High-efficiency LEDs of 1.6–2.4 µm spectral range for medical diagnostics and environment monitoring

High efficient LED structures covering the spectral range of 1.6–2.4 μm have been developed on the basis of GaSb and its solid solutions. The electroluminescent characteristics and their temperature and current dependences have been studied. The radiative and nonradiative recombination mechanisms and their effect on the quantum efficiency have been investigated. A quantum efficiency of 40–60% has been obtained in the quasi-steady mode at room temperature. A short-pulse optical power of 170 mW was reached. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 37, No. 8, 2003, pp. 996–1009. Original Russian Text Copyright ? 2003 by Stoyanov, Zhurtanov, Astakhova, Imenkov, Yakovlev.     

Optimal mean-square prediction of the mobile-radio fading envelope

Long-range prediction of the mobile-radio fading envelope is an enabling technology for many fading compensation approaches. Because the fading envelope is well modeled as a bandlimited process, it has special predictability properties. In this paper, we find a linear predictor that is optimal in the mean-square sense when the predictor impulse response is energy constrained. This solution may be used to determine the minimum mean squared error of a prediction based on past values that are corrupted with estimation errors.     

PNNI-based control plane for automatically switched optical networks

Much effort has been spent on the definition of control plane protocols for automatically switched optical networks (ASON). Most of the proposals brought into the standardization for an International Telecommunications Union-Telecommunication Sector, Internet Engineering Task Force, and Optical Internetworking Forum are based on Internet protocol concepts. One such proposal is the generalized multi-protocol label switching (GMPLS), an extension of the MPLS traffic engineering control plane model that includes nonpacket switched technologies (time, wavelength, and fiber switching). Recently, the potential use of private network-network interface (PNNI) in ASONs has been discussed as an alternative proposal by the standardization bodies. The goal of this paper is to appropriately adapt asynchronous transfer mode into an optical PNNI (O-PNNI) protocol that can be used as the control plane of ASONs. The paper also provides a critical viewpoint on the potential usage of either O-PNNI or GMPLS control plane and analyzes the pros and cons of each. The methodology adopted toward devising O-PNNI hinges on reviewing PNNI along with ASON recommendations in order to determine the set of PNNI features that require adaptation. Having identified these features we engineer and present appropriate solutions relating to routing, signaling and addressing aspects.     

Experimental real-time detector of GSM terminals

The authors present an experimental real-time GSM terminal detector, to be installed in a restricted area. The detector triggers terminal signaling, which can be captured.     

The Shunting of Current and the Resultant Variation of Voltage in Channels of Plasmatrons with Self-Adjusting Length of Electric Arc

The characteristics of pulsation processes in dc plasmatrons with the cathode located in the channel center and the anode in the form of a cylindrical or a conical channel wall are investigated in plasmas of argon and nitrogen at atmospheric pressure. The fast Fourier transform of signals and their subsequent computer processing are used to obtain the dependences of the frequency of fluctuations of the arcing voltage on the working parameters of the plasmatron, namely, the electric arc current, the flow rate of plasma-forming gas, and the channel diameter. For plasmatrons with the self-adjusting length of the electric arc, analysis is performed of the mechanism of reclosing of the anode region of the arc, i.e., of the electric arc shunting associated with the stretching of the current filament by a flow of gas and with the electrodynamic interaction of different filament regions. A formula is derived which defines the dependence of the characteristic frequency of fluctuations of the arcing voltage on the external parameters of the problem, namely, the arc current, the flow rate of the working gas, and the characteristic channel diameter. It is demonstrated that the pattern of the dependence of the frequency of voltage fluctuations on the gas flow rate may vary with the values of the parameter of magnetohydrodynamic interaction. The formula generalizes the experimental results of numerous researchers obtained in a wide range of variation of the external parameters.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Parametric effects on the transient Voltage performance of a DC superconducting cable

The objective of this work was to determine the significant parameters of a 3-GW 200-kV dc superconducting cable system which influence the transient voltage distribution in the various parts of the cable. The cable system consists of four coaxial metallic cylinders. It was found that the dielectric constant and the electrical resistivity of the soil significantly affect the severity of the transient voltages; lower dielectric constant and higher resistivity of the soil will increase the magnitudes of the transient voltages by increasing the earth-return impedance. It was also found that the effect of the conductor internal impedances of the cable is insignificant. Shorting the coaxial cylinders of the cryogen flow and the cryostat will lessen the severity of the transient voltages. Grounding the second, third, and fourth cylinders at regular intervals with low-impedance grounding impedance will also improve the transient performance of the cable. More research is needed to evaluate these procedures.     

Progressive damage modelling of SMC composite materials

The present work deals with the modelling of damage behaviour for sheet moulding compound (SMC) composite materials using a finite element analysis package. Specifically, a comparison is made between the results obtained experimentally for a three-point bending test, and those obtained from numerical simulation using a material model already implemented. The simulation has been performed for the material models available within the PAM-CRASH software. The simulation results are compared and validated with respect to experimentation.     

Fracture response of fibre-reinforced materials with macro/microcrack damage using the Boundary Element Technique

The Boundary Element Method (BEM) incorporating the Embedded Cell Approach (ECA) has been used to analyse the effects of constituent material properties, fibre spatial distribution and microcrack damage on the localised behaviour of transversely fractured, unidirectional fibre-reinforced composites. Three specific composites, i.e., glass fibre reinforced polyester, carbon fibre reinforced epoxy and a glass-carbon hybrid, are considered. The geometrical structures examined were perfectly periodic, uniformly spaced fibre arrangements in square and hexagonal embedded cells. In addition, numerical simulations were also conducted using embedded cells containing randomly distributed fibres. The models involve both elastic fibres and matrix, with the interfaces between the different phases being fully bonded. The results indicate that the constituent material properties (two phase composite) and spatial distribution have a significant effect on the localised stress distributions around the primary crack tip. However, the strain energy release rate associated with crack propagation is predominantly influenced by the material composition. The three-phase hybrid composite exhibited an apparent intermediate fracture toughness value, compared to the all-glass and all-carbon models. Furthermore, the strain energy release rate for the macrocrack lowers as it enters a zone of localised damage (microcracking). The presence of microcracks relaxes the stress field, which can result in a significant reduction in the energetics of the primary crack.