基于分段凿孔的极化码级联方案

极化码拥有出色的纠错性能,但编码方式决定了其码长不够灵活,需要通过凿孔构造码长可变的极化码。该文引入矩阵极化率来衡量凿孔对极化码性能的影响,选择矩阵极化率最大的码字作为最佳凿孔模式。对极化码的码字进行分段,有效减小了最佳凿孔模式的搜索运算量。由于各分段的第1个码字都会被凿除,且串行抵消译码过程中主要发生1位错,因此在各段段首级联奇偶校验码作为译码提前终止标志,检测前段码字的译码错误并进行重新译码。对所提方法在串行抵消译码下的性能进行仿真分析,结果表明,相比传统凿孔方法,所提方法在10^–3误码率时能获得约0.7 dB的编码增益,有效提升了凿孔极化码的译码性能。     

SPIHT嵌入式编码算法在图像压缩中的应用

介绍了小波提升的基本原理及其实现流程,分析和比较了小波提升和Mallat算法在图像压缩中的应用,并将9/7提升小波应用在SPIHT嵌入式图像编码中。实验结果表明,该算法具有低复杂、高保真的特点。     

数字移动通信系统中认证协议的设计与分析

该文针对数字移动通信系统的背景和需求, 基于公钥密码体制设计了一个端端密钥分发协议,基于对称密码体制设计了一个身份认证协议,并利用Spi演算对身份认证协议进行了分析,证明了其安全性。     

基于ARMA的无线传感器网络流量预测模型的研究

无线传感器网络(WSN)的流量预测研究对于WSN管理具有至关重要的意义。基于WSN的特点,结合自回归滑动平均(ARMA)模型,该文提出了一个面向WSN的流量预测算法。仿真结果表明,该算法具有较高的预测精度;利用本算法对WSN的多路径路由机制进行改进后,可进一步提高WSN的生存期。     

基于正则化处理的超分辨率重建

针对超分辨率重建的病态反问题进行研究。该文首先介绍超分辨率重建的数学模型,分析了最小二乘估计及其病态性。其次给出病态问题的正则化泛函,并提出一种自适应动态确定正则化系数的方法,主要研究了迭代算法的收敛性和参数选择等问题。实验结果验证了方法的有效性。     

考虑次级电子的行波管多级降压收集极的辅助设计计算

文中较全面地讨论了多级降压收集极的物理模型.借助Orion(2.5维)软件设计出效率较高的带有再聚焦系统的四级降压收集极,并考虑了次级电子的影响,模拟计算多级降压收集极和再聚焦区的性能,为行波管整管效率的提高提供了保证.     

Wavelength and repetition rate tunable optical pulse source using a chirped fiber Bragg grating and a nonlinear optical loop mirror

We experimentally demonstrate a simple and novel scheme for tunable real-repetition-rate multiplication, based on the combined use of fractional Talbot effect in a linearly tunable chirped fiber Bragg grating (FBG) and cross-phase modulation (XPM) effect in a nonlinear optical loop mirror (NOLM). By tuning the group-velocity dispersion of the chirped FBG fabricated with the S-bending method using a uniform FBG, we obtain high quality pulses at pseudorepetition rates of 20/spl sim/50 GHz from an original 8.5-ps 10-GHz soliton pulse train. We subsequently convert this pseudorate multiplication into a real-rate multiplication using XPM effect in an NOLM. A wavelength tuning is also achieved over a /spl sim/15-nm range.     

Board-level reliability of Pb-free solder joints of TSOP and various CSPs

To evaluate various Pb-free solder systems for leaded package, thin small outline packages (TSOPs) and chip scale packages (CSPs) including leadframe CSP (LFCSP), fine pitch BGA (FBGA), and wafer level CSP (WLCSP) were characterized in terms of board level and mechanical solder joint reliability. For board level solder joint reliability test of TSOPs, daisy chain samples having pure-Sn were prepared and placed on daisy chain printed circuit board (PCB) with Pb-free solder pastes. For CSPs, the same composition of Pb-free solder balls and solder pastes were used for assembly of daisy chain PCB. The samples were subjected to temperature cycle (T/C) tests (-65/spl deg/C/spl sim/150/spl deg/C, -55/spl deg/C/spl sim/125/spl deg/C, 2 cycles/h). Solder joint lifetime was electrically monitored by resistance measurement and the metallurgical characteristics of solder joint were analyzed by microstructural observation on a cross-section sample. In addition, mechanical tests including shock test, variable frequency vibration test, and four point twisting test were carried out with daisy chain packages too. In order to compare the effect of Pb-free solders with those of Sn-Pb solder, Sn-Pb solder balls and solder paste were included. According to this paper, most Pb-free solder systems were compatible with the conventional Sn-Pb solder with respect to board level and mechanical solder joint reliability. For application of Pb-free solder to WLCSP, Cu diffusion barrier layer is required to block the excessive Cu diffusion, which induced Cu trace failure.     

部分耗尽SOI体接触nMOS器件的关态击穿特性

分别采用具有硅化物和不具有硅化物的SOI工艺制成了部分耗尽SOI体接触nMOS晶体管.在体接触浮空和接地的条件下测量了器件的关态击穿特性.通过使用二维工艺器件模拟,并测量漏体结的击穿特性,详细讨论和分析了所制成器件击穿特性的差异和击穿机制.在此基础上,提出了一个提高PD-SOI体接触nMOS击穿特性的方法.     

全耗尽SOI MOSFETs阈值电压解析模型

提出了一种新的全耗尽SOI MOSFETs阈值电压二维解析模型.通过求解二维泊松方程得到器件有源层的二维电势分布函数,氧化层-硅界面处的电势最小值用于监测SOI MOSFETs的阈值电压.通过对不同栅长、栅氧厚度、硅膜厚度和沟道掺杂浓度的SOI MOSFETs的MEDICI模拟结果的比较,验证了该模型,并取得了很好的一致性.