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61.
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This article presents the design and development of a personal computer based controller for a microwave tomographic system for breast cancer detection. The system uses motorized, dual-polarized antennas and a custom-made GUI interface to control stepper motors, a wideband vector network analyzer (VNA) and to coordinate data acquisition and archival in a local MDSPlus database. Both copolar and cross-polar scattered field components can be measured directly. Experimental results are presented to validate the various functionalities of the scanner.  相似文献   
63.
The authors reassert the need for methodological changes in depression research appearing in the Journal of Personality and Social Psychology and other personality and social psychology journals. In this rejoinder the authors update their earlier literature review (H. Tennen, J. Hall, & G. Affleck; see record 1995-31710-001) and respond to the commentaries by P C. Kendall and E. C. Flannery-Schroeder (see record 1995-31700-001) and G. Weary, J. A. Edwards, and J. A. Jacobson (see record 1995-31713-001). The authors notice that G. Weary et al.'s own findings demonstrate the need to change how depression is measured and participants are assigned to experimental groups. The authors also challenge G. Weary et al.'s contention that structured interviews are limited because they require interviewer judgments, and they urge personality and social psychologists to learn more about these interviews. Finally, G. Weary et al.'s suspicion that depression research guidelines reflect professional parochialism is disputed. (PsycINFO Database Record (c) 2010 APA, all rights reserved)  相似文献   
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A unified picture is obtained of the Cooper pair-breaking data by Cu-site Zn and Ni in Nd2–z Ce z CuO4, La2–SrCuO4, Bi2Sr2CaCu2O8, Bi1.8Pb0.2Sr2Ca2Cu3O10, YBa2Cu3O7, and YBa2Cu4O8. The data are generally inconsistent with spin-fluctuation d-wave pairing mechanisms of superconductivity and with all two-dimensional cuprate-plane models. The data are consistent with superconductivity in the charge reservoirs.  相似文献   
66.
The charge-transfer hypothesis is shown to be inconsistent with data for YBa2Cu3Ox: (i) The two-step behavior ofT c(x) (with jumps from zero to 60 K and then to 90 K) is not reflected as a similar, statistically significant two-step behavior in the bond-valence-sum charge of cuprate-plane Cu ions (as once believed), (ii) as a consequence of the law of conservation of charge, the derivatives of the layer charges with respect to oxygen contentx for both the Ba-O layers and the charge-reservoir Cu-O chains have the opposite signs to those predicted, and (iii) the charge-transfer observed for superconducting YBa2Cu3Ox is not sufficient to produce superconductivity, as demonstrated by insulating PrBa2Cu3Ox, which has virtually the same layer charges.  相似文献   
67.
Abstract— A processing technology based upon a temporary bond—debond approach has been developed that enables direct fabrication of high‐performance electronic devices on flexible substrates. This technique facilitates processing of flexible plastic and metal‐foil substrates through automated standard semiconductor and flat‐panel tool sets without tool modification. The key to processing with these tool sets is rigidifying the flexible substrates through temporary bonding to carriers that can be handled in a similar manner as silicon wafers or glass substrates in conventional electronics manufacturing. To demonstrate the power of this processing technology, amorphous‐silicon thin‐film‐transistor (a‐Si:H TFT) backplanes designed for electrophoretic displays (EPDs) were fabricated using a low‐temperature process (180°C) on bonded‐plastic and metal‐foil substrates. The electrical characteristics of the TFTs fabricated on flexible substrates are found to be consistent with those processed with identical conditions on rigid silicon wafers. These TFTs on plastic exhibit a field‐effect mobility of 0.77 cm2/V‐sec, on/off current ratio >109 at Vds = 10 V, sub‐threshold swing of 365 mV/dec, threshold voltage of 0.49 V, and leakage current lower than 2 pA/μm gate width. After full TFT‐array fabrication on the bonded substrate and subsequent debonding, the flexible substrate retains its original flexibility; this enables bending of the EPD display without loss in performance.  相似文献   
68.
Squeeze-film damping on microresonators is a significant damping source even when the surrounding gas is highly rarefied. This article presents a general modeling approach based on Monte Carlo (MC) simulations for the prediction of squeeze-film damping on resonators in the free-molecule regime. The generality of the approach is demonstrated in its capability of simulating resonators of any shape and with any accommodation coefficient. The approach is validated using both the analytical results of the free-space damping and the experimental data of the squeeze-film damping on a clamped–clamped plate resonator oscillating at its first flexure mode. The effect of oscillation modes on the quality factor of the resonator has also been studied and semi-analytical approximate models for the squeeze-film damping with diffuse collisions have been developed.  相似文献   
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Six different methods to calculate the Strain Index (SI) scores for jobs with multiple forces/tasks were developed. Exposure data of 733 subjects from 12 different worksites were used to calculate these SI scores. Results show that using different SI computation methods could result in different SI scores, hence different risk level classifications. However, some simpler methods generated SI scores were comparable to the more complicated composite SI method. Despite differences in the scores between the six different SI computation methods, Spearman rank-order correlation coefficients of 0.61-0.97 were found between the methods. With some confidence, ergonomic practitioners may use simpler methods, depending on their specificity requirement in job evaluations and available resources. Some SI computation methods may tend to over-estimate job risk levels, while others may tend to under-estimate job risk levels, due to different ways used in obtaining the various SI parameters and computations.  相似文献   
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