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101.
Dual command travel times and miniload system throughput with turnover-based storage 总被引:2,自引:0,他引:2
Byung Chun Park Robert D. Foley John A. White Edward H. Frazelle 《IIE Transactions》2003,35(4):343-355
We analyze travel times for automated storage/retrieval systems. In particular, we apply our travel time model to turnover-based storage systems and determine the mean and variance of dual command travel times. We present detailed numerical results for selected rack shape factors and ABC inventory profiles. We then investigate the effect of alternative rack configurations on travel time performance measures. We also show how to determine the throughput of miniload systems with turnover-based storage and exponentially distributed pick times. 相似文献
102.
在分析了双极型晶体管和场效应晶体管各自的特点和不足后,介绍了一种既具有双极型晶体管较大电流容量和功率输出,又具有场效应晶体管高输入阻抗的电子器件——双极MOS场效应晶体管(BJMOSFET),同时指出体硅BJMOSFET的阳极扩散区与衬底之间存在较大的漏电流,可产生较大的寄生效应。提出了一种新型固体电子器件——基于SOI的BJMOSFET,分析了其工作原理j与体硅BJMOSFET比较,由于SOI技术完整的介质隔离避免了体硅器件中存在的大部分寄生效应,使基于SOI的BJMOSFET在体效应、热载流子效应、寄生电容、短沟道效应和闩锁效应等方面具有更优良的特性。 相似文献
103.
This letter presents our investigation for the effect of symbol timing errors in orthogonal frequency-division multiple access (OFDMA) uplink systems. We express the symbol timing errors between users as the symbol timing misalignments with respect to the desired user. Then, we derive an explicit expression of the signal-to-noise ratio (SNR) as a function of the maximum value of the symbol timing misalignments. Analyses and simulation results show that, to achieve an SNR of 20 dB, the maximum value of the symbol timing misalignments must be less than the cyclic prefix duration plus 6.25% of the useful symbol duration. Based on the resulting SNR degradation, we evaluate the SNR gain with guard subcarriers in order to mitigate the effect of the symbol timing misalignments. 相似文献
104.
H.S. Seo Y.G. Choi B.J. Park D.H. Cho K.H. Kim 《Photonics Technology Letters, IEEE》2003,15(9):1198-1200
A flat signal gain over in the entire C- and L-bands by erbium (Er) ions' radiative transition and stimulated Raman scattering in an Er-doped germano-silica fiber can be obtained if proper values of the concentration of Er and background loss in a fiber core are obtained during the fiber fabrication process. The optimized conditions for the flat C- and L-band gain are analyzed as functions of Er concentrations. Even for a low-gain value provided by a germano-silica core fiber with a low Er concentration and an optimum fiber length, a relatively low pump is required to obtain the flat gain band. 相似文献
105.
聚甲亚胺改性尼龙6复合材料的等温结晶动力学 总被引:6,自引:0,他引:6
采用差示扫描量热法(DSC)对聚甲亚胺(PAM)/尼龙6复合材料等温结晶过程进行了研究。结果表明,PAM的加入使得基体的结晶速率增大,尤其是当含量为5%时,半结晶期明显减少。研究还发现,该体系的等温结晶过程完全可以用Avrami方程来描述,各试样的Avrami指数均在2-3之间,表明Avrami指数,球晶生长方式基本不受聚甲亚胺加入的影响。基体中原位形成的聚甲胺微纤起到了诱导结晶的作用,使得基体的结晶速率加快,但随着微纤含量的增加,由于分散性能变差而使得诱导结晶的能力减弱,表现为结晶速率又有所降低。 相似文献
106.
107.
108.
Dong-Soo Yoon Jae Sung Roh Sung-Man Lee Hong Koo Baik 《Journal of Electronic Materials》2003,32(8):890-898
The effect of a thin RuOx layer formed on the Ru/TiN/doped poly-Si/Si stack structure was compared with that on the RuOx/TiN/doped poly-Si/Si stack structure over the post-deposition annealing temperature ranges of 450–600°C. The Ru/TiN/poly-Si/Si
contact system exhibited linear behavior at forward bias with a small increase in the total resistance up to 600°C. The RuOx/TiN/poly-Si/Si contact system exhibited nonlinear characteristics under forward bias at 450°C, which is attributed to no
formation of a thin RuOx layer at the RuOx surface and porous-amorphous microstructure. In the former case, the addition of oxygen at the surface layer of the Ru film
by pre-annealing leads to the formation of a thin RuOx layer and chemically strong Ru-O bonds. This results from the retardation of oxygen diffusion caused by the discontinuity
of diffusion paths. In particular, the RuOx layer in a nonstoichiometric state is changed to the RuO2-crystalline phase in a stoichiometric state after post-deposition annealing; this phase can act as an oxygen-capture layer.
Therefore, it appears that the electrical properties of the Ru/TiN/poly-Si/Si contact system are better than those of the
RuOx/TiN/poly-Si/Si contact system. 相似文献
109.
110.
Chel-Jong Choi Tae-Yeon Seong Key-Min Lee Joo-Hyoung Lee Young-Jin Park Hi-Deok Lee 《Electron Device Letters, IEEE》2002,23(4):188-190
The leakage mechanism in p+/n shallow junctions fabricated using Co silicidation and shallow trench isolation processes has been investigated using transmission electron microscopy (TEM) combined with selective chemical etching. TEM and TSUPREM-4 simulation results show that dopant profiles bend upward near the edge of the active region. The formation of the abnormal profile is attributed to transient enhanced diffusion induced by source/drain implantation. Based on the TEM and simulation results, it is suggested that the shallower junctions formed near the active edge can serve as a source for leakage current in the silicided p+ /n shallow junctions 相似文献