Preparation of SnO2 whiskers via the decomposition of tin oxalate

A new method for preparing SnO₂ whiskers by the decomposition of SnC₂O₄ is suggested. A Whisker-like morphology of a SnC₂O₄ precipitate was attained via the gradual addition of an oxalic acid solution to a hot SnCl₂ aqueous solution (T > 50^∘C). In comparison, when the solution temperature was either lower than 50^∘C or when ethanol was used as the solvent, the SnC₂O₄ precipitate showed an angular and relatively isotropic morphology. The morphology of the SnC₂O₄ precipitate remained even after its thermal decomposition into SnO₂ at 400^∘C indicating that SnC₂O₄ precipitation is a key step in preparing the whiskers. The formation mechanism of SnO₂ whiskers was explained by the supersaturation during the precipitation of SnC₂O₄.     

Baseband derived RF digital predistortion

A unique baseband derived RF predistortion system which uses lookup table coefficients extracted at baseband that directly RF envelope modulate a quadrature vector modulator is presented. The primary advantages of this architecture are that it combines the narrowband advantage of envelope predistortion with the accuracy of baseband predistortion.     

A miniature UWB planar monopole antenna with 5-GHz band-rejection filter and the time-domain characteristics

A planar monopole antenna with a staircase shape and small volume (25/spl times/26/spl times/1 mm/sup 3/) is proposed in this paper. With the use of a half-bowtie radiating element, the staircase-shape, and a modified ground plane structure, the proposed antenna has a very wide impedance bandwidth measured at about 11.6 GHz (2.9-14.5 GHz, bandwidth ratio about 1:5) below VSWR 2 including the WLAN band notched in the vicinity of 5 GHz. An omnidirectional radiation pattern is obtained. The group delay which is an indication of linearity between two proposed antennas is less than 1 ns. The electrical characteristics in terms of frequency and time domains and physical ones of the proposed antenna make it attractive for use in ultrawideband (UWB) systems.     

Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications

This paper describes low-temperature flip-chip bonding for both optical interconnect and microwave applications. Vertical-cavity surface-emitting laser (VCSEL) arrays were flip-chip bonded onto a fused silica substrate to investigate the optoelectronic characteristics. To achieve low-temperature flip-chip bonding, indium solder bumps were used, which had a low melting temperature of 156.7/spl deg/C. The current-voltage (I-V) and light-current (L-I) characteristics of the flip-chip bonded VCSEL arrays were improved by Ag coating on the indium bump. The I-V and L-I curves indicate that optical and electrical performances of Ag-coated indium bumps are superior to those of uncoated indium solder bumps. The microwave characteristics of the solder bumps were investigated by using a flip-chip-bonded coplanar waveguide (CPW) structure and by measuring the scattering parameter with an on-wafer probe station for the frequency range up to 40 GHz. The indium solder bumps, either with or without the Ag coating, provided good microwave characteristics and retained the original characteristic of the CPW signal lines without degradation of the insertion and return losses by the solder bumps.     

Parallel optical transmitter module using angled fibers and a V-grooved silicon optical bench for VCSEL array

We propose an advanced structure of optical subassembly (OSA) for packaging of the vertical-cavity surface-emitting laser (VCSEL) array, using (111) facet mirror of the V-groove ends formed in a silicon optical bench (SiOB) and angled fiber apertures. The feature of our OSA can provide a low optical crosstalk between neighboring channels, a low feedback reflection, and a large misalignment tolerance along the V-groove. We describe the optimized design of fiber angle, VCSEL position, and fiber position. The fabricated OSA structure consists of 12 channels of angled fiber array, 54.7/spl deg/ V-grooves, Au-coated mirrors on (111) end facet of the V-grooves, and flip-chip-bonded VCSEL array on a SiOB. In this structure, the beam emitted from the VCSEL is deflected at the 54.7/spl deg/ mirror of (111) end facet and propagated into the angled fiber. The angled fiber array was polished by 57/spl deg/. Fabricated OSAs showed a coupling efficiency of 30%-50% that is 25 times larger than that obtained from an OSA with a vertically flat fiber array. Our OSA showed large misalignment tolerance of about 90 /spl mu/m along the longitudinal direction in the V-groove. We fabricated a parallel optical transmitter module using the OSA and demonstrated 12 channels /spl times/2.5 Gb/s data transmission with a clear eye diagram.     

Performance Analysis on Coexistence of EDCA and Legacy DCF Stations in IEEE 802.11 Wireless LANs

The distributed coordination function (DCF) scheme of IEEE 802.11 MAC protocol does not support any concepts of quality of service (QoS) but the enhanced distributed channel access (EDCA) scheme in IEEE 802.11e standard provides QoS according to access categories using different access parameters. However, the legacy DCF stations may be used together with EDCA stations. In this letter, we investigate and analyze the performance discrimination when EDCA and DCF stations operate simultaneously     

MLS‐based variable‐node elements compatible with quadratic interpolation. Part I: formulation and application for non‐matching meshes

Two‐dimensional variable‐node elements compatible with quadratic interpolation are developed using the moving least‐square (MLS) approximation. The mapping from the parental domain to the physical element domain is implicitly obtained from MLS approximation, with the shape functions and their derivatives calculated and saved only at the numerical integration points. It is shown that the present MLS‐based variable‐node elements meet the patch test if a sufficiently large number of integration points are employed for numerical integration. The cantilever problem with non‐matching meshes is chosen to check the feasibility of the present MLS‐based variable‐node elements, and the result is compared with that from the lower‐order case compatible with linear interpolation. Copyright © 2005 John Wiley & Sons, Ltd.     

Recrystallization and grain growth of cold-rolled gold sheet

Recrystallization and grain growth of a cold-rolled gold sheet with 98 pct reduction in area (RA) were investigated with electron backscatter diffraction (EBSD) and X-ray diffraction (XRD). Gold with some dopants (Be, Ca, and La) was used in this research and its recrystallization temperature was 320 °C. Isothermal annealing experiments at 400 °C, 500 °C, and 600 °C were carried out for the cold-rolled gold sheet, and recrystallization texture was examined. In the cold-rolled gold sheet, α- and β-fibers were measured mainly and some shear texture components were found on the surface. Shear texture components remained on the surface for 2 hours at 400 °C and were consumed by other recrystallized grains after 24 hours at 400 °C. Microstructure and texture evolution during in-situ annealing at 400 °C were investigated from the cold-rolled state to the fully recrystallized state using EBSD. Most of the newly, recrystallized grains came from the deformed β-fiber regions and consisted of β-fiber, cube, and other random orientations.     

Process Modeling for Precision Forming of Discrete Parts – State of the Technology and Critical Issues

This paper presents an overview on the application of FE simulation as a virtual manufacturing tool in designing manufacturing processes for precision parts. The processes discussed include forging, sheet metal forming and hydroforming. Determination of reliable input parameters to simulate a process is a key element in successful application of process simulation for process design in all the mentioned areas. These issues are discussed in detail. Practical examples of application of FE simulation are presented for improvement of the existing metal forming process and/or designing new metal forming process for manufacturing discrete precision parts in forging, sheet metal forming and hydroforming.