基于微电压调节的太阳能充放电系统设计

基于微电压调节的太阳能充放电系统,是以微控制器LPC1114为核心的太阳能电池板充放电电路,是实现高效率的智能充放电设计方案。微电压调节理论整合了经典电压回授法和多种太阳能最大功率点追踪思想,利用简单合理的DC／DC平衡技术,充分考虑系统功耗等问题,以简单的电路设计和创新的软件思想实现更高效率的太阳能系统。随着能源危机的加剧,高效率、低成本的太阳能系统备受社会关注,其在民用、交通等领域的运用也更加重要。     

一个PASCAL结构编辑器的设计与实现

本文对一个新的PASCAL结构编辑编辑器PSE（PASCAL Structured Editor）的系统结构和功能进行了概括的描述。在设计和实现PSE时,作者提出了一种新的程序内部表示法,即所谓“文本-树”表示。与以往的程序内部表示相较,这种表示方法具有占用内存量小,光标控制及编辑操作简便以及无须进行内部语法树与行式文件间的转换等特点。实践证明,基于此种表示的语法制导编辑器是易于实现的,其工作效率是较高的。     

中职学校提高《数字电路》课程教学质量的探讨

《数字电路》是中职电类专业的一门专业基础课程。结合目前中职学校教学现状中存在的问题,如何让学生把这门课学好,笔者从精选教材、课堂导入、教学手段、考核评价等方面进行了探讨。指出了只有充分激发起学生的学习兴趣和学习积极性,才是提高教学质量的关键。     

Boosting the Microbial Electrosynthesis of Acetate from CO2 by Hydrogen Evolution Catalysts of Pt Nanoparticles/rGO

Catalysis Letters - Microbial electrosynthesis (MES) is an effective approach to driving the CO2 reduction to multi-carbon organic products using renewable energy. In this work, the MES of acetate...     

深层入岩钻孔灌注桩干成孔作业下的后注浆技术的研究

在极软岩的地质条件下,采用自创的新型注浆设备,通过不同入岩深度及成桩措施进行桩基施工,根据静载荷试验进行分析对比,得出入岩深度增加和后注浆对桩基沉降量的影响及自创注浆设备的实用性.     

In-depth investigation on the factors affecting the performance of high oil-absorption resin by response surface method

A series of high oil-absorption resins with low cross-linking degree were synthesized by suspension polymerization using stearyl methacrylate(SMA), 2-Ethylhexyl methacrylate(EHMA), and styrene(St) as monomers.Response surface methodology(RSM) with central composite design(CCD) was also applied to determine the optimal parameters that are mainly known to affect their synthesis. Thus, the effects of the monomer mass ratio(EHMA:SMA), the rigid monomer(St) dosage, the porous agent(acetone) dosage, and their pairwise interaction on the resin's oil-absorption capacity were analyzed, highlighting PSES-R_2 as the resin with the optimum performance. The pure oil-absorption rates of PSES-R2 for gasoline, diesel, and kerosene were 11.19 g·g~(-1),16.25 g·g~(-1), and 14.84 g·g~(-1), respectively, while the oil removal rates from oily wastewater were 98.82%,65.11%, and 99.63%, respectively.     

Catalase (CAT) Gene Family in Rapeseed (Brassica napus L.): Genome-Wide Analysis,Identification, and Expression Pattern in Response to Multiple Hormones and Abiotic Stress Conditions

Catalase (CAT) is an antioxidant enzyme expressed by the CAT gene family and exists in almost all aerobic organisms. Environmental stresses induce the generation of reactive oxygen species (ROS) that eventually hinder plant growth and development. The CAT enzyme translates the hydrogen peroxide (H₂O₂) to water (H₂O) and reduce the ROS levels to shelter the cells’ death. So far, the CAT gene family has not been reported in rapeseed (Brassica napus L.). Therefore, a genome-wide comprehensive analysis was conducted to classify the CAT genes in the rapeseed genome. The current study identified 14 BnCAT genes in the rapeseed genome. Based on phylogenetic and synteny analysis, the BnCATs belong to four groups (Groups I–IV). A gene structure and conserved motif analysis showed that Group I, Group II, and Group IV possess almost the same intron/exon pattern, and an equal number of motifs, while Group III contains diverse structures and contain 15 motifs. By analyzing the cis-elements in the promoters, we identified five hormone-correlated responsive elements and four stress-related responsive elements. Further, six putative bna-miRNAs were also identified, targeting three genes (BnCAT4, BnCAT6, and BnCAT8). Gene ontology (GO) enrichment analysis showed that the BnCAT genes were largely related to cellular organelles, ROS response, stimulus response, stress response, and antioxidant enzymes. Almost 10 BnCAT genes showed higher expression levels in different tissues, i.e., root, leaf, stem, and silique. The expression analysis showed that BnCAT1–BnCAT3 and BnCAT11–BnCAT13 were significantly upregulated by cold, salinity, abscisic acid (ABA), and gibberellic acid (GA) treatment, but not by drought and methyl jasmonate (MeJA). Notably, most of the genes were upregulated by waterlogging stress, except BnCAT6, BnCAT9, and BnCAT10. Our results opened new windows for future investigations and provided insights into the CAT family genes in rapeseed.     

