Dry sliding wear in case-hardened niobium microalloyed steels

Low-carbon steel samples containing a small addition of niobium singly or in combination with nitrogen have been carburized in a natural Titas gas atmosphere at 950 °C and 15 psi gas pressure for different time periods. At the end of the predetermined time period, the specimens were pre-cooled to 860 °C in the furnace and quenched in 10% brine. One set of the quenched specimens was tempered at a low temperature of 160 °C and the other set was sub-zero treated at −195 °C in liquid nitrogen, followed by tempering at the same tempering temperature. Surface hardness was measured by Rockwell hardness testing machine and optical microscopy was performed on etched samples. Using a pin-on-disc type apparatus, wear test was carried out under dry sliding condition to assess the beneficial effect of niobium and niobium with nitrogen on the wear properties of the carburized and hardened low-carbon steels in relation to the resulted surface hardness and microstructures.

It has been found that niobium with or without nitrogen improves the wear resistance under both the heat treatment conditions. Niobium with nitrogen is more effective than niobium in improving the wear resistance. Whatever was the heat treatment condition, the wear rate of the specimens increases for all the steels as the carburizing time increases. It has also been found that samples with sub-zero treatment always have higher wear resistance than that of samples without sub-zero treatment. Niobium singly or in combination with nitrogen has been found as a modifier of the wear mechanism.     

Fault-tolerant switched reluctance motor drive using adaptive fuzzy logic controller

An adaptive fuzzy controller has been designed to develop a high-performance fault-tolerant switched reluctance motor (SRM) drive. The fuzzy controller continuously adapts its properties to regulate the machine torque as desired by the drive system even under fault conditions. The adaptation of the fuzzy membership functions results in extended conduction period and increased peak current of the healthy phases to deliver the commanded torque, as much as possible. The adaptive fuzzy controller provides smooth torque output with minimum ripple, even under fault conditions, yielding a high-performance SRM drive with fault-tolerant capability.     

Effect of microwave preheating on the bonding performance of flip chip on flex joint

A microwave (MW) preheating mechanism of anisotropic conductive adhesive film (ACF) has been introduced in order to reduce the bonding temperature for flip chip technology. Thermal curing of epoxy shows a very sluggish and non-uniform curing kinetics at the beginning of the curing reaction, but the rate increases with time and hence requires higher temperature. On the other hand MW radiation has the advantage of uniform heating rate during the cycle. In view of this, MW preheating (for 2/3 s) of ACF prior to final bonding has been applied to examine the electrical and mechanical performance of the bond. Low MW power has been used (80 and 240 W) to study the effect of the MW preheating. It has been found that 170 °C can be used for flip chip bonding instead of 180 °C (standard temperature for flip chip bonding) for MW preheating time and power used in this study. The contact resistance (0.015–0.025 Ω) is low in these samples where the standard resistance is 0.017 Ω (bonded at 180 °C without prior MW preheating). The shear forces at breakage were satisfactory (152–176 N) for the samples bonded at 170 °C with MW preheating, which is very close and even higher than the standard sample (173.3 N). For MW preheating time of 2 s, final bonding at 160 °C can also be used because of its low contact resistance (0.022–0.032 Ω), but the bond strength (137.3–145 N) is somewhat inferior to the standard one.     

Expression of MHC class II CD4+ and ED1 molecules in association with selective hippocampal neuronal degeneration after long-term adrenalectomy

The neuroendocrine and the immune systems are interconnected. Monoclonal antibodies against major histocompatibility complex (MHC) class I, class II, CD4, CD8, pan T cells, and macrophages were used for immunostaining brains from adrenalectomized (ADX) and shamoperated rats to investigate the potential involvement of the immune/inflammatory mechanisms in the neurodegeneration of hippocampus after ADX. Our results demonstrate upregulation of MHC class II, CD4 antigens and activated microglial marker-ED1 expression selectively in the hippocampus after ADX. The absence of CD5 reactivity precludes that these activated cells were T lymphocytes. The activated microglial cells may either be instrumental in the hippocampal neuronal loss or activated secondarily to the neuronal degeneration after long-term adrenalectomy.     

Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization

Cu-containing solder alloys have been used to identify their interfacial reactions with electroless NiP. As-reflowed, AuSn₄ intermetallic compounds (IMCs) are formed in the Sn-Cu and Sn-Ag-Cu solders, but in the cases of Sn-Ag-Cu-In, In-Sn-Au IMCs are formed and are uniformly distributed in the solder. Different types of IMCs such as high-Cu (>30 at.%), medium-Cu (30-15 at.%), and low-Cu (<15 at.%) containing IMCs are formed at the interface. High-Cu and medium-Cu containing ternary intermetallic compounds (TIMCs) are found in the Sn-Cu and Sn-Ag-Cu solder joints, respectively. Medium-Cu containing quaternary intermetallic compounds (QIMCs) are found in the Sn-Ag-Cu-In joints. Initially, TIMCs and QIMCs have higher growth rates, resulting in the entrapment of some Pb-rich phase in the high-Cu containing TIMCs and some In-Sn-Au phase in the QIMCs. High-Cu containing TIMCs have a lower growth rate and consume less of the NiP layer. The spalling of medium-Cu containing TIMCs in the Sn-Ag-Cu solder increases both the growth rate of TIMCs and the consumption rate of the NiP layer. Low-Cu containing QIMCs in the Sn-Ag-Cu-In solder are stable on P-rich Ni and reduce the dissolution rate of the NiP layer. Consumption of the NiP layer can be reduced by adding Cu or In, because of the changes of the interfacial IMCs phases, which are stable and adhere well to the P-rich Ni layer during reflow.