Thermomechanical finite-element model of shell behavior in continuous casting of steel

A coupled finite-element model, CON2D, has been developed to simulate temperature, stress, and shape development during the continuous casting of steel, both in and below the mold. The model simulates a transverse section of the strand in generalized plane strain as it moves down at the casting speed. It includes the effects of heat conduction, solidification, nonuniform superheat dissipation due to turbulent fluid flow, mutual dependence of the heat transfer and shrinkage on the size of the interfacial gap, the taper of the mold wall, and the thermal distortion of the mold. The stress model features an elastic-viscoplastic creep constitutive equation that accounts for the different responses of the liquid, semisolid, delta-ferrite, and austenite phases. Functions depending on temperature and composition are employed for properties such as thermal linear expansion. A contact algorithm is used to prevent penetration of the shell into the mold wall due to the internal liquid pressure. An efficient two-step algorithm is used to integrate these highly nonlinear equations. The model is validated with an analytical solution for both temperature and stress in a solidifying slab. It is applied to simulate continuous casting of a 120 mm billet and compares favorably with plant measurements of mold wall temperature, total heat removal, and shell thickness, including thinning of the corner. The model is ready to investigate issues in continuous casting such as mold taper optimization, minimum shell thickness to avoid breakouts, and maximum casting speed to avoid hot-tear crack formation due to submold bulging.     

Extracting Light from Polymer Light‐Emitting Diodes Using Stamped Bragg Gratings

In this paper, we describe a method for increasing the external efficiency of polymer light‐emitting diodes (LEDs) by coupling out waveguided light with Bragg gratings. We numerically model the waveguide modes in a typical LED structure and demonstrate how optimizing layer thicknesses and reducing waveguide absorption can enhance the grating outcoupling. The gratings were created by a soft‐lithography technique that minimizes changes to the conventional LED structure. Using one‐dimensional and two‐dimensional gratings, we were able to increase the forward‐directed emission by 47 % and 70 %, respectively, and the external quantum efficiency by 15 % and 25 %.     

Glycoconjugated polymer 6. Synthesis of poly[styrene-<Emphasis Type="Italic">block</Emphasis>-(styrene-<Emphasis Type="Italic">graft</Emphasis>-amylose)] via potato phosphorylase-catalyzed polymerization

Summary The potato phosphorylase-catalyzed polymerization of α-D-glucose-1-phosphate (G-1-P) onto poly[styrene-block-(4-vinylbenzyl maltohexaoside)] (1) was performed at the molar ratios of [G-l-P]₀ and [maltohexaose]₀ of 35, 80, and 250. The product was found to be soluble in dimethyl sulfoxide, which was a good solvent for amylose, and showed the complex-formation with iodine, indicating that the product was assignable to poly[styrene-block-(styrene-graft-amylose)] (2). The quantitative analysis of the liberated phosphoric acid gave the average degree of polymerization o f the glucose unit (n) as 27, 5 1, and 180 for 2-I, 2-II, and 2-III, respectively. Received: 29 November 2002/Accepted: 22 December 2002 Correspondence to Toyoji Kakuchi     

基于美国数字有线电视标准信道解码技术的DSP实现

介绍了美国数字有线电视传输标准以及一种采用DSP技术进行软件信道解码的方法，给出了所用关键技术和实现算法。使用软件信道解码方法，可以通过修改程序来满足不同信道处理要求，增强系统的灵活性。     

MULTICARRIER DS—CDMA WITH ADAPTIVE MODULATION AND POWER ALLOCATION

Adaptive modulation and power allocation is introduced into the multicarrier DSCDMA system to improve the system performance and bandwidth efficiency.First,the system design appropriate for adaptive modulation and power allocation is given,then the algorithm of adaptive modulation and power allocation is applied.Simulation results demonstrate great performance improvement compared with the fixed modulated one.     

Exchange-correlation errors at harmonic and anharmonic orders: the case of bulk Cu

As an aid towards improving the treatment of exchange and correlation effects in electronic structure calculations, it is desirable to have a clear picture of the errors introduced by currently popular approximate exchange-correlation functionals. We have performed ab initio density functional theory and density functional perturbation theory calculations to investigate the thermal properties of bulk Cu, using both the local density approximation (LDA) and the generalized gradient approximation (GGA). Thermal effects are treated within the quasiharmonic approximation. We find that the LDA and GGA errors for anharmonic quantities are an order of magnitude smaller than for harmonic quantities; we argue that this might be a general feature. We also obtain much closer agreement with experiment than earlier, more approximate calculations.     

Electronic properties of magnetically doped nanotubes

Effect of doping of carbon nanotubes by magnetic transition metal atoms has been considered in this paper. In the case of semiconducting tubes, it was found that the system has zero magnetization, whereas in metallic tubes the valence electrons of the tube screen the magnetization of the dopants: the coupling to the tube is usually antiferromagnetic (except for Cr).     

空间数据立方体的物化视图选择方法研究

针对决策支持系统(DSS)中集成空间分析能力的应用趋势，研究基于空间数据仓库的一种决策分析工具——空间在线分析处理(Spatial OLAP)，拟解决影响空间OLAP在线响应的瓶颈难点——空间数据立方体的物化问题。首先系统地提出空间OLAP的模型，然后对现有空间度量物化视图选择方法进行改进，提出了双向空间Greedy算法。实验证明．该算法在降低选择时间和求解质量两方面具有更好的表现。     

火成岩储层测井评价进展综述

十多年来,国内外火成岩储层测井评价已从交会图定性分析发展到用岩心分析资料建立裂缝性储层的测井解释模型，半定量、定量评价裂缝。成像测井和核磁测井的纵、横向分辨率高，经过地质刻度，可以较精细地识别岩性和裂缝，在解释火成岩方面有良好的效果。提高岩性识别准确率，识别复杂火成岩储层和孔隙流体，以及综合评价火成岩储层裂缝、饱和度等参数，仍然是火成岩储层测井评价所面临的难题。加强岩石物理基础实验，研究火成岩储层导电机理，系统研究火成岩储层测井评价理论，推广测井新技术在火成岩中的应用，建立统一的测井评价方法，将成为火成岩储层测井评价的发展趋势。     

1.8 V千兆以太网接收器模拟前端预均衡电路

介绍了一种用于1.8 V电源电压下的千兆以太网接收器的模拟前端预均衡电路。电路分为三个部分:预处理电路、基带漂移补偿电路和可变增益放大电路,主要实现回波消除、基带漂移补偿和电路增益自动控制等功能。为了与百兆模式兼容,提出了一种预处理电路。仿真结果表明,该电路可以很好地实现回波消除的功能,能够对由于基带漂移引起的信号失真给以补偿,可以提供16级不同的增益,并进行频率补偿。电路采用0.18μm标准CMOS工艺实现。