全文获取类型
收费全文 | 130174篇 |
免费 | 13073篇 |
国内免费 | 7897篇 |
专业分类
电工技术 | 9096篇 |
技术理论 | 9篇 |
综合类 | 10365篇 |
化学工业 | 20016篇 |
金属工艺 | 7551篇 |
机械仪表 | 8471篇 |
建筑科学 | 9664篇 |
矿业工程 | 3630篇 |
能源动力 | 3366篇 |
轻工业 | 13340篇 |
水利工程 | 2983篇 |
石油天然气 | 5818篇 |
武器工业 | 1363篇 |
无线电 | 15156篇 |
一般工业技术 | 14042篇 |
冶金工业 | 5131篇 |
原子能技术 | 1449篇 |
自动化技术 | 19694篇 |
出版年
2024年 | 465篇 |
2023年 | 2013篇 |
2022年 | 3916篇 |
2021年 | 5408篇 |
2020年 | 4099篇 |
2019年 | 3388篇 |
2018年 | 3873篇 |
2017年 | 4131篇 |
2016年 | 3886篇 |
2015年 | 5630篇 |
2014年 | 7014篇 |
2013年 | 8610篇 |
2012年 | 9878篇 |
2011年 | 10831篇 |
2010年 | 9676篇 |
2009年 | 9367篇 |
2008年 | 9299篇 |
2007年 | 8621篇 |
2006年 | 7886篇 |
2005年 | 6486篇 |
2004年 | 4628篇 |
2003年 | 3809篇 |
2002年 | 3577篇 |
2001年 | 3029篇 |
2000年 | 2403篇 |
1999年 | 1958篇 |
1998年 | 1360篇 |
1997年 | 1161篇 |
1996年 | 995篇 |
1995年 | 770篇 |
1994年 | 637篇 |
1993年 | 496篇 |
1992年 | 358篇 |
1991年 | 319篇 |
1990年 | 254篇 |
1989年 | 178篇 |
1988年 | 135篇 |
1987年 | 96篇 |
1986年 | 88篇 |
1985年 | 55篇 |
1984年 | 37篇 |
1983年 | 28篇 |
1982年 | 50篇 |
1981年 | 34篇 |
1980年 | 42篇 |
1979年 | 26篇 |
1978年 | 20篇 |
1977年 | 23篇 |
1976年 | 29篇 |
1975年 | 15篇 |
排序方式: 共有10000条查询结果,搜索用时 500 毫秒
101.
地层岩性随钻识别的神经网络方法研究 总被引:2,自引:1,他引:1
钻井过程中随钻识别钻头当前位置的岩性信息对于合理选择钻头类型、快速建立岩性剖面、及时发现油气层和卡准取心层位有着重要意义。钻井实践证明,地层岩性的变化在钻井参数上有很好的综合体现。以录井资料为基础,结合已钻井的测井资料,根据BP神经网络原理,建立了地层岩性随钻识别神经网络模型。应用该模型在新疆油田进行了地层岩性随钻识别试验,试验结果与测井资料解释结果相比,效果较好,符合率可达80%。 相似文献
102.
W. Shieh R. Hui X. Yi 《Photonics Technology Letters, IEEE》2006,18(10):1122-1124
We perform a systematic measurement of the degree-of-polarization (DOP) and eye-closure penalty for optical signals with orthogonal polarizations. We find that the symmetry of DOP is maintained for the orthogonal polarizations under both first and higher order polarization-mode dispersion (PMD), whereas the symmetry of eye-closure penalty is broken under second-order PMD. An orthogonal polarization pair can have large disparity of eye-closure penalty despite an identical DOP. We also demonstrate a novel approach to estimate the maximum eye-closure penalty asymmetry with three orthogonal polarizations on the Poincare/spl acute/ sphere. 相似文献
103.
A new detection algorithm (NDA) based on fuzzy cellular neural networks for white blood cell detection. 总被引:1,自引:0,他引:1
White blood cell detection is one of the most basic and key steps in the automatic recognition system of white blood cells in microscopic blood images. Its accuracy and stability greatly affect the operating speed and recognition accuracy of the whole system. But there are only a few methods available for cell detection or segmentation due to the complexity of the microscopic images. This paper focuses on this issue. Based on the detailed analysis of the existing two methods--threshold segmentation followed by mathematical morphology (TSMM), and the fuzzy logic method--a new detection algorithm (NDA) based on fuzzy cellular neural networks is proposed. NDA combines the advantages of TSMM and the fuzzy logic method, and overcomes their drawbacks. With NDA, we can detect almost all white blood cells, and the contour of each detected cell is nearly complete. Its adaptability is strong and the running speed is expected to be comparatively high due to the easy hardware implementation of FCN. Experimental results show good performance. 相似文献
104.
105.
Hui Luo Wei Hao David H Foos Craig W Cornelius 《IEEE transactions on information technology in biomedicine》2006,10(2):302-311
Chest radiography is one of the most widely used techniques in diagnostic imaging. It comprises at least one-third of all diagnostic radiographic procedures in hospitals. However, in the picture archive and communication system, images are often stored with the projection and orientation unknown or mislabeled, which causes inefficiency for radiologists' interpretation. To address this problem, an automatic hanging protocol for chest radiographs is presented. The method targets the most effective region in a chest radiograph, and extracts a set of size-, rotation-, and translation-invariant features from it. Then, a well-trained classifier is used to recognize the projection. The orientation of the radiograph is later identified by locating the neck, heart, and abdomen positions in the radiographs. Initial experiments are performed on the radiographs collected from daily routine chest exams in hospitals and show promising results. Using the presented protocol, 98.2% of all cases could be hung correctly on projection view (without protocol, 62%), and 96.1% had correct orientation (without protocol, 75%). A workflow study on the protocol also demonstrates a significant improvement in efficiency for image display. 相似文献
106.
107.
The current Internet and wireless networks are harsh environments for transporting high-bandwidth multimedia data. We examine the technical issues involved, and describe an end-to-end solution to support a Web-based learn-on-demand system that operates in a wireless campus environment. 相似文献
108.
109.
层序单元体系域划分及勘探意义 总被引:3,自引:3,他引:0
体系域是层序地层学理论体系中的重要概念,在隐蔽油气藏的勘探中,勘探家们极为重视低位体系域。但体系域的成因意义、是否有不同级别层序的体系域以及如何划分,在实际工作中认识不一致。结合勃海湾盆地的勘探实例,分析体系域的成因机制、组合特征和勘探规律,认为:体系域是基准面变化等因素作用的产物,不同级别的层序都发育着与其对应的体系域:一般情况下,三级层序对应的体系域单元与含油气层的规模相匹配,但四级层序对应的体系域才是隐蔽油气藏赋存的有利部位。图5参6。 相似文献
110.
Chong D. Y. R. Lim B. K. Rebibis K. J. Pan S. J. Sivalingam K. Kapoor R. Sun A. Y. S. Tan H. B. 《Advanced Packaging, IEEE Transactions on》2006,29(4):674-682
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported 相似文献