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31.
The catalytic activities of alumina prepared from an Al alkoxide-amine adduct monomer for the reaction of cyclopentene oxide with piperidine was determined after various pretreatments, including calcination and exposure to moisture. They were compared with the activity of alumina prepared by the conventional hydrolysis method. It was found that the as-prepared sample from the alkoxide-amine monomer preparation was five times more active than a conventional preparation, suggesting that it has a higher density of surface Lewis acid sites. However, its activity was much more severely suppressed by exposure to moisture. 相似文献
32.
A decision support system for interactive decision making - Part II: analysis and output interpretation 总被引:2,自引:0,他引:2
Liping Fang K.W. Hipel D.M. Kilgour Xiaoyong Peng 《IEEE transactions on systems, man and cybernetics. Part C, Applications and reviews》2003,33(1):56-66
For pt.I see ibid., p.42-55 (2003). The development of a comprehensive decision support system, GMCR II, for the systematic study of real-world interactive decision problems is presented. The companion paper (Part I), discusses how GMCR II elicits, stores, and manages conflict models; here (Part II), the focus is on GMCR IIs analysis and output interpretation subsystems. Specifically, this paper describes the powerful and efficient analysis engine contained in GMCR II, its informative output presentation and interpretation facilities, and a number of follow-up analyses. Furthermore, an illustrative case study is used to demonstrate how GMCR II can be conveniently applied in practice. 相似文献
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35.
Chong D. Y. R. Lim B. K. Rebibis K. J. Pan S. J. Sivalingam K. Kapoor R. Sun A. Y. S. Tan H. B. 《Advanced Packaging, IEEE Transactions on》2006,29(4):674-682
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported 相似文献
36.
In this paper, we propose a routing algorithm called minimum fusion Steiner tree (MFST) for energy efficient data gathering with aggregation (fusion) in wireless sensor networks. Different from existing schemes, MFST not only optimizes over the data transmission cost, but also incorporates the cost for data fusion, which can be significant for emerging sensor networks with vectorial data and/or security requirements. By employing a randomized algorithm that allows fusion points to be chosen according to the nodes' data amounts, MFST achieves an approximation ratio of 5/4log(k + 1), where k denotes the number of source nodes, to the optimal solution for extremely general system setups, provided that fusion cost and data aggregation are nondecreasing against the total input data. Consequently, in contrast to algorithms that only excel in full or nonaggregation scenarios without considering fusion cost, MFST can thrive in a wide range of applications 相似文献
37.
宽带DDS跳频源设计 总被引:1,自引:0,他引:1
直接数字合成(DDS)简单可靠、控制方便,具有很高的频率分辨率,高速转换,非常适合快速跳频的要求。在对DDS基本原理进行了简要介绍和分析后,提出宽带跳频源设计方案。 相似文献
38.
The present work deals with the modelling of damage behaviour for sheet moulding compound (SMC) composite materials using a finite element analysis package. Specifically, a comparison is made between the results obtained experimentally for a three-point bending test, and those obtained from numerical simulation using a material model already implemented. The simulation has been performed for the material models available within the PAM-CRASH software. The simulation results are compared and validated with respect to experimentation. 相似文献
39.
Yu. V. Baldokhin V. V. Vavilova P. Ya. Kolotyrkin Yu. K. Kovneristyi N. A. Palii A. S. Solomatin 《Inorganic Materials》2003,39(6):562-567
Mössbauer effect measurements and physicochemical analysis demonstrate that annealing of amorphous Fe–P–Mn alloys leads to the formation of a nanocrystalline structure. 相似文献
40.
H. L. Du S. R. Rose Z. D. Xiang P. K. Datta X. Y. Li 《Materialwissenschaft und Werkstofftechnik》2003,34(4):421-426
The oxidation/sulphidation behaviour of a Ti‐46.7Al‐1.9W‐0.5Si alloy with a TiAl3 diffusion coating was studied in an environment of H2/H2S/H2O at 850oC. The kinetic results demonstrate that the TiAl3 coating significantly increased the high temperature corrosion resistance of Ti‐46.7Al‐1.9W‐0.5Si. The SEM, EDX, XRD and TEM analysis reveals that the formation of an Al2O3 scale on the surface of the TiAl3‐coated sample was responsible for the enhancement of the corroison resistance. The Ti‐46.7Al‐1.9W‐0.5Si alloy was also modified by Nb ion implantation. The Nb ion implanted and as received sampels were subjected to cyclic oxidation in an open air at 800oC. The Nb ion implantation not only increased the oxidation resistance but also substantially improved the adhesion of scale to the substrate. 相似文献