析了现有的重排序机制,提出了基于PFR方案的分级PFR方案H—PFR,通过保存正确的重排序数据帧,在进行TCP超时重传时,能立刻在本地完成正确排序的数据帧向高层的转发,缩短了延迟时间,节省了信道资源,提高了无线TCP的传输性能。     

Mechanochromic Photonic Vitrimer Thermal Management Device Based on Dynamic Covalent Bond

Flexible self-healing thermal management devices are increasingly in demand due to their high flexibility, low driving voltage, and excellent stability of thermal property. In this paper, the design of mechanochromic self-healing thermal management devices is reported based on photonic vitrimer through self-healing dynamic covalent bond. A series of new photonic vitrimers i first prepared by dynamic disulfide covalent bond and PS@SiO₂ photonic crystals. The resulting photonic vitrimer exhibits bright structural colors, large tensile strain (>1000%), high mechanical strength (>10 MPa) and self-healing ability (>95% efficiency). More importantly, the structural color remains constant after 10000 stretching/releasing cycles, demonstrating excellent mechanical stability, creep-resistance, and durability. Taking advantage of the above features, a novel mechanochromic flexible wireless thermal management (MFW) device is developed by semi-embedding the photonic vitrimer in a thermally conductive carbon nanotube film and then integrating it with a Bluetooth module and a control chip. Interestingly, the MFW device exhibits mechanochromic property, fast thermal response, low driving voltage (103 °C, at 3 V), and precise temperature control. Notably, the device even remains electrothermal performance (105 °C) after self-healing. This work provides new insight into the self-healing photonic materials, and the device shows promising applications in wearable electronics, vitro physiotherapy, and personal heating.     

Flexible Osteogenic Glue as an All-In-One Solution to Assist Fracture Fixation and Healing

Osteogenic glue that reproduces the natural bone composition represents the final frontier of orthopedic adhesives with the potential to revolutionize surgical strategies against comminuted fractures. However, it is difficult to achieve an all-in-one formula, which could provide flexible and reliable adhesiveness while avoiding interfering with or even promoting the healing of glued fractures. Herein, an osteogenic glue characterized by inorganic-in-organic integration between amine-modified mesoporous bioactive glass nanoparticles (AMBGN) and bioadhesive gelatin-dextran network (GelDex) is introduced as an all-in-one tool to flexibly adhere and splice bone fragments and subsequently guide fracture healing during degradation. Relying on such integration, a 4-fold improvement in cohesiveness is presented, followed by a nearly 5-fold enhancement in adhesive strength in ex vivo porcine bone samples. The reversible and re-adjustable adhesiveness also enables glue to effectively splice intricate fragments from highly comminuted fractures in the rabbit radius in an in vivo environment. Moreover, well-preserved organic–inorganic integrity during degradation of the glue guides sustained interfacial osteogenesis and achieve satisfying healing outcomes in glued fractures, as observed by the 2-fold improvement in biomechanical and radiological performance compared with commercially available cyanoacrylate adhesives. The current findings propose an all-in-one solution for the fixation of bone fragments during surgery.     

LTCC基片的飞针测试工艺研究

低温共烧陶瓷技术(Low Temperature Co-fired Ceramic LTCC)是近年来兴起的一种相当令人瞩目的多学科交叉的整合组件技术,广泛用于基板、封装及微波器件等领域。主要介绍当前广泛用于检测混合电路板、LTCC陶瓷基板、PCB裸板故障的飞针测试设备在陶瓷基片测试中的工艺研究。