Opportunities and Challenges of Peer-to-Peer Internet Video Broadcast

There have been tremendous efforts and many technical innovations in supporting real-time video streaming in the past two decades, but cost-effective large-scale video broadcast has remained an elusive goal. Internet protocol (IP) multicast represented an earlier attempt to tackle this problem but failed largely due to concerns regarding scalability, deployment, and support for higher level functionality. Recently, peer-to-peer based broadcast has emerged as a promising technique, which has been shown to be cost effective and easy to deploy. This new paradigm brings a number of unique advantages such as scalability, resilience, and effectiveness in coping with dynamics and heterogeneity. While peer-to-peer applications such as file download and voice-over-IP have gained tremendous popularity, video broadcast is still in its early stages, and its full potential remains to be seen. This paper reviews the state-of-the-art of peer-to-peer Internet video broadcast technologies. We describe the basic taxonomy of peer-to-peer broadcast and summarize the major issues associated with the design of broadcast overlays. We closely examine two approaches - tree-based and data-driven - and discuss their fundamental tradeoff and potential for large-scale deployment. Lastly, we outline the key challenges and open problems and highlight possible avenues for future directions.     

Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis

In this paper, a transient nonlinear dynamic finite element framework is developed, which integrates the wire bonding process and the silicon devices under bond pad. Two major areas are addressed: one is the impact of assembly 1st wire bonding process and another one is the impact of device layout below the bond pad. Simulation includes the ultrasonic transient dynamic bonding process and the stress wave transferred to bond pad device and silicon in the 1st bond. The Pierce strain rate dependent model is introduced to model the impact stain hardening effect. Ultrasonic amplitude and frequency are studied and discussed for the bonding process. In addition, different layouts of device metallization under bond pad are analyzed and discussed for the efforts to reduce the dynamic impact response of the bond pad over active design. Modeling discloses the stress and deformation impacts to both wire bonding and pad below device with strain rate, different ultrasonic amplitudes and frequencies, different friction coefficients, as well as different bond pad thickness and device layout under pad. The residual stress, after cooling down to a lower temperature, is discussed for the impact of substrate temperature.     

A 0.2 V, 480 kb Subthreshold SRAM With 1 k Cells Per Bitline for Ultra-Low-Voltage Computing

A 2 muW, 100 kHz, 480 kb subthreshold SRAM operating at 0.2 V is demonstrated in a 130 nm CMOS process. A 10-T SRAM cell allows 1 k cells per bitline by eliminating the data-dependent bitline leakage. A virtual ground replica scheme is proposed for logic "0" level tracking and optimal sensing margin in read buffers. Utilizing the strong reverse short channel effect in the subthreshold region improves cell writability and row decoder performance due to the increased current drivability at a longer channel length. The sizing method leads to an equivalent write wordline voltage boost of 70 mV and a delay improvement of 28% in the row decoder compared to the conventional sizing scheme at 0.2 V. A bitline writeback scheme was used to eliminate the pseudo-write problem in unselected columns.     

A Compact SOI-Integrated Multiwavelength Laser Source Based on Cascaded InP Microdisks

We report on the performance of a compact multi- wavelength laser (MWL) source heterogeneously integrated with and coupled to a silicon-on-insulator (SOI) waveguide circuit. The MWL consists of four InP-based microdisk lasers, coupled to a common SOI wire waveguide. The microdisk lasers operate in continuous-wave regime at room temperature, with a threshold current around 0.9 mA and a waveguide-coupled slope efficiency of up to 8 muW/mA, for a microdisk diameter of 7.5 mum. The output spectrum contains four laser peaks uniformly distributed within the free-spectral range of a single microdisk. While thermal crosstalk is negligible, laser peak output powers vary up to 8 dB for equal microdisk drive currents, as a result of loss due to coupling with higher order modes supported by the 1-mum-thick microdisks. This nonuniformity could be eliminated by reducing the microdisk thickness.     

