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51.
结合工程实例,介绍了我国第一座可拆装高架火炬的基本原理及组成,并对可拆装高架火炬与普通高架火炬在安全、技术、安装、维修、占地面积、投资等方面进行了比较,还分析了高架火炬未来的发展趋势. 相似文献
52.
Soo Jin Kim Wha Young Lee Yeungho Park Wansoo Huh Young Gwan Ko 《Polymer Engineering and Science》2003,43(5):1011-1017
Supported zirconcene catalysts on a new support, MgO, were prepared and tested in ethylene polymerization. Three types of impregnation methods were employed to find an optimum supporting method for MgO. The direct impregnation of Cp2ZrCl2 on MgO showed low metal loading and polymerization activity, while the catalyst had a higher metal loading and polymerization activity when MgO was treated with methylaluminoxane (MAO) before supporting. Treatment of MgO with MAO during the supporting step invoked two types of catalytic sites, which was evidenced by the bimodal molecular weight distribution of the polymer products. MgO is considered to have potential as a support for metallocenes. 相似文献
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54.
Jin Tae Kim Keun Byoung Yoon Choon-Gi Choi 《Photonics Technology Letters, IEEE》2004,16(7):1664-1666
A novel fabrication process using a hot embossing technique has been developed for micromechanical passive alignment of polymer planar lightwave circuit (PLC) devices. With only one step of embossing, single-mode waveguide straight channels and micropedestals for passive aligning are simultaneously defined on a polymer thin film with an accuracy of /spl plusmn/0.5 /spl mu/m. This process reduces the steps for fabricating alignment structures. A fabricated polymer PLC chip and fibers are combined on a v-grooved silicon optical bench (SiOB) in a flip-chip manner. The process provides a coupling loss as low as 0.67 dB per coupling face and a cost-effective packaging solution for various polymer PLC devices. 相似文献
55.
Shi-Jin Ding Hang Hu Lim H.F. Kim S.J. Yu X.F. Chunxiang Zhu Li M.F. Byung Jin Cho Chan D.S.H. Rustagi S.C. Yu M.B. Chin A. Dim-Lee Kwong 《Electron Device Letters, IEEE》2003,24(12):730-732
For the first time, we successfully fabricated and demonstrated high performance metal-insulator-metal (MIM) capacitors with HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectric using atomic layer deposition (ALD) technique. Our data indicates that the laminate MIM capacitor can provide high capacitance density of 12.8 fF//spl mu/m/sup 2/ from 10 kHz up to 20 GHz, very low leakage current of 3.2 /spl times/ 10/sup -8/ A/cm/sup 2/ at 3.3 V, small linear voltage coefficient of capacitance of 240 ppm/V together with quadratic one of 1830 ppm/V/sup 2/, temperature coefficient of capacitance of 182 ppm//spl deg/C, and high breakdown field of /spl sim/6 MV/cm as well as promising reliability. As a result, the HfO/sub 2/-Al/sub 2/O/sub 3/ laminate is a very promising candidate for next generation MIM capacitor for radio frequency and mixed signal integrated circuit applications. 相似文献
56.
57.
Combining ideal beamforming and Alamouti space-time block codes 总被引:3,自引:0,他引:3
The simplest Alamouti space-time block code is coupled with a larger number of transmit antennas via ideal beamforming to achieve higher diversity gain. It is shown that the combined system can remain both full diversity and full code rate without orthogonality loss. Simulation results show a significant performance gain over the conventional space-time block codes. 相似文献
58.
A new process for solid phase crystallization (SPC) of amorphous silicon (a-Si) using thin film heater is reported. With this localized Ti silicide thin film heater, we successfully crystallized 500 Å-thick a-Si in a few minutes without any thermal deformation of glass substrate. The size of crystallized silicon grain was abnormally big (30-40 μm). Polycrystalline thin film transistors (TFT) fabricated using this unique thin film heater showed better mobility than those of conventional ones by furnace annealing. 相似文献
59.
珠光体球化的分形研究 总被引:7,自引:2,他引:5
珠光体球化反映到金相上,是一种不规则图像的变化,并且具有分形的特征,可望用分形几何的方法来进行描述。以Cr-Mo钢的珠光体球化为例,用分形维数来描述珠光体球化程度;用小岛法对15CrMo钢的珠光体球化图谱进行了测量。实验表明,珠光体球化从1级到6级,其相应的分形维数范围为1.3156-1.9282。从电厂运行了10^5h的15CrMo钢管上取样,实测了该试样的珠光体球化等级,结果表明,以分形维数表示的球化程度与按图谱评定的球化等级完全吻合。 相似文献
60.