Metal-semiconductor-metal photodetectors with InAlGaP capping and buffer layers

To improve the Schottky contact performance and carrier confinement of GaAs metal-semiconductor-metal photodetectors (MSM-PDs), we employed the wide bandgap material, In/sub 0.5/(Al/sub 0.66/Ga/sub 0.34/)/sub 0.5/P, for the capping and buffer layers. We directly evaluated the Schottky contact parameters on the MSM-PD structure. The reverse characteristics of the Schottky contacts were examined by taking into account the Schottky barrier height depended on the electric field in the depletion region, and hence on the applied bias. The ideality factor and Schottky barrier height of Ti-Pt-Au contacts to In/sub 0.5/(Al/sub 0.66/Ga/sub 0.34/)/sub 0.5/P are 1.02 and 1.05 eV, respectively. Extremely low dark currents of 70 and 620 pA were obtained for these MSM-PDs when they were operated at a reverse bias of -10 V at room temperature and at 70/spl deg/C, respectively.     

Manipulation of microenvironment with a built-in electrochemical actuator in proximity of a dissolved oxygen microsensor

Biochemical sensors for continuous monitoring require dependable periodic self diagnosis with acceptable simplicity to check its functionality during operation. An in-situ self-diagnostic technique for a dissolved oxygen microsensor is proposed in an effort to devise an intelligent microsensor system with an integrated electrochemical actuation electrode. With a built-in platinum microelectrode that surrounds the microsensor, two kinds of microenvironments, called the oxygen-saturated or oxygen-depleted phases, can be created by water electrolysis, depending on the polarity. The functionality of the microsensor can be checked during these microenvironment phases. The polarographic oxygen microsensor is fabricated on a flexible polyimide substrate (Kapton) and the feasibility of the proposed concept is demonstrated in a physiological solution. The sensor responds properly during the oxygen-generating and oxygen-depleting phases. The use of these microenvironments for in-situ self-calibration is discussed to achieve functional integration, as well as structural integration, of the microsensor system.     

Neutron Stress Measurement of W‐Fiber Reinforced Cu Composite

Stress measurement methods using neutron and X‐ray diffraction were examined by comparing the surface stresses with internal stresses in the continuous tungsten‐fiber reinforced copper‐matrix composite. Surface stresses were measured by X‐ray stress measurement with the sin²ψ method. Furthermore, the sin²ψ method and the most common triaxal measurement method using Hooke's equation were employed for internal stress measurement by neutron diffraction. On the other hand, microstress distributions developed by the difference in the thermal expansion coefficients between these two phases were calculated by FEM. The weighted average strains and stresses were compared with the experimental results. The FEM results agreed with the experimental results qualitatively and confirmed the importance of the triaxial stress analysis in the neutron stress measurement.     

Effective Reduction of Horizontal Error in Laser Scanning Information by Strip‐Wise Least Squares Adjustments

Though the airborne laser scanning (ALS) technique is becoming more popular in many applications, horizontal accuracy of points scanned by the ALS is not yet satisfactory when compared with the accuracy achieved for vertical positions. One of the major reasons is the drift that occurs in the inertial measurement unit (IMU) during the scanning. This paper presents an algorithm that adjusts for the error that is introduced mainly by the drift of the IMU that renders systematic differences between strips on the same area. For this, we set up an observation equation for strip‐wise adjustments and completed it with tie point and control point coordinates derived from the scanned strips and information from aerial photos. To effectively capture the tie points, we developed a set of procedures that constructs a digital surface model (DSM) with breaklines and then performed feature‐based matching on strips resulting in a set of reliable tie points. Solving the observation equations by the least squares method produced a set of affine transformation equations with 6 parameters that we used to transform the strips for adjusting the horizontal error. Experimental results after evaluation of the accuracy showed a root mean squared error (RMSE) of the adjusted strip points of 0.27 m, which is significant considering the RMSE before adjustment was 0.77 m.     