几种TCP协议下F、G函数的研究

随着网络技术的不断提高,一些新型的高速网络投入使用,产生了一系列如TCP拥塞控制算法,其中Reno协议、Vegas协议、RED协议以不同的方式解决了网络拥塞的问题。通过在以上3种协议模型下对F、G函数进行推导,用对偶方程求解的方法,比较3种协议的优劣,为网络模型的建立打下基础。     

太原有线电视数字化服务体系的建立

太原市是国家广电总局确定的全国有线电视数字化整体转换试点示范城市,太原有线通过在运营管理、用户服务及技术支撑等方面的改革和创新,不断提升有线电视的优质服务品牌,建立了完善的有线电视数字化服务体系.2006年9月25日,太原市通过.了国家广播电影电视总局组织的验收,成为全国首批完成整体转换的有线数字电视示范城市.在实施有线电视数字化的工作当中,太原市通过举办"服务月"活动使之成为升华服务理念、提高服务素质和能力、发现和宏扬企业精神、建设企业文化的重要平台.也因此深深的体会到有线电视数字化服务工作是将现代科学技术与运营管理紧密结合的系统工程,是有线电视运营企业的中心工作.太原有线将籍此把有线数字电视优质服务的品牌逐步创建起来,使之成为广播电视系统的一颗璀璨明珠.     

电子产品的故障分析技术

文中简单介绍电子产品的故障分析技术,着重介绍如何开展故障分析,以确保故障信息的正确性和完整性,达到改进产品质量的目的。     

皮卫星发展展望

随着微纳技术(MNT)及微电子机械系统(MEMS)技术的迅猛发展，卫星朝着集成度高、体积小、质量轻、费用低等方向发展。纳型／皮型卫星技术处于微纳技术及卫星技术发展趋势的最前沿，其应用前景广阔。大力开展纳型／皮型卫星及其关键技术的研究，加快其产业化进程，具有十分重要的意义。     

Thermoelectric Properties of Ag-Doped n-Type (Bi2?xAgxTe3)0.96?(Bi2Se3)0.04 Pseudobinary Alloys

n-Type thermoelectric powders of (Bi_2−x Ag _x Te₃)_0.96−(Bi₂Se₃)_0.04 (0 ≤ x ≤ 0.05) have been synthesized by mechanical alloying and then consolidated by spark plasma sintering. The analysis results show that the grain size of pure Bi, Te, Ag, and Se powders is decreased to about 1 μm to 0.5 μm after they are mechanically alloyed for 2 h. The power factor of bulk material increases with increasing Ag-doping content, while the trend for the lattice thermal conductivity is the opposite. Bulk (Bi_0.99Ag_0.04)₂(Te_0.96Se_0.04)₃ after milling for 12 h exhibits a higher power factor, lower thermal conductivity, and thus a higher ZT of 0.74 at 373 K.     

Surface graft copolymerization enhanced adhesion of an epoxy-basedprinted circuit board substrate (FR-4) to copper

The lamination of surface modified printed circuit board (PCB) substrate, FR-4(R), from argon plasma pretreatment and UV-induced graft copolymerization with glycidyl methacrylate (GMA), to copper foil was carried out at elevated temperature and in the presence of an epoxy adhesive. The structure and chemical composition of the graft copolymerized surfaces and interfaces of the glass fiber-reinforced and epoxy-based FR-4 substrates were studied by X-ray photoelectron spectroscopy (XPS). The effects of the plasma pretreatment time, the UV illumination time, as well as the curing temperature, on the adhesion strength between the FR-4 substrate and copper were investigated. The assemblies involving GMA graft copolymerized FR-4, or the FR-4-GMA/epoxy resin/Cu assemblies, exhibited a significantly higher interfacial adhesion strength and reliability, in comparison to those assemblies in which only epoxy adhesive alone was used. The enhanced adhesion in the assemblies involving GMA graft copolymerized substrate arises from the fact that the covalently tethered GMA graft chains on the FR-4 surface can become covalently incorporated into the epoxy resin, resulting in the toughening of the epoxy matrix and increased interaction with copper