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1.
Qin Song Zou Xubiao Zhong Yan Zhang Zhongdong 《中国炼油与石油化工》2006,(1):31-35
1 Introduction Propylene as an important feedstock for organic chemicals is mainly originated from steam cracking and catalytic cracking processes. During the FCC process the propylene content varies with the FCC catalyst and process technology adopted, resulting in significant difference in propylene concentration in the cracked product——LPG. The conventional FCC pro- cess generally gives a propylene yield of around 4%, while the FCC process with maximization of propylene yield can in… 相似文献
2.
含硫化氢气井钻井过程中的腐蚀因素与防护研究 总被引:1,自引:0,他引:1
在含硫气井的钻井过程中对于HRC大于22的钻具钢材除了腐蚀疲劳之外,在pH值小于9的环境中会发生硫化物应力腐蚀破裂,这种破坏比腐蚀疲劳更突然、更快,使钻杆大量损坏。含硫气井在钻井过程中,由于湿硫化氢的出现,常常会出现油管、套管、钻井设备、钻井仪器以及对支持保护管柱的水泥环柱等腐蚀和损坏问题,为此,阐述了湿硫化氢的腐蚀特点、机理,归纳总结了影响腐蚀的因素,综述了如何在这些方面防止其腐蚀,使损失减小,为指导油管、套管防腐工程实践提供了依据。建议在钻井过程中采用碱性钻井液,其pH值可到9或更高(至pH值12),以减缓或防止钻井过程中电化学从硫化物应力腐蚀破裂;含硫气井用的钻杆应该间歇使用。钻杆停用堆置时间可使其放氢,使钻杆恢复韧性,防止硫化物应力腐蚀断裂。 相似文献
3.
Xiang Cao Sheng Zhong 《Communications Letters, IEEE》2006,10(8):580-581
Lin et al., (2003) proposed a remote user authentication scheme for multi-server architecture. In this paper, we breaks this scheme by giving an attack. Our attack allows an adversary to impersonate any user in the system, as long as a single authentication message of that user is observed. 相似文献
4.
Σ-ΔA/D转换技术及仿真 总被引:1,自引:0,他引:1
Σ-ΔA/D转换技术近年来颇受重视,因为基于该技术的A/D转换器能达到很高的分辨率(16bit以上),并另具一系列优点。本文对Σ-ΔA/D转换器的基本原理,包括过采样(Oversampling),噪声成形(NoiseShaping),以及数字抽取滤波(DigitalDecimationFiltering)等内容,均作了叙述。作者还对一个20bitΣ-Δ转换器的算法进行了计算机仿真。该转换器采用了高阶MASH噪声成形技术,而其数字抽取滤波部分则由梳状滤波器与级联的半带滤波器构成。文章中给出了仿真结果。 相似文献
5.
DCS的现状与发展趋势 总被引:1,自引:0,他引:1
钟霖田 《自动化与仪器仪表》1994,(3):1-6
叙述DCS的进展。目前的DCS正面临来自用户需求的挑战,为保住全球市场竞争优势,制造加工行业用户需要建立集过程控制数据与商业信息于一体的CIMS。未来DCS应具备服从国际标准的开放性和互换操作性。以ISP现场总线为基础的系统结构可能成为未来的DCS。提高应用水平有助于发展未来的DCS 相似文献
6.
W. F. Flanagan Lijun Zhong B. D. Lichter 《Metallurgical and Materials Transactions A》1993,24(3):553-559
A model is proposed to explain transgranular-stress corrosion cracking (T-SCC) in face-centered cubic (fcc) materials. Crack
propagation is shown to be anisotropic, in that growth near {110} < 001> is discontinuous due to crack arrest by dislocation
blunting whereas growth away from this growth orientation is continuous. For the former case, renucleation of arrested cracks
involves active dissolution of shear bands at the crack tip, which changes the stress state at Lomer-Cottrell locks, causing
them to fail by cleavage. Once the crack is nucleated, its instantaneous macroscopic crack-growth velocity is considered to
be comprised of multiple nucleation of microcracks with intervening arrests. This microcracking results from the interaction
of the stress fields from neighboring cracks which are forming simultaneously, the crack-opening constraint due to ligaments
which act as “bridges” behind the crack front, and the localized dissolution at the microcrack tip which affectsK
IC and leads to the “cobblestone” appearance. Experimental evidence and theoretical considerations are presented to support
the model. The system studied was Cu-25 at. pct Au in 0.6 M NaCl solution at potentials between 300 and 400 mV (sce), which
precludes hydrogen embrittlement.
This article is based on a presentation made in the symposium “Quasi-Brittle Fracture” presented during the TMS fall meeting,
Cincinnati, OH, October 21–24, 1991, under the auspices of the TMS Mechanical Metallurgy Committee and the ASM/MSD Flow and
Fracture Committee. 相似文献
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9.
Xiang‐Dan Li Zhen‐Xin Zhong Sang‐Hoon Han Seung Hee Lee Myong‐Hoon Lee 《Polymer International》2005,54(2):406-411
From chloromethylated polyimide, a useful starting material for modification of aromatic polyimides, a thermocurable transparent polyimide having acrylate side groups was prepared. In the presence of 1,8‐diazabicyclo[5,4,0]undec‐7‐ene, chloromethylated polyimide was esterified with acrylic acid to synthesize poly(imide methylene acrylate). The polymer was soluble in organic solvent, which makes it possible to prepare a planar film by spin coating. The polymer film became insoluble after thermal treatment at 230 °C for 30 min. Optical transparency of the film at 400 nm (for 1 µm thickness) was higher than 98 % and not affected by further heating at 230 °C for 250 min. Adhesion properties measured by the ASTM D3359‐B method ranged from 4B to 5B. Preliminary results of planarization testing showed a high degree of planarization (DOP) value (>0.53). These properties demonstrate that poly(imide methylene acrylate) could be utilized as a thermocurable transparent material in fabricating display devices such as TFT‐LCD. Copyright © 2004 Society of Chemical Industry 相似文献
10.