Corrosion fatigue of extruded magnesium alloys

Corrosion fatigue tests were carried out on extruded AZ31 (3% Al, 1% Zn, 0.3% Mn, Mg—the rest), AM50 (5% Al, 0.4% Mn, Mg—the rest) and ZK60 (5% Zn, 0.5% Zr, Mg—the rest) Mg alloys in air, NaCl-based and borate solutions. N_sol/N_air ratios (the relative fatigue life) were used for the analysis of the corrosion fatigue behavior of Mg alloys in various environments, where N_sol and N_air are the numbers of cycles to failure in the solution and in air, respectively. Extruded ZK60 alloy reveals very high fatigue and corrosion fatigue properties in comparison with other alloys. However, it has the lowest relative fatigue life (N_sol/N_air 10⁻³–10⁻²) or the highest sensitivity to the action of NaCl-based solutions in comparison with that of AM50 and AZ31 alloys (N_sol/N_air 10⁻²–10⁻¹). Under the same stress, the corrosion fatigue life of extruded alloys is significantly longer than that of die-cast alloys (N_sol for extruded AM50 in NaCl is two to three times longer than that of die-cast AM50).     

Analysis of tungsten and titanium migration during ESD contact burnout

A physical and chemical analysis of a machine model (MM) electrostatic discharge (ESD) failure in a silicon circuit was carried out. Focused ion beam (FIB) was used to make cross sections through the region of contact burnout. The resulting samples were analyzed using scanning electron microscopy (SEM) and two-dimensional (2-D) auger electron spectroscopic (AES) mapping. It is shown for the first time that both titanium (Ti) and tungsten (W) migrated throughout the melted silicon filament. Large pellets of the W plug were embedded in the bulk silicon but only on the cathode side of the junction. Mechanisms are discussed to explain these phenomena. These involve the melting of titanium disilicide (TiSi/sub 2/), dissolution of Ti and W in the molten silicon and the formation of W pellets through electromigration at temperatures below /spl sim/1800 K.     

Electrotunable Non‐reciprocal Laser Emission from a Liquid‐Crystal Photonic Device

A liquid crystal (LC) photonic device with an anisotropic optical heterojunction structure has been fabricated. The device has a phase‐retarding nematic LC (NLC) layer sandwiched between two polymer cholesteric LC films with right‐handed helices of different pitches. Electrotunable non‐reciprocal light transmittance and unidirectional circularly polarized (CP) lasing emission have been successfully demonstrated for this device structure. Two left CP (LCP) lasing emission peaks are observed at the edges of the overlapping region between the two photonic bands in the structure and are shifted upon the application of a voltage. In contrast, a non‐reciprocal right CP (RCP) lasing emission peak emerges at one of the band edges and diminishes upon the application of a voltage. These phenomena are interpreted based on the selective reflection of RCP light and the reorientation of the NLC molecules by the application of a voltage.     

A fiber depolarizer using polarization beam splitter loop structure for narrow linewidth light source

A new fiber depolarizer employing a polarization beam splitter loop structure is proposed and demonstrated. The depolarizer is devised for broad-band operation and the depolarization of narrow linewidth light source without any help of polarization controllers or Faraday rotator mirrors. A polarizing method is developed that shows good performance without polarization control unit. Therefore, the proposed depolarizer can be cost-effective and easily configured. From experiments, low output degree of polarization less than 10% is obtained for a narrow linewidth light source.     

Operation of HTS Toggle-Flip-Flop Circuit With Improved Layout Design

Toggle-flip-flop (T-FF) is one of the most important high-T_c superconducting single-flux quantum (HTS SFQ) circuit components and has been designed and fabricated by using YBa₂Cu₃ O_7-delta ramp-edge junction technology. The circuit layout of the T-FF was improved to suppress the junction critical current (I_c) spread in the circuit. Test circuits, which include a T-FF with a single output for evaluating the logic operation and measuring the operating frequency, were fabricated and their operation characteristics were investigated. The T-FF circuit with a single output was successfully operated and finite direct current (dc) supply current margins were obtained at temperatures from 27 to 34 K. Moreover, the maximum operating frequency of the T-FF was estimated to be 360 GHz at 4.2 K and 114 GHz at 41 K. In addition, reduction of dc supply current margins due to thermal noise was also investigated. According to the numerical simulation in which parasitic inductances were taken into account, the narrowest margin in the T-FF circuit wider than plusmn10% was maintained with a bit-error rate (BER) of 10^-6 up to 40 K