Licence de brevet et partage du risque: Résultats de simulation

Annals of Telecommunications - Le partage du risque est une des raisons les plus souvent avancées pour expliquer les clauses financières des contrats de licence. Pour autant, aucune...     

State of the Art of Molecular Visualization in Immersive Virtual Environments

Visualization plays a crucial role in molecular and structural biology. It has been successfully applied to a variety of tasks, including structural analysis and interactive drug design. While some of the challenges in this area can be overcome with more advanced visualization and interaction techniques, others are challenging primarily due to the limitations of the hardware devices used to interact with the visualized content. Consequently, visualization researchers are increasingly trying to take advantage of new technologies to facilitate the work of domain scientists. Some typical problems associated with classic 2D interfaces, such as regular desktop computers, are a lack of natural spatial understanding and interaction, and a limited field of view. These problems could be solved by immersive virtual environments and corresponding hardware, such as virtual reality head-mounted displays. Thus, researchers are investigating the potential of immersive virtual environments in the field of molecular visualization. There is already a body of work ranging from educational approaches to protein visualization to applications for collaborative drug design. This review focuses on molecular visualization in immersive virtual environments as a whole, aiming to cover this area comprehensively. We divide the existing papers into different groups based on their application areas, and types of tasks performed. Furthermore, we also include a list of available software tools. We conclude the report with a discussion of potential future research on molecular visualization in immersive environments.     

Metabolite interactions in prostatic fluid mimics assessed by 1H NMR

Magnetic Resonance Materials in Physics, Biology and Medicine - Molecular interactions in prostatic fluid are of biological interest and may affect MRI and MRS of the prostate. We investigated the...     

Using I2P (Invisible Internet Protocol) Encrypted Virtual Tunnels for a Secure and Anonymous Communication in VANets: I2P Vehicular Protocol (IVP)

Wireless Personal Communications - The Invisible Internet Project (I2P) as a secure protocol uses robust mechanisms and strong algorithms to reinforce the security and the anonymity of the...     

Comparison of the identification performance of conventional FEM updating and integrated DIC

Full‐field identification methods are increasingly used to adequately identify constitutive parameters to describe the mechanical behavior of materials. This paper investigates the more recently introduced one‐step method of integrated digital image correlation (IDIC) with respect to the most commonly used two‐step method of finite element model updating (FEMU), which uses a subset‐based DIC algorithm. To make the comparison as objective as possible, both methods are implemented in the most equivalent manner and use the same FE model. Various virtual test cases are studied to assess the performance of both methods when subjected to different error sources: (1) systematic errors, (2) poor initial guesses for the constitutive parameters, (3) image noise, (4) constitutive model errors, and (5) experimental errors. Results show that, despite the mathematical similarity of both methods, IDIC produces less erroneous and more reliable results than FEMU, particularly for more challenging test cases exhibiting small displacements, complex kinematics, misalignment of the specimen, and image noise. Copyright © 2015 John Wiley & Sons, Ltd.     

Noncontact Sonic NDE and Defect Imaging Via Local Defect Resonance

A selective acoustic activation of defects based on the concept of local defect resonance enables to enhance considerably the intensity of defect vibrations and makes it possible to reduce the input acoustic powers to the levels permissible for noncontact nondestructive inspection. Since for cm-size defects in composite materials, the LDR frequencies lie in the low kHz-range, the resonant noncontact activation shifts to an audible frequency range and can be provided by conventional sonic equipment. In this paper, the feasibility of the resonant noncontact inspection is validated for the most “problematic” methodologies of nonlinear, thermosonic and shearosonic NDE that usually require an elevated acoustic power and, therefore, a reliable contact between the specimen and the transducer. In contrast, the noncontact versions developed employ commercial loudspeakers which can simultaneously insonify large areas and be applied for a contactless sonic inspection of different materials and various scale components.     

Formation of Cu Nanodots on Diamond Surface to Improve Heat Transfer in Cu/D Composites

Diamond‐dispersed copper matrix (Cu/D) composite materials with different interfacial configurations are fabricated through powder metallurgy and their thermal performances are evaluated. An innovative solution to chemically bond copper (Cu) to diamond (D) has been investigated and compared to the traditional Cu/D bonding process involving carbide‐forming additives such as boron (B) or chromium (Cr). The proposed solution consists of coating diamond reinforcements with Cu particles through a gas–solid nucleation and growth process. The Cu particle‐coating acts as a chemical bonding agent at the Cu–D interface during hot pressing, leading to cohesive and thermally conductive Cu/D composites with no carbide‐forming additives. Investigation of the microstructure of the Cu/D materials through scanning electron microscopy, transmission electron microscopy, and atomic force microscopy analyses is coupled with thermal performance evaluations through thermal diffusivity, dilatometry, and thermal cycling. Cu/D composites fabricated with 40 vol% of Cu‐coated diamonds exhibit a thermal conductivity of 475 W m^?1 K^?1 and a thermal expansion coefficient of 12 × 10^?6 °C^?1. These promising thermal performances are superior to that of B‐carbide‐bonded Cu/D composites and similar to that of Cr‐carbide‐bonded Cu/D composites fabricated in this study. Moreover, the Cu/D composites fabricated with Cu‐coated diamonds exhibit higher thermal cycling resistance than carbide‐bonded materials, which are affected by the brittleness of the carbide interphase upon repeated heating and cooling cycles. The as‐developed materials can be applicable as heat spreaders for thermal management of power electronic packages. The copper‐carbon chemical bonding solution proposed in this article may also be found interesting to other areas of electronic packaging, such as brazing solders, direct bonded copper substrates, and polymer coatings.

     

Magnetic Properties of Thermal Sprayed Tungsten Carbide–Cobalt Coatings

In the information age, the storage and accessibility of data is of vital importance. There are several possibilities to fulfill this task. Magnetic storage of data is a well‐established method and the range of materials used is continuously extended. In this study, the magnetic remanence of thermally sprayed tungsten carbide–cobalt (WCCo)‐coatings in dependence of their thickness is examined. Two magnetic fields differing in value and geometry are imprinted into the coatings and the resulting remanence field is measured. It is found that there are two effects, which in combination determine the effective value of the magnetic remanence usable for magnetic data storage.

     

A fully pipelined RLS-based array for channel equalization

It is shown that several recursive least squares (RLS) type equalization algorithms such as, e.g., decisiondirected schemes and orthogonalized constant modulus algorithms, possess a common algorithmic structure and are therefore rather straightforwardly implemented on an triangular array (filter structure) for RLS estimation with inverse updating. While the computational complexity for such algorithms isO(N ²), whereN is the problem size, the throughput rate for the array implementation isO(1), i.e., independent of the problem size. Such a throughput rate cannot be achieved with standard (Gentleman-Kung-type) RLS/QR-updating arrays because of feedback loops in the computational schemes.