Formation of Proto-Kranz in C3 Rice Induced by Spike-Stalk Injection Method

Introduction of C4 photosynthetic traits into C3 crops is an important strategy for improving photosynthetic capacity and productivity. Here, we report the research results of a variant line of sorghum–rice (SR) plant with big panicle and high spikelet density by introducing sorghum genome DNA into rice by spike-stalk injection. The whole-genome resequencing showed that a few sorghum genes could be integrated into the rice genome. Gene expression was confirmed for two C4 photosynthetic enzymes containing pyruvate, orthophosphate dikinase and phosphoenolpyruvate carboxykinase. Exogenous sorghum DNA integration induced a series of key traits associated with the C4 pathway called “proto-Kranz” anatomy, including leaf thickness, bundle sheath number and size, and chloroplast size in bundle sheath cells. Significantly, transgenic plants exhibited enhanced photosynthetic capacity resulting from both photosynthetic CO₂-concentrating effect and improved energy balance, which led to an increase in carbohydrate levels and productivity. Furthermore, such rice plant exhibited delayed leaf senescence. In summary, this study provides a proof for the feasibility of inducing the transition from C3 leaf anatomy to proto-Kranz by spike-stalk injection to achieve efficient photosynthesis and increase productivity.     

Low Dielectric Polyimide/Fluorinated Ethylene Propylene (PI/FEP) Nanocomposite Film for High-Frequency Flexible Circuit Board Application

The low dielectric polymer films have drawn great attention to the application as the dielectric insulating materials in high-frequency circuit boards, while the weak adhesion to the copper foils and the poor processability resulted from the fluorinated or rigid structures limited their high-frequency application. In this work, the low dielectric and high adhesive polyimide/fluorinated ethylene propylene (PI/FEP) nanocomposite film for high-frequency flexible circuit board application is developed. It is indicated that the fluorocarbon surfactants can significantly improve the dispersion of FEP in PI substrate, and thus, the PI/FEP nanocomposite film exhibits excellent mechanical properties, including the tensile strength increases to 46.6 MPa and the elongation at the break increases to 13.7%. Importantly, at the high-frequency of 10 GHz, the 60 wt% FEP filled PI nanocomposite film displays an ultralow dielectric loss (0.006) and a reduced dielectric constant (2.69). In addition, the high-frequency flexible circuit board with the PI/FEP film as the dielectric insulating layer has a high peel strength of 0.75 N mm⁻¹, indicating this PI/FEP nanocomposite film can meet the requirements of the high-frequency flexible circuit board application.     

3D Printing Conductive Composites with Poly(ionic liquid) as a Noncovalent Intermedia to Fabricate Carbon Circuits

In this study, a kind of imidazole type poly(ionic liquid) ([PEP-MIM]Cl) is synthesized, which can disperse carbon effectively. [PEP-MIM]Cl is used as an intermediate to coat carbon on the poly(acrylic acid)(PAA-co-MBA) via ion exchange to obtain conductive polymer composite (CPC). A series of characterizations are performed. Experiments show that carbon can be coated on the PAA-co-MBA uniformly, and compared with using carbon as filler, this method requires less carbon to achieve good conductive performance. The carbon layer on the polymer's surface is enriched via the swelling-shrinking properties of PAA-co-MBA according to the SEM images. Furthermore, in combination with 3D printing technology, PAA-co-MBA can be designed into different shapes to achieve various functions such as pressure-sensing element. Finally, a new type of CPC named carbon clad polymeric laminate (CCPL) is prepared by using the carbon coating method and 3D printing technology. It has the potential to replace copper clad laminate (CCL) and printed circuit board (PCB), to a certain extent. This technology expands the preparation method and application of the CPC such as flexible and wearable conductive fabrics.