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51.
Ping Liu Zheng-Fan Li Guo-Bing Han 《Electromagnetic Compatibility, IEEE Transactions on》2006,48(3):485-492
In this paper, the asymptotic waveform evaluation (AWE) technique is first applied to the conventional eigenmode expansion method for characterizing a power/ground (P/G) plane pair and analyzing the simultaneous switching noise on such plane pairs for printed circuit boards or multichip modules. The application of AWE avoids a large number of iterations in computing the impedance frequency response of a P/G plane pair structure and greatly reduces the computation time. Meanwhile, to obtain an accurate solution in an entire frequency range, we employ the complex frequency hopping technique which can help select multiple expansion points. In addition, the proposed approach can also be used to characterize the P/G plane pair structures with irregular shapes. Three examples demonstrate its high efficiency and good accuracy. 相似文献
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Mikio Miyake Katsuyuki Takahashi Jun Higashine Masakatsu Nomura 《Fuel Processing Technology》1992,30(3):205-213
A series of mixtures of Japanese subbituminous Taiheiyo coal and Athabasca oil sand bitumen (AOB) with various coal concentrations (0–100 wt%) was coprocessed in a 70 ml autoclave at 420°C for 1 h in the presence of H2 (50 kg/cm2 at room temperature) and sulfided Ni---Mo/Al2O2 catalyst. The mixture containing 2 wt% coal produced the largest amount of hexane soluble fraction (HS) and the smallest amount of benzene insoluble fraction (BI). Thus, a synergistic liquid production occurred for this mixture with 2 wt% coal by suppressing the retrogressive reactions which proceeded for pure AOB. The HS obtained from mixtures with 2–30 wt% showed higher H/C ratios and lower heteroatom contents than those obtained from pure AOB and the mixtures with more than 30 wt% coal. The amounts of transferable hydrogen contained in the mixtures were estimated using anthracene as a hydrogen acceptor. The mixtures with 2–10 wt% coal contained higher amounts of donor hydrogen than pure AOB. The HS yield from the various mixtures was correlated with the amount of donor hydrogens contained in the mixtures, except for the mixture with 10 wt% coal. Thus, the important factor which results in synergism is suggested to be the amount of donor hydrogens contained in the feed mixtures. 相似文献
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Constrained Drying of Aqueous Yttria-Stabilized Zirconia Slurry on a Substrate. I: Drying Mechanism 总被引:1,自引:0,他引:1
Aqueous yttria-stabilized zirconia slurry was cast on a substrate to form wet coatings. Both weight loss and thickness reduction were measured, during the drying process. Lateral drying was observed by in situ monitoring of the coating surface. The drying kinetics were classified as an initial constant rate period (CRP), followed by a falling rate period (FRP). Thickness reduction occurred in the CRP stage, and was uneven across the coating because of lateral flow. As tensile stresses developed within the coating because of the constrained volume shrinkage, crack formation and propagation occurred in the FRP stage and affected the drying rate. 相似文献
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Demir H.V. Jun-Fei Zheng Sabnis V.A. Fidaner O. Hanberg J. Harris J.S. Jr. Miller D.A.B. 《Semiconductor Manufacturing, IEEE Transactions on》2005,18(1):182-189
This work reports an easy planarization and passivation approach for the integration of III-V semiconductor devices. Vertically etched III-V semiconductor devices typically require sidewall passivation to suppress leakage currents and planarization of the passivation material for metal interconnection and device integration. It is, however, challenging to planarize all devices at once. This technique offers wafer-scale passivation and planarization that is automatically leveled to the device top in the 1-3-/spl mu/m vicinity surrounding each device. In this method, a dielectric hard mask is used to define the device area. An undercut structure is intentionally created below the hard mask, which is retained during the subsequent polymer spinning and anisotropic polymer etch back. The spin-on polymer that fills in the undercut seals the sidewalls for all the devices across the wafer. After the polymer etch back, the dielectric mask is removed leaving the polymer surrounding each device level with its device top to atomic scale flatness. This integration method is robust and is insensitive to spin-on polymer thickness, polymer etch nonuniformity, and device height difference. It prevents the polymer under the hard mask from etch-induced damage and creates a polymer-free device surface for metallization upon removal of the dielectric mask. We applied this integration technique in fabricating an InP-based photonic switch that consists of a mesa photodiode and a quantum-well waveguide modulator using benzocyclobutene (BCB) polymer. We demonstrated functional integrated photonic switches with high process yield of >90%, high breakdown voltage of >25 V, and low ohmic contact resistance of /spl sim/10 /spl Omega/. To the best of our knowledge, such an integration of a surface-normal photodiode and a lumped electroabsorption modulator with the use of BCB is the first to be implemented on a single substrate. 相似文献
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