Mechanical strengthening of Si cantilever by chemical KOH etching and its surface analysis by TEM and AFM

Mechanical strengthening of a Si cantilever by applying KOH wet etching was investigated. Two kinds of Si cantilever specimens having the different crystallographic orientations of the sidewall surfaces, i.e., Si{100} and Si{110}, were fabricated from the same SOI wafer by a Bosch process. The typical height and pitch of the scalloping formed on the sidewall were 248 and 917 nm, respectively. A 50 % KOH (40 °C) chemical wet etching was applied to increase the fracture stress of the Si cantilever. The fracture stress in the both of Si{100} and Si{110} cantilevers increased with the advance of the etching. The obtained maximum fracture stress in Si{100} and Si{110} were 4.2 and 3.7 GPa, respectively. Sidewall surface of the cantilever was analyzed to investigate the mechanical strengthening of Si cantilever by wet etching. The etched surface crystalline was analyzed by the transmission electron microscope (TEM), and confirmed that the thickness of the affected flow layer was less than 10 nm from the obtained TEM image. Then the change of the surface roughness by the KOH etching was analyzed by the atomic force microscope. The surface was smoothened with the advance of the KOH etching. The roughness value of Ra in Si{100} and Si{110} decreased to 12.1 and 37.7 nm, respectively.     

Nonlinear control for rotational movement of cart-pendulum system using homoclinic orbit

In this paper, we deal with the control method for rotational movements of a pendulum using a separatrix. We design a controller that attains a homoclinic motion or a heteroclinic motion of the pendulum and the asymptotic stability of the cart by using a kind of forwarding control design. First, we derive a controller that converges to a homoclinic orbit via a Lyapunov function of the pendulum subsystem. Next, we give a nonlinear stabilizing controller via another Lyapunov function of the cart subsystem. Moreover, using the third Lyapunov function and adding a complementary control input, we guarantee that the pendulum converges to the homoclinic orbit and the cart is stabilized. Finally, the simulation and the experiment using the rapid controller prototyping system based on MATLAB/Simulink are performed to demonstrate the forward upward circling and the giant swing of the pendulum.     

A new optical elasticity resin for mobile LCD modules

Abstract— The display used in current cell phones has an air gap between the cover glass and the liquid‐crystal‐display (LCD) module to prevent the LCD glass from being damaged. Reflections at the boundaries of the air gap cause a reduction in the LCD luminance and contrast. To address this problem, a newly proposed LCD structure has been investigated. The “Super View Resin (SVR),” a transparent elastic resin which improves the shock resistance and visibility of the LCD, has been developed. Filling the air gap between the cover glass and LCD module with a refractive‐index‐matching resin solves the light‐reflection problem inherent in the use of a reinforced cover‐glass lens. Moreover, the elastic filler works as a damper, reducing any external shock, which prevents not only the cover glass and LCD module from being damaged, but also the glass from being shattered when it is broken.     

Magnetic order and evolution of the electronic state aroundx=0.12 in La2?xBaxCuO4 and La2?xSrxCuO4

Muon spin rotation ( ⁺SR) measurement provides clear evidence of the antiferromagnetic order of Cu moments below 35 K for La_2–x Ba _x CuO₄ and below 15 K for La_2–x Sr _x CuO₄ in the narrow range ofx where the high-T _c superconductivity (SC) is suppressed remarkably. The results suggest that the change of the electronic state coupled with the lattice instability is relevant to the local suppression of SC and freezing of spin fluctuations of the Cu moment.     

Metal Single-Atom Cocatalyst on Carbon Nitride for the Photocatalytic Hydrogen Evolution Reaction: Effects of Metal Species

Single-atom (SA) catalysts exhibit high activity in various reactions because there are no inactive internal atoms. Accordingly, SA cocatalysts are also an active research fields regarding photocatalytic hydrogen (H₂) evolution which can be generated by abundant water and sunlight. Herein, it is investigated whether 10 transition metal elements can work as an SA on graphitic carbon nitride (g-C₃N₄; i.e., gCN), a promising visible-light-driven photocatalyst. A method is established to prepare SA-loaded gCN at high loadings (weight of ≈3 wt.% for Cu, Ni, Pd, Pt, Rh, and Ru) by modulating the photoreduction power. Regarding Au and Ag, SAs are formed with difficulty without aggregation because of the low binding energy between gCN and the SA. An evaluation of the photocatalytic H₂-evolution activity of the prepared metal SA-loaded gCN reveals that Pd, Pt, and Rh SA-loaded gCN exhibits relatively high H₂-evolution efficiency per SA. Transient absorption spectroscopy and electrochemical measurements reveal the following: i) Pd SA-loaded gCN exhibits a particularly suitable electronic structure for proton adsorption and ii) therefore they exhibit the highest H₂-evolution efficiency per SA than other metal SA-loaded gCN. Finally, the 8.6 times higher H₂-evolution rate per active site of Pd SA is achieved than that of Pd-nanoparticles cocatalyst.     

