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31.
Porous alumina films can be found in a wide variety of materials, including filters, thermal insulation components, dielectrics, biomedical and catalyst supports, coatings and adsorbents. Production methods for these films are as equally diverse as their applications. In this work, a hybrid process based upon chemical vapor deposition and gas-to-particle conversion is presented as an alternative technique for producing porous alumina films, with the main advantages of solvent-free, low substrate-temperature operation. In this process, nanoparticles were produced in the vapor phase by reaction of aluminum acetylacetonate in the presence of oxygen. Downstream of this reaction zone, these nanoparticles were collected via thermophoresis onto a cooled substrate, forming a porous film. Some deposited films were subjected to post-processing in the form of annealing in air. Fourier-transform infrared spectra and X-ray energy-dispersive spectroscopy analysis confirmed the production of alumina at processing temperatures above 973 K. X-Ray diffraction revealed that the films were amorphous. Film thickness, ranging from 30 to 250 μm, and the average deposition rate were determined from scanning electron microscopy results. From transmission electron microscopy, the average primary particle size was determined to be approximately 18 nm and the formation of nanoparticle aggregates was evident. Annealing of the films at temperatures ranging from 523 to 1173 K in the presence of air did not have an effect on particle size. The specific surface area of the powder composing the films ranged from 10 to 185 m2 g−1, as determined from nitrogen gas adsorption by the Brunauer–Emmett–Teller method. 相似文献
32.
Blair J.D. Correale A. Jr. Cranford H.C. Dombrowski D.A. Erdelyi C.K. Hoffman C.R. Lamphere J.L. Lang K.W. Lee J.K. Mullen J.M. Norman V.R. Oakland S.F. 《Solid-State Circuits, IEEE Journal of》1989,24(6):1647-1655
The authors describe a 9.02×9.02-mm chip built in 1-μm CMOS with two levels of metal and an additional mask level for fabricating capacitors. It contains both analog and digital circuits and has provisions for self-test. The function includes the transmitter, receiver, protocol handler, an microprocessor, as well as interfaces for RAM/ROM storage, IBM PC bus, IBM PS/2 bus, IBM 3174 bus, and Motorola 68000 bus. The physical design terrains are formed by 24K circuits of standard cell gates, a 10K-circuit equivalent hand-honed custom microprocessor, and an analog macro. The chip operates from a single 5-V supply, and the power consumption is 0.8 W nominal at 16 Mb/s. The chip can also be operated at 4 Mb/s 相似文献
33.
Koenen Karestan C.; Stellman Jeanne Mager; Stellman Steven D.; Sommer John F. Jr. 《Canadian Metallurgical Quarterly》2003,71(6):980
Risk factors affecting the course of posttraumatic stress disorder (PTSD) are poorly understood. As part of a larger study on characterizing exposure to herbicides in Vietnam, the authors investigated this issue in a random sample of 1,377 American Legionnaires who had served in Southeast Asia during the Vietnam War and were followed over a 14-year period. High combat exposure, perceived negative community attitudes at homecoming, minority race, depression symptoms at Time 1, and more anger at Time 1 predicted a more chronic course. Community involvement at Time 1 was protective and associated with decreased risk at Time 2. Discomfort in disclosing Vietnam experiences was associated with an increased risk for developing PTSD but did not predict its course. Combat exposure predicted PTSD course more strongly than any other risk factor. Findings suggest recovery from PTSD is significantly influenced by perceived social support. (PsycINFO Database Record (c) 2010 APA, all rights reserved) 相似文献
34.
Richard F. D.; Bond Charles F. Jr.; Stokes-Zoota Juli J. 《Canadian Metallurgical Quarterly》2003,7(4):331
This article compiles results from a century of social psychological research, more than 25,000 studies of 8 million people. A large number of social psychological conclusions are listed alongside meta-analytic information about the magnitude and variability of the corresponding effects. References to 322 meta-analyses of social psychological phenomena are presented, as well as statistical effect-size summaries. Analyses reveal that social psychological effects typically yield a value of r equal to .21 and that, in the typical research literature, effects vary from study to study in ways that produce a standard deviation in r of .15. Uses, limitations, and implications of this large-scale compilation are noted. (PsycINFO Database Record (c) 2010 APA, all rights reserved) 相似文献
35.
36.
A radix-8 wafer scale FFT processor 总被引:2,自引:0,他引:2
Earl E. Swartzlander Jr. Vijay K. Jain Hiroomi Hikawa 《The Journal of VLSI Signal Processing》1992,4(2-3):165-176
Wafer Scale Integration promises radical improvements in the performance of digital signal processing systems. This paper describes the design of a radix-8 systolic (pipeline) fast Fourier transform processor for implementation with wafer scale integration. By the use of the radix-8 FFT butterfly wafer that is currently under development, continuous data rates of 160 MSPS are anticipated for FFTs of up to 4096 points with 16-bit fixed point data. 相似文献
37.
Summary In this study the critical dimensionless parameters, controlling the alternate 90° turn and oscillation along the axis of a vertical water-jet emanating downwards from a slit in the air are determined. 相似文献
38.
A new seismic support device and its application in piping systems is described. The device, E-BAR (patented), can be cost effectively used for snubber replacement programs, mitigation of hydraulic transients, pipe whip and as a thermal stop. The device has pre-set gaps to allow free thermal movement. During a seismic or other dynamic load event, if the pipe movement exceeds the gap dimension, the device acts as an elastic or elastic-plastic restraint. The device also has a unique design feature for not exceeding the restraint force beyond a specified limit design value. To analyze piping systems with gap supports having elastic-plastic characteristics, modal analysis procedures for both response spectrum and time history methods are developed. The comparison of responses obtained from the procedures with nonlinear time history analysis and test results available in the literature shows excellent correlation. A pilot program conducted for snubber replacement with E-BARs demonstrates that the limit force feature of E-BAR makes them very attractive for snubber replacement. This is because a particular E-BAR with a specified limit design force can be selected, such that, the E-BAR replacing the snubber does not require any modifications be made to the existing support steel and hardware. 相似文献
39.
The relationship between the distance properties of trellis codes and the computational effort and error performance of sequential decoding is studied and optimum distance profile (ODP) and optimum free distance (OFD) trellis codes are constructed for 8-PSK and 16 QAM modulation. A comparison of the performance of both the ODP and the OFD trellis codes reveals that neither class of codes results in the best trade-off between error performance and computational effort when sequential decoding is used. A new algorithm is then proposed to construct robustly good trellis codes for use with sequential decoding. New trellis codes with asymptotic coding gains up to 6.66 dB are obtained using this algorithm, and the new codes achieve nearly the same free distances as the OFD codes and nearly the same distance profiles as the ODP codes 相似文献
40.
Binder M. Mammone R.J. Wade W.L. Jr. Rondeau E. Lavene B. 《Electrical Insulation Magazine, IEEE》1992,8(4):16-19
It is shown that the electrical breakdown voltages of polycarbonate film/metal foil capacitors can be increased. This can be achieved by briefly exposing the metal foil in these spirally wound film foil sections to a low-pressure, low-temperature gas plasma. Exposure of tin/lead foil to a 96% CF4/4% O2 gas plasma for four min, for example, produced >500% increase in breakdown voltage of sealed polycarbonate capacitors 相似文献