Gap symmetry and intrinsic intraplane pinning of untwinned YBa2Cu3O7 single crystals

The interplane (cb) and intraplane (ab) anisotropy of untwinned YBa₂ Cu₃0₇ single crystals has been investigated by means of the torque magnetometry. To extract the reversible and irreversible components, the torque was measured as a function of increasing angle as well as decreasing angle. The interplane irreversible torque _irr shows two-fold peaks at _c =90 ° and270 ° (of half width11 ° at77 K) due to the well-known intrinsic interplane pinning. A novel intrinsic pinning has been discovered in the intraplane irreversible torque, i.e., _irr shows four-fold peaks of half width20° at77 K when _a =0 °, 90 °, 180 ° and270 °. We argue that the intrinsic intraplane pinning comes from the four-fold nature of the gap parameter.     

Fabrication of X-rays mask with carbon membrane for diffraction gratings

We have produced diffraction gratings for obtaining high resolution X-ray phase imaging, such as X-ray Talbot interferometer. These diffraction gratings were required to have a fine, high accuracy, high aspect ratio structure. Therefore, we decided to use the X-rays lithography technique that used synchrotron radiation of the directivity for a manufacture process. The accuracy of the completed structure depends largely on the accuracy of the X-ray mask. In our group, a resin material is conventionally used for the membrane of large X-ray masks. However, X-ray masks comprising a resin membrane have the disadvantage that, after several cycles of X-ray exposure, they crease and sag due to X-ray-derived heat. As a substitute for the conventional resin membrane, we experimentally fabricated a new X-ray mask using a carbon wafer membrane. The newly fabricated X-ray mask was subjected to X-ray exposure experiment. We succeeded in making the structure body which was almost shape. And the experimental results verified that the new mask did not deteriorate even when used repeatedly, demonstrating that it was highly durable.     

Fabrication of high hardness Ni mold with electroless nickel–boron thin layer

The nickel electroforming method using a high-concentration nickel sulfamate bath is commonly used to fabricate micro metal molds in the LIGA process; however, this method does not produce micro metal molds of sufficient hardness. One means of improving the hardness of micro metal molds made using the nickel electroforming method is to include additives in the nickel plating solution. Another method is nickel alloy plating or a similar technique. In this research, we used a nickel–boron (Ni–B) electroless alloy plating method to obtain a hard nickel plated film having hardness of 832 Hv. It was also ascertained that Ni–B electroless alloy plated film retains its high hardness even during heat treatment in conditions of 250°C for 1 h. To deal with the high stresses developed in high-hardness plated films, we proposed double-layer nickel electroforming. This method is covered and used on conventional nickel electroforming layer by high hardness micro mold. High hardness micro metal mold using double-layer was fabricated by nickel electroforming and Ni–B electroless alloy plating method.     

Trends in highly scalable crossbar-based packet switch architecture

A combined input and crosspoint queued (CICQ) switch is receiving significant attention to be the next generation high speed packet switch for its scalability; however, a multi-cabinet implementation of a combined input and crosspoint queued (CICQ) switch unavoidably introduces a large round-trip time (RTT) latency between the line cards and switch fabric, resulting a large crosspoint (CP) buffer requirement. In this paper, virtual crosspoint queues (VCQs) that significantly reduces the CP buffer requirement of the CICQ switch is investigated. The VCQs unit resides inside the switch fabric, is dynamically shared among virtual output queues (VOQ) from the same source port, and is operated at the line rate, making the implementation practical. A threshold-based exhaustive round-robin (T-ERR) arbitration is employed to reduce buffer hogging at VCQ. The T-ERR at VCQ and CP arbiters serves packets residing in a longer queue more frequently than packet residing in a shorter queue. Consequently, the T-ERR, drastically increases the throughput of the CICQ switch with small CP buffers. A multi-cabinet implementation of CICQ switch do not support multicasting traffic well since a combination of small CP buffer in the switch fabric and a large RTT latency between the line cards and switch fabric results in non-work conservation of the intra-switch link. Deployment of multicast FIFO buffer between the input buffer and CP buffer shows a promise. With its ability to achieve high throughput independent of RTT and switch port size, the integration of the VCQ architecture and T-ERR scheduler to the CICQ switch is ideal for supporting ever-increasing Internet traffic that requires higher data rate, larger switch size, and efficient multicasting.